Also Known As: TSMC 2nm node
Developer: Taiwan Semiconductor Manufacturing Company (TSMC)
Node Class: Advanced logic semiconductor node
Technology Generation: 2 nanometer (2nm)
Status (as of 2025): Risk production in progress; volume production expected in late 2025 or 2026
Overview
The TSMC N2 process node marks a major … Read More
Full Name: Patrick Paul Gelsinger
Born: March 5, 1961
Nationality: American
Occupation: Technology Executive, Engineer, Innovator
Known For: Former CEO of Intel Corporation, Technology Leadership in Semiconductor Industry
Early Life and Education
Pat Gelsinger grew up in Pennsylvania and displayed a passion for electronics… Read More
Lip-Bu Tan Wikiby Daniel Nenni on 07-12-2025 at 4:26 pm
Born: 1959, Malaysia
Nationality: American
Occupation: Entrepreneur, Engineer, Venture Capitalist, Executive
Current Positions:
Notable Former Roles:
…
Read More
Why advanced packaging matters:
As Moore’s Law slows down, it has become increasingly difficult and expensive to scale monolithic SoCs. This has driven the semiconductor industry toward heterogeneous integration, which combines different functional blocks (CPU, GPU, memory, accelerators, etc.) in a single package… Read More
A 3D Integrated Circuit (3D IC) is a device in which two or more active electronic layers (dies or wafers) are vertically stacked and interconnected to function as a single integrated system. These layers are interconnected using fine-pitch vertical interconnects, such as Through-Silicon Vias (TSVs) or hybrid bonds, allowing… Read More
Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technology used to print the smallest features on integrated circuits (ICs), particularly at leading-edge nodes such as 7nm, 5nm, 3nm, and below. EUV uses light with a wavelength of 13.5 nanometers, which is in the extreme ultraviolet… Read More
Chiplets Wikiby Daniel Nenni on 05-28-2023 at 4:11 pm
Chiplets are small, functional integrated circuit (IC) blocks that are designed to work together in a modular fashion to form a complete system-on-chip (SoC) or system-in-package (SiP). Instead of building a large, monolithic chip on a single die, chiplet-based design breaks the system into multiple smaller dies that are connected… Read More
cHBM for AI: Capabilities, Challenges, and Opportunities