TSMC 3D Fabric™ is a comprehensive suite of 3D silicon stacking and advanced packaging technologies developed by Taiwan Semiconductor Manufacturing Company (TSMC) to enable high-performance, power-efficient, and space-optimized system integration. It represents TSMC’s response to growing industry demand for heterogeneous… Read More
A System on Chip (SoC) is an integrated circuit (IC) that consolidates all—or most—components of a computer or electronic system onto a single chip. SoCs are foundational to modern electronics, powering everything from smartphones and tablets to automobiles, IoT devices, gaming consoles, and AI accelerators. They offer advantages… Read More
Intel 18A(P) (also referred to as Intel 18A+ or simply 18A Performance) is Intel’s upcoming advanced semiconductor process node, positioned as a refinement and performance enhancement of the base Intel 18A node. It marks a critical step in Intel’s roadmap to reclaim process leadership by the latter half of the 2020s, leveraging… Read More
Intel 7 is a 10nm-class semiconductor manufacturing node developed by Intel Corporation, first announced in July 2021 as part of the company’s updated process node naming scheme. Despite its name, Intel 7 is not a 7nm node by conventional industry standards, but rather an enhanced version of Intel’s previous 10nm SuperFin… Read More
Also Known As: TSMC 1.6 nm, Angstrom-class node
Node Class: Leading-edge logic (1.6 nm)
Transistor Type: Nanosheet GAAFET (Gate-All-Around Field-Effect Transistor)
Backside Power Variant: Integrates Super Power Rail (SPR) backside power delivery
Launch Schedule: Risk production in 2026, volume production in H2 2026–2027… Read More
| Feature | Intel 3 | Intel 18A |
|---|---|---|
| Node Class | Enhanced 7nm (refinement of Intel 4) | 1.8nm-class full-node leap |
| Transistor Type | FinFET | RibbonFET (GAAFET) |
| Power Delivery | Front-side power only | Backside Power Delivery (PowerVia) |
| EUV Use | Partial (select layers) | Extensive EUV, reduced multi-patterning |
| PPA Target | Modest vs. Intel |
Also known as: TSMC 1.4nm, A14 process node
Node class: Advanced logic technology (1.4nm)
Foundry: Taiwan Semiconductor Manufacturing Company (TSMC)
Expected HVM (High Volume Manufacturing): 2028
Predecessor: TSMC N2 (2nm)
Transistor architecture: 2nd Generation GAAFET (nanosheet)
Backside power variant: A14P (planned… Read More
Full Name: Tan Hock Eng
Born: 1951 or 1952 (exact date undisclosed)
Nationality: Malaysian-American
Current Role: President and Chief Executive Officer (CEO), Broadcom Inc.
Other Roles: Board Member of Broadcom Inc., Former President & CEO of Integrated Device Technology (IDT)
Education:
B.S. in Mechanical Engineering
Also Known As: Semiconductor Industry Supply Chain, Chip Manufacturing Ecosystem
Domain: Electronics, High-Tech Manufacturing, Global Trade
Purpose: To describe the end-to-end ecosystem that enables the design, fabrication, packaging, and delivery of semiconductor chips.
Major Players: EDA vendors, IP providers, … Read More
Full Name: Gate-All-Around Field-Effect Transistor
Also Known As: Gate-All-Around FET, Nanosheet FET, Nanowire FET
Category: Advanced 3D CMOS Transistor
Predecessor: FinFET (Tri-Gate Transistor)
Successors/Subtypes: Nanosheet FET, MBCFET (Samsung), RibbonFET (Intel), Forksheet FET
First Commercial Use: Samsung… Read More
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