Recent Industry Wikis


Samsung X-Cube™ (eXtended-Cube)

Samsung X-Cube™ (eXtended-Cube)
by Daniel Nenni on 07-16-2025 at 9:55 pm

Samsung X-Cube™ is a 3D IC packaging technology developed by Samsung Electronics that enables vertical stacking of multiple active logic dies using through-silicon vias (TSVs) and micro-bump bonding. As part of Samsung’s Advanced Package (AVP) portfolio—which also includes I-Cube™ (2.5D interposer-based packaging) and… Read More


Intel EMIB (Embedded Multi-die Interconnect Bridge)

Intel EMIB (Embedded Multi-die Interconnect Bridge)
by Daniel Nenni on 07-16-2025 at 9:39 pm

EMIB (Embedded Multi-die Interconnect Bridge) is an advanced 2.5D packaging technology developed by Intel that enables high-density, high-bandwidth, low-latency interconnects between chiplets (dies) within a single package—without requiring a full silicon interposer. EMIB offers a modular and scalable approach to … Read More


CoWoS® (Chip-on-Wafer-on-Substrate) Wiki

CoWoS® (Chip-on-Wafer-on-Substrate) Wiki
by Daniel Nenni on 07-16-2025 at 9:28 pm

CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a critical role in enabling … Read More


System on Chip (SoC) Wiki

System on Chip (SoC) Wiki
by Daniel Nenni on 07-16-2025 at 9:05 pm

A System on Chip (SoC) is an integrated circuit (IC) that consolidates all—or most—components of a computer or electronic system onto a single chip. SoCs are foundational to modern electronics, powering everything from smartphones and tablets to automobiles, IoT devices, gaming consoles, and AI accelerators. They offer advantages… Read More


Intel 18A(P) Process Technology Wiki

Intel 18A(P) Process Technology Wiki
by Daniel Nenni on 07-15-2025 at 12:22 pm

Intel 18A(P) (also referred to as Intel 18A+ or simply 18A Performance) is Intel’s upcoming advanced semiconductor process node, positioned as a refinement and performance enhancement of the base Intel 18A node. It marks a critical step in Intel’s roadmap to reclaim process leadership by the latter half of the 2020s, leveraging… Read More


Intel 7 Process Technology Wiki

Intel 7 Process Technology Wiki
by Daniel Nenni on 07-14-2025 at 4:57 pm

Overview

Intel 7 is a 10nm-class semiconductor manufacturing node developed by Intel Corporation, first announced in July 2021 as part of the company’s updated process node naming scheme. Despite its name, Intel 7 is not a 7nm node by conventional industry standards, but rather an enhanced version of Intel’s previous 10nm SuperFinRead More


TSMC A16 Process Technology Wiki

TSMC A16 Process Technology Wiki
by Daniel Nenni on 07-14-2025 at 9:29 am

Also Known As: TSMC 1.6 nm, Angstrom-class node
Node Class: Leading-edge logic (1.6 nm)
Transistor Type: Nanosheet GAAFET (Gate-All-Around Field-Effect Transistor)
Backside Power Variant: Integrates Super Power Rail (SPR) backside power delivery
Launch Schedule: Risk production in 2026, volume production in H2 2026–2027… Read More