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Steve Furber has found his million ARM cores

Steve Furber has found his million ARM cores
by Don Dingee on 01-25-2016 at 12:00 pm

Some people say that everything in our lives happens for a reason. As we wrote Part I of “Mobile Unleashed”, the origin story of ARM architecture and its main progenitors Steve Furber and Sophie Wilson, we found what seemed like an obvious technological breakthrough was far from an overnight success – and it led to fascinating twists and turns. Continue reading “Steve Furber has found his million ARM cores”


In Low Voltage Timing, the Center Cannot Hold

In Low Voltage Timing, the Center Cannot Hold
by Bernard Murphy on 01-25-2016 at 7:00 am

When I started discussing this topic with Isadore Katz, I was struggling to find a simple way to explain what he was telling me – that delay and variance calculations in STA tools are wrong at low voltage because the average (the center) of a timing distribution shifts from where you think it is going to be. He told me that I’m not alone in my struggle – he’s never found an easy way to boil it down either. You just have to go through all the steps then the conclusion at the end makes sense. Therefore, with apologies to timing experts, here is my explanation. Throughout, I’m going to use “typical” for most common / mode / nominal value and “average” for mean.

A Static Timing Analysis (STA) tool is really nothing more than an adding machine with a simple less-than/greater-than check when it hits a timing end-point, say a flip-flop. At the simplest level, it traverses paths starting from source flops, adding delays (from gates and interconnect) along those paths, until it hits destination flops. Where paths converge in-between those points, it keeps worst- and best-case delays (path-based analysis is more refined, but I think those details are not essential for this argument). Then it’s all about when the data can potentially get to a flop relative to when the clock can get to the flop. Too early and you have a hold time violation, too late and you have a setup violation.

The timing values (typical values) come from library lookup tables indexed by gate-type, input slew and output load, and for models for the interconnect between gates. Back in the day, you would have tables for different process corners – slow/slow (SS) for slow NFET/slow PFET, fast/fast (FF), typical/typical (TT) and permutations thereof. You analyze in each of the corners, tweak the design to fix timing violations and all was good. But then it got complicated.

At 40nm, margins represented purely as corners became too pessimistic to get reasonable yield at reasonable power, because statistical sampling across many lots from many designs buries different variances between different designs in the final variance, which is too pessimistic per design. Statistical timing analysis should have been the ideal solution but performance and other issues eventually killed that approach. So the foundries aimed for something that could support conventional STA methods with adjustments. They split measured variances into design-dependent variance (on chip variation, or OCV) and a design-independent part (the die-to-die variance) and called the latter “global”. That gives you corners called SSG, TTG and FFG. A design team must then add back in OCV variance based on the structure of their design to get the true variances they need to model. But they can’t just add/subtract the old-style 3σ to these these corners; that would be even more pessimistic than the traditional corners and the whole point is to minimize pessimism.

So how do you calculate OCV? You still want to stick to single-pass analysis, but enhanced by different methods to approximate measured variances within those constraints. You can pick from AOCV, based on pre-characterized chains of gates to get variances at the end of the chain, or POCV or SOCV which in different ways compute variances at each stage in a path. (LVF is a recently introduced format which aims to combine representations for all these methods in one standard but does not prescribe how the calculation should actually be done.)

What is important in all these methods is that you are propagating typical values as delays, but delay and variance calculated through these methods only serves as an accurate representation of the underlying distribution if that distribution is normal (Gaussian). If this assumption is reasonable (and it is at normal voltages), then as an input distribution passes through stages in a path, the average input delay to the next stage is the sum of the average delays up to that stage, because that’s how Gaussians sum.

But when distributions are skewed, as they are at low voltage, something different happens. The sum of skewed distributions tends to a normal distribution as you pass through stages (thanks to the Central Limit Theorem) but at each stage the average of the distribution shifts away from the sum of the typical values up to that stage. This undermines the calculation based on typical values in two ways. First, the true average progressively moves to a value greater than the sum of typical values up to that stage. And second, the output slew lookup, which is now based on an incorrect delay value, is therefore also incorrect and this error also compounds. When you get to the end of the path to check setup and hold, the computed typical can differ from the true average by as much as 3σ for the distribution, as large as the amount you are trying to correct for with your OCV calculation. And that means on a path like this, the typical value adjusted by 3σ on one side could be extremely pessimistic and on the other side extremely optimistic.

Some people argue this is a non-problem; that in fact these differences actually average out. That doesn’t seem very likely to me. The math of combining skewed distributions leading to a shift in the average is indisputable. Also gate timing distributions should always skew to longer delays since non-linearity near the switching threshold should favor longer delays rather than shorter delays at low voltage. There’s really no way these shifts can cancel out in a stage-based calculation. The AOCV approach could in principle get this right since it pre-characterizes chains of gates which should incorporate all effects, though apparently it doesn’t take account of slews so it’s still wrong. Not to mention that lookup tables for this approach could get rather large.

Maybe you could fix the stage-based approach by using left and right variances at each stage to compute a shift at that stage, which you would then use to get the delay and slew lookup right. There have been attempts along these lines, though it’s not clear they have been very successful. Or more generally, you could model a skewed distribution using 3 points and evolve that along the path. This might be mathematically feasible, but I imagine there would be problems in performance. At minimum you’d have to do 3 divisions to scale this model curve to a (reasonably sized) lookup table so you could figure out the shift, then 3 multiplications to scale back, none of which is going to help run-time. And I don’t see any way you could emulate the correct behavior using only addition.

The only way to do this correctly, at least along a set of paths of concern, is to do variance-aware transistor based modeling, either using MCSpice (which would be very slow) or CLKDA FX analysis (which is much faster). To get a more knowledgeable analysis of the whole problem and the FX approach, click HERE.

More articles by Bernard…


Your Car Will Never be Secure

Your Car Will Never be Secure
by Roger C. Lanctot on 01-24-2016 at 4:00 pm

The automotive cybersecurity forum put on by the National Highway Traffic Safety Administration (NHTSA) yesterday in Washington, DC, surfaced a wide range of issues and conflicts at the heart of the connected car industry. One clear takeaway from the event was that cars will never be secure.
Continue reading “Your Car Will Never be Secure”


Star Wars, the Force and the Power of Parallel Multicore Processing

Star Wars, the Force and the Power of Parallel Multicore Processing
by George Teixeira on 01-24-2016 at 12:00 pm

During the 80’s, the original Star Wars movies featured amazing future technology and were all about “the power of the Force.” The latest movie has now broken all box office records and got me thinking about how much IT and computing technology has progressed over the years but yet, there is still so much left untapped.

Yes, several of the envisioned gains have come true – many of these driven by Moore’s Law and the growing force of the microprocessor revolution. For example, server virtualization software such as VMware radically redefined consolidation savings and productivity, CPU clock speeds got faster and microprocessors became commodities used everywhere – powering PCs, laptops, smart phones and intelligent devices of all types. But the full force and promise of using many microprocessors in parallel, what is now called ‘multicores,’ still remains largely untapped and I/O continues to be the major bottleneck holding back the IT industry from achieving the next revolution in consolidation, performance and productivity.

Virtual computing is still bottlenecked by I/O. Just as city drivers can only dream about flying vehicles as gridlock haunts their morning commute, IT is left wondering if they will ever see the day when application workloads will reach light speed.

How can it be that with multi-core processing, virtualized apps, abundant RAM and large amounts of flash, you still have to deal with I/O-starved virtual machines (VMs) while many processor cores remain idle? Yes, you can run several independent workloads at once on the same server using separate CPU and memory resources, but that’s where everything begins to break down. The many workloads in operation generate concurrent I/O requests yet only one core is charged with I/O processing. This architectural limitation strangles the life out of application performance. Instead of one server doing vast quantities of work, IT is forced to add more servers and racks to deal with I/O bottlenecks – this sprawl goes against the ‘consolidation and productivity savings’ which is the basic premise and driver of virtualization.

All it takes, then, is a few VMs running simultaneously on multi-core processors churning out almost inconceivable volumes of work and you quickly overwhelm the one processor tasked with serial I/O. Instead of a flood of accomplished computing, a trickle of I/O emerges. IT is left feeling like the kids who grew up watching Star Wars who ask – where are our flying starships and when can we travel at light-speed?!

The good news is that all is not lost. DataCore has a number of bright minds hard at work to bring a revolutionary breakthrough for I/O to prime time, DataCore Parallel I/O technology lets virtualized traffic flow through without slowdown. Its unique software-defined parallel I/O architecture is needed to capitalize on today’s powerful multi-core/parallel processing infrastructure. By enlisting software to drive I/O processing across many different cores simultaneously, this eradicates I/O bottlenecks and drives a higher level of consolidation savings and productivity. The better news is that this technology is already on the market today.

Just like Star Wars has shattered the world record, check out how DataCore recently set the new world record on price-performance and on a hyperconverged system (on the Storage Performance Councils peer reviewed SPC1 benchmark). DataCore also reported the best performance per footprint and the fastest response times ever and so while the numbers do not actually reach light-speed, DataCore has lapped the field not once but multiple times. See for yourself the latest benchmark results in this article that appeared in Forbes: The Rebirth of Parallel I/O.

How? DataCore’s software actively senses the I/O load being generated by concurrent VMs. It adapts and responds dynamically by assigning the appropriate number of cores to process the input and output traffic. As a result, VM’s no longer sit idle waiting on a serial I/O thread to become available. Should the I/O load lighten, however, CPU cores are freed to do more computational work.

This not only solves the immediate performance problem facing multi-core virtualized environments, it significantly increases the VM density possible per physical server. It allows IT to do ‘far more with less.’ This means fewer servers or racks and less space, power and cooling are needed to get the work done. In effect, it achieves remarkable cost reductions through maximum utilization of CPU cores, memory and storage while fulfilling the productivity promise of virtualization.

You can read more about this in DataCore’s white paper, “Waiting on I/O: The Straw that Broke Virtualization’s Back.”


The Smartphone is Dead! Long Live the Smartphone!

The Smartphone is Dead! Long Live the Smartphone!
by Roger C. Lanctot on 01-24-2016 at 10:00 am

According to a study released on the eve of CES by Accenture “heightened data security concerns, falling demand for smartphones and tablet PCs, and stagnant growth in the Internet of Things (IoT) market” are combining to stymie consumer electronics industry growth. While slow uptake of new products is normal, data security concerns is new.
Continue reading “The Smartphone is Dead! Long Live the Smartphone!”


Honda Driver-aware Connected Car Insights from Patents

Honda Driver-aware Connected Car Insights from Patents
by Alex G. Lee on 01-24-2016 at 7:00 am

Honda patent applications US20130245886, US20140276112, US20140309881, US20140303899, US20140371984, US20150126818, US20160001781 and patent US8698639 describe systems implementing state monitoring of a driver for automatically adjusting the operation of a vehicle in response to the driver state (e.g., driver’s health, slower reaction time, attention lapse and/or alertness). For example, in situations where a driver can be drowsy and/or distracted, the motor vehicle can include provisions for detecting and assessing that the driver is drowsy and/or distracted and modifying vehicle systems automatically to mitigate against hazardous driving situations.

The driver state monitoring system includes different types of sensors for obtaining information regarding the physiological driver state, behavioral driver state, and vehicular-sensed driver state. The physiological sensors measure the heart rate, blood pressure, oxygen content, blood alcohol content, respiratory rate, perspiration rate, skin conductance, brain wave activity, digestion information and salivation information etc. For example, the driver state monitoring system includes optical sensing devices and/or thermal sensing devices to sense and provide a heart rate signal indicative of a driver state. The heart information can be detected from head movements, eye movements, facial movements, skin color, skin transparency, chest movement, upper body movement using the optical sensing devices and/or thermal sensing devices.

The behavioral information can include eye movements, mouth movements, facial movements, facial recognition, head movements, body movements, hand postures, hand placement, body posture, and gesture recognition etc. Vehicle information that is related to the vehicular-sensed driver state includes vehicle conditions, states, statuses, behaviors, and information about the external environment of the vehicle (e.g., other vehicles, pedestrians, objects, road conditions, weather conditions).

The driver state monitoring system includes a response system that can receive information about the states of the driver and automatically adjust the operation of the vehicle. The response system determines the driver state based on the receive information. For example, the driver state can be normal/drowsy or normal/distracted. The response system automatically modifies the control of the vehicle systems using various vehicle control systems. The vehicle control systems can include the automatic brake prefill system, engine control system, speed follow system, automatic cruise control system, collision warning system, lane departure warning system, blind spot indicator system, lane keep assist system, navigation system, HAVC control system, lighting control system, and vehicle mode selector system.

For example, if the response system determines that the driver is drowsy, the response system can modify the operation of the collision warning system so that the driver is warned earlier about potential collisions. The collision warning system can retrieve the heading, position, and speed of an approaching vehicle. In some cases, this information could be received from the approaching vehicle through a vehicle to vehicle (V2V) communication network, such as a DSRC network. The collision warning system can estimate a vehicle collision point using information about the position, heading, and speed of the motor vehicle.


More articles from Alex…


The Best Analyst Presentation at SEMI ISS 2016!

The Best Analyst Presentation at SEMI ISS 2016!
by Daniel Nenni on 01-22-2016 at 5:00 pm

The problem I have with semiconductor analysts and media today is that they rarely have depth in what they are talking about. Some because they have never actually worked in the industry and others because they have not worked in the industry since the 1970s. One famed analyst even repeated the mythical “Fabs cost $10B” generalization to spread his self-serving doom and gloom of future semiconductor success. What kind of Fab is that, logic or memory? Where is it built and how many wafers per month does it produce? All fabs are not created equal and for the record: TSMC builds logic fabs in Taiwan for $5B and the new one in China is budgeted at $3B but I digress…

The thing I like about Weston Twigg, Director of Capital Markets Research at Pacific Crest Securities, is that he is an actual semiconductor professional having worked at both Samsung and Intel at the process level (he has an MS degree in Chemical Engineering to go with his MBA). Weston thoroughly understands and respects the foundries which very few analysts do and his presentation reflects that:

Bulls, Bears, Bits: Investor Views on Changing Semiconductor Industry Dynamics
Investors are struggling to keep up with changes in the semiconductor industry. Semiconductor economics are becoming challenged as process complexity increases; compute functions are shifting from local compute to the cloud; PC, tablet, and smartphone demand is decelerating or declining; and signs of maturation are emerging as M&A becomes a dominant theme. With all of the uncertainty, however, investors generally remain upbeat with two prevailing investment themes: story-driven stocks and M&A beneficiaries.

In our never ending quest to find “The Next BIG Semiconductor Thing” Weston and I share a similar view: From the demand side Internet of Things (IoT) and cloud are ramping up but if demand for smartphones decelerates (which it has) what else will drive big die size chips? Weston highlights three potentially big trends which I agree with, absolutely:




Weston’s conclusion:
Investors are contemplating disruptive shifts:

  • Semiconductor economics are becoming challenged as process complexity increases
  • Compute functions are shifting from local compute to the cloud
  • PC, tablet and smartphone demand is decelerating or declining
  • Signs of maturation are emerging as M&A becomes a dominant theme

Questions that investors are working on:

  • Can technology-driven (leading-edge) companies be successful if node transitions slow?
  • Which trends could drive more leading-edge demand?
  • Are there companies positioned at n-x nodes that might perform well?
  • Which segments should remain relatively high growth?

Despite the uncertainty, investors generally remain upbeat over the long-term on semiconductors

My personal view of the next big thing is along the same lines. The products we have today will need to be increasingly smarter which will result in much larger die sizes and more wafers at the leading edge. It will also lead to increased design complexity and stricter power requirements which will benefit the fabless semiconductor ecosystem as well.

In my humble opinion, IoT will go through a similar transformation. Today’s IoT chips are pretty dumb if you think about it, which I have. Before you know it the “IoT SoC Revolution” will begin and it will be the lather, rinse, repeat shampoo cycle yet again.

More articles from Daniel Nenni


The Death of Moore’s Law

The Death of Moore’s Law
by Michael Barger on 01-22-2016 at 12:00 pm

For the last several years, people have predicted the end of Moore’s Law. The reasoning is that there is a limit at which one can’t shrink transistors any further. A reoccurring comment has been “You can’t divide an atom.” I had assumed that its demise would be at the hands of a new paradigm like quantum computing. Now, with Intel’s announcement that the next doubling of transistors will take 2 ½ years, it looks like it may die of old age.

I, personally, do not believe that Moore’s Law needs to die of old age. Having worked within and in support of the semiconductor industry, I believe that the scaling argument is based on a faulty assumption; that one must only use two dimensions. I also believe that the industry is finally waking up to this fact with the surge in interest in 3D integration. But it has come too late to keep the industry on the Moore’s Law curve.

I have watched as the increased cost of scaling has forced the formation of collaborative research organizations, e.g. Sematech. Chip companies have shifted market and business strategies like the fabless ecosystem. And continued M&A has resulted in massive organizations with deep pockets that make barriers to market entry by new players almost impossible. As a result, I believe that the Semiconductor industry is ripe for disruption.

When I worked at the Hughes Technology Center in the early 90’s, we were working on enabling technologies for 3D integrated circuits (3DIC). Our strategy was to freeze scaling at 0.25 micron (that’s 250 nm folks!) and build another active layer on top, doubling the circuit density. There were several technologies that we were developing to do this. For example, HRL had developed a TSV on which I was able to grow high quality silicon epitaxy. This was used to build a 3D version of a Pentium-based PC in a “cube” as demonstrator. We filed for a patent disclosure, but corporate declined to pursue.

Another development was wafer bonding and thinning. We developed a scanning plasma process that flattened the device wafer while thinning it. We had a 200mm demonstrator wafer bonded to a handle wafer that was 10nm thick with +/- 1nm variation. Obviously, 10nm is not very useful, but it meant that FDSOI was comparatively easy. Our bonding technique allowed conductors and dielectrics to be bonded, simultaneously. Our university collaborator used this process to demonstrate the fabrication of a CMOS circuit by bonding NMOS and PMOS circuits. There other technologies developed that I won’t go into for lack of reader attention. But these were only steps toward the ultimate goal, which was monolithic 3D integration.

Monolithic 3D integration was not to be the stacking of processed layers, but depositing and processing layers on a continuous process. Think in terms of transistors along with other components embedded in a matrix of dielectric with interconnects routed for optimal distances. This would require different equipment and different chemistries. One enabler we were working on was atomic layer deposition (ALD). The sub-category, atomic layer epitaxy (ALE) was the process we believed would provide the embedded transistor structures. I submitted a proposal the develop ALE silicon, which was declined just prior to GM Hughes Electronics’ demise. With Hughes’ breakup, all of these technologies have fallen into disuse. I believe that it is time to resurrect some of these concepts and develop the necessary equipment and processes to revitalize Moore’s Law.

I have an initial product concept that I would like to develop that would be an enabler to control the new processes. I am interested in finding investors who would fund the startup. If you are one or know of one, please contact me.

https://www.linkedin.com/in/mjbarger


Qualcomm Shows Their First 5G Demo At Industry Analyst Day

Qualcomm Shows Their First 5G Demo At Industry Analyst Day
by Patrick Moorhead on 01-22-2016 at 7:00 am

Complete 5G solutions aren’t something that you’ll be seeing in phones or networks any time soon regardless of what you may see in the headlines or companies are claiming. In fact, the first official release of the 5G standard isn’t likely to be finalized until 2018, at which point true 5G networks will very likely not roll out until 2020. However, due to the increased demand for added capacity and throughput, certain parties are getting impatient and want to push up the implementation of specific 5G technologies to as soon as 2018.

What we are more likely to see is that specific 5G technologies will get adopted sooner than others as the spectrum and technology allow. Part of the introduction of 5G includes the use of higher frequency signals that can range anywhere from 3.5 GHz to 60+ GHz, much higher than current 4G LTE networks. As a result, the companies in the wireless industry are moving up their time tables and preparing for 5G sooner due to the demand for increased capacity and faster throughput. Qualcomm recently held an industry analyst day to explain and demonstrate the company’s vision for 5G. Representing Moor Insights & Strategy were Anshel Sag who covers mobile and wireless and Mike Krell who covers Industrial IoT.

Part of Qualcomm’s 5G vision included how the company sees 5G evolving beyond “just another wireless technology” for smartphones and tablets, expanding into every facet of life. This included presentations on how 5G incorporates a more flexible network, making devices on the network more than just endpoints as well as their 5G unified air interface (UAI). Qualcomm’s 5G UAI combines a multitude of features including massive MIMO, reliable high capacity and high frequency spectrum and much more. To make 5G more real for the analysts in attendance, Qualcomm took analysts deep inside of their research and development building, also known as the Qualcomm Research Center (QRC). Deep down inside of the basement of the building analysts were given a peek at some of Qualcomm’s own 5G technologies in a working demonstration.

To deliver the multi-gigabit speeds that users should experience with 5G, the use of higher frequencies is needed, as mentioned earlier. For Qualcomm’s demonstration, they chose to use 28 GHz, which is right in the middle between Qualcomm’s currently supported 4G LTE bands (below 3GHz) and their 802.11ad Wi-Fi operating at 60 GHz. The industry has coined these multi-gigabit high frequency wireless technologies as mmWave, to represent the measurement of the wave lengths in millimeters due to their high frequency and short length.

Because of the nature of these waves, Qualcomm utilizes extremely small antennas in a broad array in conjunction with directional beamforming to deliver a robust wireless signal regardless of the objects in the way. This is important because higher frequency wireless signals tend to be easily obstructed or blocked when something dense gets between them and their target device. For example, Wi-Fi operating at 60 GHz also known as 802.11ad, is best applied for in-room applications and that’s generally used with 32 tiny little antennas. The technology is designed to constantly adapt and adjust to the best possible beam based on the current conditions, combining all of the antennas on the base station transmitting to the antennas on the client device. The purpose of this demo was not to show us how fast 5G can be, but rather how well Qualcomm’s 5G implementation can handle less-than-perfect conditions, which is what most users experience on a daily basis. Many of those issues come from the actual deployment of the technology and the challenges that 5G brings to the table like non-line-of-sight connectivity and the consequences of how users use their devices on 5G signal.

For this demo, Qualcomm had set up a base station and a client device in a hall way and had people walk between the two as well as move the client device around to show how their 5G technology adapted. To accomplish this, Qualcomm used a base station with a 128 antenna elements with 16 controllable RF arrays. Commercial base stations could have significantly more antenna elements in the real world depending on the area that they are trying to cover and the size that they need to be. The client device receiving the signal had four selectable antenna sub-arrays, each with their own 4 controllable RF channels, meaning that each had four antennas as well. Having multiple antennas in multiple arrays allows for the client device to switch between the best antenna array that delivers the best signal, dynamically, while also beamforming, to also improve signal and catch the best channel and signal.

In their tests, they were able to achieve speeds of 400 Mbps pretty consistently using one antenna out of the possible 16, which is pretty good when you consider that 4G LTE right now can do 100Mbps. The system is designed to find the right beam and deliver it to the right antenna in order to deliver the best possible service utilizing one beam at a time. The demonstration was using only 16 QAM modulation, which means that there is still room for improvement in terms of throughput when they are able to achieve higher order modulation like 64-QAM or higher. Qualcomm’s engineers stated that they have simulated tests of this technology in urban environments and had line of sight range of 350 meters and non-line of sight coverage of 150 meters in Manhattan.

Qualcomm’s 5G demo at their industry analyst day shows that the company is well into development in 5G technologies, and that they are already working on solving many of the problems that come with using wireless frequencies above 3 GHz. Qualcomm’s acquisition of Wilocity mid last year, the first creators of 60 GHz Wi-Fi technology, may have put the company in a unique position ahead of the competition as they have dealt with many of the issues with mmWave technologies and are already in their second generation of 802.11ad Wi-Fi. Expertise doesn’t come overnight, and there is still going to be a lot more work to be done in the 5G space in order for it to become a commercialized technology, standardization included.

Qualcomm 3D mmWave Signal Visualization of 4 Antenna Array (Credit: Anshel Sag, Moor Insights & Strategy)


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Microsoft Cloud-based Connected Car Service Insights from Patents

Microsoft Cloud-based Connected Car Service Insights from Patents
by Alex G. Lee on 01-21-2016 at 4:00 pm

Microsoft patent application US20150262486 and patents US9092984 and US9218740 illustrate a cloud computing service to assist drivers with respect to improving driver safety. The cloud-based driver assistive system can warn drivers upon impending collisions.

The cloud-based driver assistive system includes many grid cloud servers. Each grid cloud server is associated with a grid of grids, in which each grid corresponds to a geographic area. For example, each grid cloud server divides space into square grids that have approximately even load. To do this efficiently, the cloud-based driver assistive system identifies geographic regions of varying sizes and quickly determines which server is responsible for any location. To this end, each cloud service uses the standard military grid reference system (MGRS).The MGRS enables the cloud-based driver assistive system uniquely identifies varying sized regions in a hierarchical manner.

Each grid cloud server receives information corresponding to trajectories of the vehicles that are known to the cloud server via the wireless communications that are sent from mobile devices associated with the vehicles. The mobile devices can be implemented in drivers’ smartphones or the devices built into vehicles (e.g., vehicle navigation or entertainment system). The cloud-based driver assistive system periodically collects from a GPS device and other sensors on the mobile device of a vehicle. The information includes data regarding location, speed, course, acceleration, and yaw. For example, in a normal-to-heavy traffic situation, the cloud-based driver assistive system uploads its location information every 100 ms; in lighter traffic situations, the cloud-based driver assistive system uploads its location information less frequently, e.g., every 200 ms.

Each grid cloud server determines from the trajectory-related information whether vehicles that are known to the server to be in or approaching its associated grid are at risk of collision. If so, the grid cloud server warns drivers by transmitting the alert to the vehicles that is at risk of collision. The risk of the collision can be whether a vehicle is within a threshold distance of another vehicle and/or whether the vehicle is in a lane departure state.

Using mobile devices and relatively inexpensive sensors and wireless connections to the cloud service, the cloud-based driver assistive system can be implemented inexpensively for enriching the driving experience without needing new roadside infrastructure for vehicle-to-infrastructure (V2I) communications and embedding the Dedicated Short-Range Communications (DSRC) device to every vehicle for inter-vehicle (V2V) communications.


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