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2025 Outlook with Dr Josep Montanyà of Nanusens

2025 Outlook with Dr Josep Montanyà of Nanusens
by Daniel Nenni on 01-24-2025 at 6:00 am

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Dr Josep Montanyà is a Co-founder leading the company, with +18 years of experience in MEMS, patents and the semiconductor industry. Founded Baolab Microsystems prior to Nanusens.

Tell us a little bit about your company.

 We have a patented technology that allows us to build chips with nano-mechanisms inside (called NEMS) using the de facto standard manufacturing for solid state chips (called CMOS). This allows us to have better performance, smaller size and lower cost.

There are many applications for this technology, including sensors, RF tunable devices and even AI processors with higher speeds and less consumption. Our initial focus is on a particular product called RF DTC (Digitally Tunable Capacitor). We have a very clear route to market, with signed LOI, and we will place it into Tier 1 phones (and more) that will hit the market in 4 years.

Beyond this initial product there are more RF devices we can build, and a large variety of sensors. Until now inside each wearable or portable system, you have a digital processor and one or more external sensors chips. We have the capability to change this, by embedding the sensors into the digital processors. Today it is possible to do this by using complex multi-die packages. We don’t need to do that. Instead, at Nanusens, we can build all these sensors monolithically on the same CMOS die where the digital processor is built. And this is done without impacting yield and using minimal additional area. This reduces dramatically the size of the overall system, and it reduces also power consumption to levels that today are unseen.

The company is split between its HQ in Paignton (UK) and a subsidiary in Cerdanyola (Spain).

What was the most exciting high point of 2024 for your company?

This year we got our RF DTC prototype measured by a large corporation. This was a very important milestone, because not only it shows the interest of the industry in our product, but it also validated all our measurements.

These measurements proved the incredible performance that our RF DTC can achieve, and it has helped us to better understand our route to market. Being able to increase by 30% the antenna efficiency of cell phones means that we increase by 30% talk time, we also increase by 14% the range from the base antenna, meaning that many areas of poor reception disappear. And for the smartphone OEM, the size of the PCB can be reduced, given that with our solution there is no need to switch standalone external capacitors. Reducing PCB size inside the phone is a key driver for smartphone OEMs, as this means having more space for battery.

With our chip, we aim to monopolize the +$800m market of smartphone aperture antenna. This is because we have unmatched performance, small size and low cost. And all this comes from the fact that we use our patented technology to build NEMS devices in CMOS.

What was the biggest challenge your company faced in 2024?

Main difficulty for a pre-revenue start-up like Nanusens developing semiconductor and even more MEMS technology is fundraising.  Our goal for 2024 on this front was to raise a £8m Series A to provide prototypes of inertial sensor and RF DTC devices, so that next year we would be in the market with our first products, and we have customers waiting for them. This has been moved to 2025 as we will have achieved more significant milestones by then that will facilitate this process.

How is your company’s work addressing this biggest challenge?

We have decided to focus on the RF products, leaving sensors and other devices in our future roadmap. This has allowed us to reduce costs and be more efficient.

What do you think the biggest growth area for 2025 will be, and why?

I think AI processors will keep being the dominant area in semiconductors. The incredible success of NVIDA, plus all the big techs jumping in, forecasts a very interesting year. At the same time, however, the market is starting to adjust itself, and I believe we will start seeing more start-up failures in this field as well. You need something really different to succeed in such a competitive field, dominated by giant players.

How is your company’s work addressing this growth?

We put a limited effort on studying the possibility to build better AI processors using our NEMS in CMOS technology. We discovered that it is possible for us to build vacuum transistors in CMOS. This has the potential to enable x10 faster AI processors and consuming half of the power.

Vacuum transistors enjoy the terahertz range bandwidths of vacuum tubes, but without their problems of large size, mechanical fragility, low reliability and large power consumption. In fact, given the very small, nano-sized gaps of vacuum tubes, there is not even a need for heating the metals at high temperatures. Instead, a low voltage generates such a strong electrical field with this small gap, that electrons fly between the cathode and the anode by field emission.

There are research papers on vacuum transistors, which have been built using custom NEMS processes. At Nanusens, we have the capability to build them using standard CMOS processing. This has the potential to build AI processors far beyond the state of the art, and with a process ready to produce them in high volumes. This is a project for after the Series A round is completed.

What conferences did you attend in 2024 and how was the traffic?

We did not attend any conference this year.

Will you attend conferences in 2025? Same or more?

I don’t know yet. But most probably we will not attend many conferences, as our focus is in internal R+D.

How do customers engage with your company?

Although technically we can sell IP and have already done so, our business model is to sell product (ICs) directly to our customers or through distributors.

Additional questions or final comments?

It is always difficult to predict the future. But 2025 will be a very interesting year. I will be especially interested to see what happens in this race for dominating the AI digital processor market. But, whoever wins this next year, we have a technology that will overpass them in the next years!

About Nanusens

Nanusens’ patent pending technology enables MEMS nanostructures to be built within the layers of a CMOS chip using standard CMOS processes. This enables us to create both MEMS sensors and MEMS capacitors with the required control circuitry as innovative, single chip solutions that are significantly smaller than their current, multi-component equivalents. They can also be produced in virtually unlimited numbers in standard CMOS fabs, taking advantage of their low production cost.

Also Read:

CEO Interview: John Chang of Jmem Technology Co., Ltd.

CEO Interview: Dr. Zeynep Bayram of 35ELEMENTS

CEO Interview: Subi Krishnamurthy of PIMIC


2025 Outlook with Samia Rashid of Infinisim

2025 Outlook with Samia Rashid of Infinisim
by Daniel Nenni on 01-23-2025 at 10:00 am

2025 Outlook with Samia Rashid of Infinisim

Tell us a little bit about yourself and your company. 

I am Samia Rashid, co-founder and president of Infinisim. My background is quite diverse, spanning product management, manufacturing, sales, and mergers and acquisitions. Before founding Infinisim, I was with iManage, Inc., where I played a pivotal role in growing the company from startup to $20 million in sales and taking it public. My responsibilities included sales, marketing strategy, and building partnerships with major Fortune 500 companies. I hold an MS in Engineering from Duke University and an MBA from the University of Chicago.

At Infinisim, we focus on SoC clock verification solutions for high-performance designs. As technology moves into smaller process nodes, where nanometer effects become critical, our tools empower customers to push the boundaries of clock performance—achieving results that static timing-based solutions simply cannot match. With Infinisim, customers can confidently sign off on designs optimized for peak performance and reliability.

What was the most exciting high point of 2024 for your company? 

Interestingly, it wasn’t a specific product launch or customer win. Instead, it was how the challenges of cutting-edge semiconductor designs drove customers to us. In 2024, the growing demand for AI and data-intensive applications underscored the vital role of clock performance in advanced designs. Factors like timing jitter and reliability aging posed significant challenges, and Infinisim’s solutions emerged as essential for addressing them.

One standout moment involved a high-profile issue from a major semiconductor company. A clock tree circuit within their IA core, particularly vulnerable to aging under high voltage and temperature, became a critical pain point for the industry. This is exactly the type of problem Infinisim is built to solve. It not only demonstrated the importance of our solutions but also significantly increased interest in our company and its capabilities.

What was the biggest challenge your company faced in 2024? 

Remarkably, our most exciting high point also highlighted our biggest challenge. The clock tree aging issue revealed why advanced designs require a shift in design methodologies. However, not all companies are ready to adapt.

Many teams continue to rely on large design margins to manage uncertainties, assuming this approach ensures reliability—until unforeseen problems arise. Unfortunately, these oversized margins leave untapped performance on the table, increase design size, and drive up costs at advanced nodes, ultimately affecting both profitability and competitiveness.

Our biggest challenge has been encouraging companies to rethink these traditional methods. While design margins have long been considered a safety net, they are no longer sustainable at advanced technologies. Addressing this requires not just innovative tools but also a shift in mindset, driven by education and collaboration with the industry.

How is your company’s work addressing this biggest challenge? 

Our approach focuses on both cutting-edge technology and customer education. Infinisim provides industry-leading tools for analyzing and optimizing critical timing challenges like jitter and aging, offering unprecedented accuracy and insight. These solutions enable design teams to reduce excessive margins while maintaining reliability, unlocking better performance and profitability.

Equally important is helping the industry shift its mindset. We actively engage with customers to demonstrate how adopting more precise design methodologies can lead to more competitive outcomes. By bridging the gap between traditional practices and advanced solutions, we empower companies to stay ahead in an increasingly complex market.

What do you think the biggest growth area for 2025 will be, and why?

The biggest growth area for 2025 will be driven by the rapid expansion of AI and other data-intensive applications, which demand unprecedented performance and efficiency from semiconductor designs. The size and complexity of these systems will continue to grow, with the trend toward multi-die design accelerating this evolution.

As technology advances into smaller process nodes, managing clock performance, jitter, and aging will become more critical than ever. Jitter combined with aging will emerge as a key area of analysis, directly impacting the performance and reliability of advanced designs.

This presents a significant opportunity for Infinisim to help the industry address these challenges. By enabling customers to optimize performance, reduce excessive design margins, and deliver more competitive products, we are poised to play a pivotal role in shaping the next phase of semiconductor innovation.

How is your company’s work addressing this growth? 

Infinisim is already at the forefront of these advancements. We provide de facto solutions for comprehensively analyzing and optimizing aging and jitter—two of the most pressing challenges at smaller process nodes. Our tools deliver unmatched accuracy and efficiency, helping customers confidently address these complex demands.

We’re also leading the way in deploying jitter-with-aging solutions at leading-edge companies. By ensuring our technology evolves in line with cutting-edge applications, we enable our customers to create high-performance, reliable, and competitive designs.

How do customers engage with your company?

We invite you to connect with us at the conferences we’ll be attending in 2025— details are available on our website. These events are an excellent opportunity to discuss industry trends and explore how our solutions can address your challenges.

You can also reach out directly through our website to start a conversation. We’re always excited to collaborate and help customers unlock the full potential of their designs while driving greater profitability.

Additional questions or final comments? 

I encourage all design teams working at advanced nodes to critically evaluate their design margins. While these margins were traditionally expanded to manage unpredictable effects, Infinisim’s tools now make it possible to accurately analyze and address these challenges. By embracing innovative solutions, teams can optimize their designs, reduce waste, and build more competitive, profitable products. We’re excited to continue partnering with companies to achieve these goals and shape the future of semiconductor innovation.

About Infinisim

Infinisim, Inc is a privately funded EDA company providing design verification solutions. Founded by industry luminaries, the Infinisim team has over 50 years of combined expertise in the area of design and verification.

Infinisim customers are leading edge semiconductor companies and foundries that are designing high-performance mobile, AI, CPU and GPU chips.  

Infinisim has helped customers achieve unprecedented levels of confidence in design robustness prior to tape-out. Customers have been able to eliminate silicon re-spins, reduce chip design schedules by weeks and dramatically improve product quality and production yield.

Contact Infinisim

Also Read:

My Conversation with Infinisim – Why Good Enough Isn’t Enough

The Perils of Aging, From a Semiconductor Device Perspective

A Closer Look at Conquering Clock Jitter with Infinisim


2025 Outlook with Randy Caplan of Silicon Creations

2025 Outlook with Randy Caplan of Silicon Creations
by Daniel Nenni on 01-23-2025 at 6:00 am

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Randy Caplan is co-founder and EVP of Silicon Creations. For over 18 years, Randy has helped to grow Silicon Creations into a leading semiconductor IP company with more than 500 customers in over 20 countries, and nearly 100% employee retention. Silicon Creations’ designs have been included in over 1500 mass-produced chips from 3nm to 350nm, from which more than ten million wafers were shipped. Randy’s earlier career includes developing high-speed data transceivers at Agilent Technologies and as a Senior Design Engineer at MOSAID, where he contributed to high-performance silicon IP clocking and interface products.

Tell us a little bit about yourself and your company.

Silicon Creations is a mixed-signal IP provider, specializing in low-risk, high performance clocking solutions (PLLs) and high speed data interfaces (SerDes). We offer designs in every foundry (TSMC, Samsung, GF, Intel, Rapidus, UMC, SMIC, and more…), and every process node (2nm up to 180nm, all inclusive). We were founded in 2006, are ISO9001 certified, and after 18 years, still have close to 100% employee retention.

What was the most exciting high point of 2024 for your company?

Passing ten million (TSMC) wafers shipped using our IP. Also, we passed our 1000th production license of our Fractional SoC PLL IP.

We developed and taped out a portfolio of advanced-node TSMC IP including multiple PLLs, free-running oscillators, low-noise IOs, and temperature sensor IP. We also developed select 2nm PLLs with multiple other foundries including Samsung, Intel, and Rapidus.

What was the biggest challenge your company faced in 2024?

Simultaneously developing IP in all the leading process nodes (TSMC, Samsung, Intel, Rapidus). This required new design techniques to support core-device-only requirements in GAA (gate-all-around) nano-sheet / nano-wire processes.

How is your company’s work addressing this biggest challenge?

Chip development costs in advanced nodes have gone up exponentially. We provide a substantial portfolio of low-risk, proven, foundational IP which helps enable our customers to get their designs right the first time. Our advanced design and verification flow enables fast iteration and re-verification in processes where PDKs are frequently changing. This ensures we’re not the bottleneck in our customers’ development schedule.

What do you think the biggest growth area for 2025 will be, and why?

We’re seeing growth in many parallel market segments including AI accelerator chips, crypto mining, and automotive. Customer tapeouts in advanced nodes (5nm and below) are picking up. We’re even seeing early interest in sub-2nm nodes. Due to long chip development schedules and fab times in advanced nodes, our IP sales tend to be a strong leading indicator of chip sales one to two years in the future. We don’t have first-hand knowledge of the end market forces, but we can infer from our IP sales which semiconductor market segments are seeing increased investment now.

How is your company’s work addressing this growth?

We use an advanced IP design flow, leveraging the latest EDA flows from Siemens, Synopsys, Cadence, Silvaco, and others. This helps to reduce IP development time, improve simulation-to-silicon correlation, and ensure our customers have the foundational blocks they need to build their high-performance chips.

What conferences did you attend in 2024 and how was the traffic?

All TSMC shows, ICCAD (China), DAC and many other foundry and EDA events (Samsung, GF, Intel, Siemens U2U, CadenceLive). Traffic was especially strong at TSMC and ICCAD, but we also had a good turn-out at our booth for the other events as well.

Will you attend conferences in 2025? Same or more?

Silicon Creations attended over 30 trade shows / conferences in 2024, and expects to attend a similar number in 2025…

How do customers engage with your company?

We already work with 16 of the top 20 TSMC customers, and over 500 companies overall. For new inquiries, please send an email to sales@siliconcr.com, or come to our booth at any trade show.

About Silicon Creations

Silicon Creations is a self-funded, leading silicon IP provider with offices in the US and Poland, and sales representation worldwide. The company provides world-class silicon intellectual property (IP) for precision and general-purpose timing (PLLs), oscillators, low-power, high-performance multi-protocol and targeted SerDes and high-speed differential I/Os for diverse applications including smart phones, wearables, consumer devices, processors, network devices, automotive, IoT, and medical devices. Silicon Creations’ IP is proven and/or in high-volume mass production in process technologies up to the most advanced available in the industry.

Also Read:

One Thousand Production Licenses Means Silicon Creations PLL IP is Everywhere

Silicon Creations is Fueling Next Generation Chips

Silicon Creations is Enabling the Chiplet Revolution


A Deep Dive into SoC Performance Analysis: Optimizing SoC Design Performance Via Hardware-Assisted Verification Platforms

A Deep Dive into SoC Performance Analysis: Optimizing SoC Design Performance Via Hardware-Assisted Verification Platforms
by Lauro Rizzatti on 01-22-2025 at 10:00 am

A Deep Dive into SoC Performance Analysis Part 2 Figure 1

Part 2 of 2 – Performance Validation Across Hardware Blocks and Firmware in SoC Designs

Part 2 explores the performance validation process across hardware blocks and firmware in System-on-Chip (SoC) designs, emphasizing the critical role of Hardware-Assisted Verification (HAV) platforms. It outlines the validation workflow driven by real-world applications, and best practices for leveraging HAV platforms to ensure comprehensive performance validation and meet evolving design demands. Part 1 is found here

Performance Validation Models in the SoC Verification Flow

It is crucial to distinguish between performance validation and architectural exploration, as these processes serve different purposes in the design and development cycle. Architectural exploration focuses on selecting the optimal SoC architecture to achieve specific design goals, such as maximizing performance or minimizing silicon area. In contrast, performance validation evaluates the actual performance of an architectural implementation to ensure it meets the intended specifications and operational requirements.

Performance validation is a comprehensive, multi-phase process that begins at the architectural level and progressively refines through the abstraction hierarchy, culminating in post-silicon validation. Each stage ensures the design remains aligned with performance expectations, mitigating risks before final production.

In the pre-silicon phase, performance validation relies on two distinct abstraction models, in contrast to software validation, which can utilize hybrid modeling techniques:

  • Approximately Timed (AT) Models: These models are used for early performance estimations, emphasizing functional correctness and coarse-grained timing analysis. Typically written in SystemC, AT models help identify potential bottlenecks and provide an initial understanding of the system’s behavior.
  • Cycle-Accurate (CA) Models: Offering detailed, clock-level timing accuracy, CA models are essential for evaluating critical performance metrics such as cycles per second, frames per second, or packets per second. These metrics are key to assessing system efficiency and ensuring the design meets specified requirements. CA models are also implemented in SystemC. When CA models are unavailable, performance validation must be conducted using cycle-accurate RTL simulations.

As the design progresses from abstraction to physical implementation, the final phase of performance validation occurs during silicon engineering sample (ES) testing after the pre-silicon stage. This stage ensures that the actual silicon meets performance expectations under real-world operational conditions. It serves as the ultimate verification step to confirm that the device functions as intended and satisfies all specified requirements before mass production.

By differentiating these processes and employing appropriate tools at each stage, developers can optimize both the architecture and performance of their designs, reducing time-to-market and improving reliability.

As the following figure shows, that analysis first happens at the architectural level (AT modeling) where it is explored if a particular architecture can support a certain workload performance using models of workload and architecture, given the constraints that a multi-die implementation will pose. Later at the CA level the exact performance is measured using the actual software workload on the detailed target architecture.

Fig 1. Analyzing Performance KPIs for complex, multi-die designs at the architecture level.

Performance Validation Methods

Performance validation can be performed at two key points: at the I/O design boundary or within the design itself.

Performance Analysis at the DUT I/O Boundary

This method measures performance externally, using the Design Under Test (DUT) interface. It often involves PCI Monitors: to assess DUT performance at the pin level, enabling precise, cycle-accurate testing. Real applications, such as I/O meter tools are executed in virtual environments to simulate traffic. Cycle-Accurate Data Capture: Monitors at the RTL pin level collect detailed performance metrics, providing insights into the DUT’s behavior under test conditions.

Performance Analysis Inside the DUT

Internal analysis is employed to diagnose issues. This approach involves DPI calls and internal monitors: These tools, combined with post-simulation scripts, help pinpoint performance bottlenecks within the system. Performance tracking: data is typically logged and managed in spreadsheets, with a framework of test cases designed to evaluate specific performance metrics.

Role of Monitors

Monitors play different roles, with some designed for transaction-level debugging and others focused solely on performance validation. The distinction is crucial.

In performance validation, the design clocks must remain running without interruption. Parameters analyzed are typically minimal and focused on transaction counts, such as read latency, the gap between two reads, read-after-write timing, and other performance indicators. Monitors check these metrics on the bus to assess performance.

In contrast, transaction-level debugging involves snooping the entire bus and tracking each transaction, often causing delays. For performance validation, the analysis is more streamlined, focusing on gaps between transactions, response latency, bandwidth usage, throttling, and backpressure management.

Performance Validation: The Role of HAV

Meeting verification requirements under realistic stress conditions necessitates the use of HAV platforms instead of traditional RTL simulation. Unlike RTL simulations, which are slow and impractical for running actual performance traffic, HAV platforms offer an efficient solution for thorough stress testing and performance measurement. HAV makes it possible to measure performance under real-world software and workload conditions.

In addition to supporting software bring-up and system validation, HAV platforms are increasingly driven by the need for precise power and performance analysis. HAV excels in measuring critical metrics like throughput and latency by counting clock cycles with exact precision. Testing these metrics requires real-world application payloads, as simple directed test cases are insufficient. A high-speed system is essential to execute complex application workloads effectively, ensuring meaningful and reliable performance evaluations.

To meet these demands, up to one-third of HAV resources are often dedicated solely to performance measurement. This allocation highlights the pivotal role HAV platforms play in modern performance validation, enabling engineers to address the complexities of today’s high-performance systems.

Performance Validation at the Firmware Layer

HAV plays a crucial role in performance tuning at the firmware level, an area gaining significant attention. For example, SSD providers1 frequently release updated firmware specifically designed to enhance performance, leveraging HAV to ensure these improvements are both measurable and reliable.

Firmware testing on actual silicon has become a vital part of performance validation frameworks. A main reason for adopting HAV is to enable the execution of firmware, which is not feasible in traditional simulation environments. The faster the validation platform, the better the ability to run real firmware effectively.

Running real firmware requires a PHY (physical layer). While PHY models do not include the full physical/analog properties, they facilitate the optimization of register access and other firmware interactions that impact performance. This early tuning can have a significant effect on overall system performance and efficiency.

The primary purpose of using a PHY model is to optimize firmware performance in conjunction with pre-silicon RTL, not to modify the RTL itself. This approach shifts the focus from measuring and validating the design’s performance to evaluating and enhancing system performance, including firmware, before chip release. This shift-left strategy allows teams to begin performance optimization much earlier in the development cycle.

Getting to the best performance

As outlined above, achieving optimal performance involves two key steps.

First, defining the optimal architecture to meet performance goals. This requires approximately timed models and a simulation and analysis framework that supports modeling and rapid simulation of various architectures and scenarios. Synopsys Platform Architect has become the industry-standard tool for this task, offering robust capabilities for exploring and optimizing system-level architectures.

Second, performance validation through emulation. The Synopsys ZeBu product family is critical for this stage, providing the fastest emulation performance available. Additionally, its extensive support for performance validation solutions enables both internal and external measurements while ensuring the ability to run accurate models of Synopsys PHY IPs. These capabilities are instrumental in delivering high-confidence validation results.

The question isn’t whether design teams should use these advanced tools, it’s how much time and resources they should invest in them. Greater investment in pre-silicon performance analysis and validation significantly increases the likelihood of delivering silicon with highly differentiated capabilities.

Read Part 1 of this series – Essential Performance Metrics to Validate SoC Performance Analysis

 

References

1: Update the firmware of your Samsung SSD

Also Read:

A Deep Dive into SoC Performance Analysis: What, Why, and How

Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools

Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)


2025 Outlook with Dr Axel Y. Poschmann of PQShield

2025 Outlook with Dr Axel Y. Poschmann of PQShield
by Daniel Nenni on 01-22-2025 at 6:00 am

Axel Poschmann PQShield

Tell us a little bit about yourself and your company.

The PQShield team helped define the new PQC (post-quantum cryptography) standards that will be used to replace current encryption that is vulnerable to attack by quantum computers. Now, we work with international blue-chip organizations, disruptive scale-ups, and national bodies throughout the technology supply chain to deliver the secure transition to quantum safety.

I have worked in hardware security for the past 20 years across Asia, Europe, the US and Middle East in industry and academia. In a time when quantum computers will soon be able to break current cryptography methods, I am focused on empowering organizations, industries and nations with the quantum-resistant cryptography solutions they need to protect themselves.

What was the most exciting high point of 2024 for your company?

This year was a momentous one in the history of post-quantum cryptography with the publication of the NIST PQC standards FIPS 203, FIPS 204, and FIPS 205. This marked the culmination of eight years of hard work from the global cryptographic community and was also a high point for the PQShield team, who contributed to all three of the final standards.

But more exciting is what comes next. The NIST standards have fired the starting gun for the PQC transition, as businesses armed with these standards now have the tools to implement their PQC transition roadmaps. After years of discussions around crypto discovery, we can finally focus on the secure implementation of PQC, an area particularly close to my heart – particularly looking at hardware implementations and resistance to side-channel and fault injection attacks (SCA and FI).

What was the biggest challenge your company faced in 2024?

The challenge we face is that we are replacing RSA, ECDSA and similar encryption – well understood and thoroughly tested over many years – with PQC, which is fundamentally new, based on different mathematics, and not a like-for-like replacement. There will be hurdles to cross as we work to deliver the most fundamental upgrade to our cybersecurity infrastructure in a generation.

As anyone in cybersecurity knows, attackers are always working to find new vulnerabilities and methods to crack encryption. As we roll out PQC across our digital infrastructure, our work is focused on ensuring that every line of code we write, every mathematical problem we solve, and every interaction we make is focused on one specific goal: keeping us all one step ahead of the attackers.

How is your company’s work addressing this biggest challenge?

A significant milestone for us was the certification of our  PQCryptoLib, PQShield’s hybrid cryptographic library, which has achieved FIPS-140-3 certification under the NIST CMVP process.

This represents a huge three-year team effort. PQCryptoLib is the library that underpins many of PQShield’s products – including the PQPlatform hardware IP family. While there will be many iterations of our products put forward for certification, this achievement represents a quality threshold that can now be attained by PQC.

Off the back of this effort, towards the summer of 2024 we introduced our first fully functional PQC silicon test chip. By building our own ASIC, we can now demonstrate and test our IP in the way that a customer will use it. We’re able to evaluate its operation in real detail, looking at how to be compliant against the NIST standards and perform security testing in a way that would be practically difficult on a customer product deployed in the field.

As we look forward to next year, we will start to see hardware manufacturers bringing new PQC products to market and we are primed as key partners to help them on that journey.

What do you think the biggest growth area for 2025 will be, and why?

For the vast majority of organizations, their ability to transition to PQC will be dependent on their supply chain’s ability to deliver PQC secure products. Therefore, businesses that sit at the foundation of the supply chain – particularly semiconductor manufacturers – are primed for growth and disruption.

As our lives are increasingly digitized through the cloud, businesses operate more advanced industrial IoT, and AI continues to drive demand for high throughput semiconductors, the introduction of PQC enabled hardware is only going to increase demand in this highly competitive sector.

Following the announcement of NIST standards, I expect we will be ending 2025 with quantum security firmly on the agenda of every boardroom in the global technology supply chain.

How is your company’s work addressing this growth?

PQShield is already well placed to help the semiconductor and hardware industries meet this demand. We now have long standing collaborations with Microchip Technologies, AMD and Lattice Semiconductors among others to help develop PQC solutions. Our extensive product suite is helping customers to implement PQC into their design pipelines to ensure quantum secure products reach the market in the new year.

To help us meet this growing demand, we have significantly expanded our corporate function to support global expansion across Europe, the US and Asia. This includes additions to our executive and strategic advisory board, with Antonio J. Viana (BrainChip, Arteris, Parsley, former Arm executive) joining as Non-Executive Director alongside three new additions to our strategic advisory board to accelerate growth into 2025: Mike Muller (co-founder and former CTO, Arm), Rose Schooler (former CVP, Intel, and current Arm board member), and Ian Drew (former chairman at Foundries.io, and CMO at Arm).

Knowing we’re on the precipice of the biggest technological transition in a generation, we’re confident that we have the team and the products to help the market grow in 2025.

What conferences did you attend in 2024 and how was the traffic?

Events are a key opportunity for us to meet our customers and help them to address their questions and concerns around PQC. Two big tentpole events for us last year were Mobile World Congress (MWC) in Barcelona and RSA in San Francisco. At both, we were able to showcase our collaboration with AMD and demonstrate how PQShield’s PQPerform PQC hardware accelerator was installed on the programmable logic of the AMD Versal Adaptive SoC.

Will you attend conferences in 2025? Same or more?

We will be back at MWC and RSA again next year and will be showing how our products have progressed following the publication of NIST’s standards.

Our team loves to get out and about and we have over 20 conferences we plan to attend just in the first half of 2025 alone! To name a few we have CES, Embedded World, CyberUK, DAC, DSEI 2025 and many others.

How do customers engage with your company?

You can connect with us on LinkedIn where we regularly highlight the events we’re attending as well as our latest research. We also have a monthly newsletter that shares the latest developments in PQC and at PQShield.

Get in touch if you have any concerns about planning your own PQC transition as the industry enters the execution phase. Our team has experience across the full spectrum of industry sectors and potential use cases, and is already advising both governments and global enterprises on this transition.

Additional questions or final comments?

Quantum-safe secure boot and PQ/T hybrid requirements are the main challenges moving forward.

The foundation of modern cybersecurity lies in the secure boot process, ensuring only trusted and authenticated software runs on a device. By validating code integrity through cryptographic signatures, secure boot upholds the Confidentiality, Integrity, and Availability triad, acting as the first line of defense against tampering, malware, and unauthorized changes.

The European Union and relevant agencies, such as ANSSI and BSI, advocate for a Post-Quantum/Traditional (PQ/T) hybrid cryptographic model, combining quantum-resistant algorithms with traditional cryptography for added resilience. Implementing quantum-safe secure boot remains challenging due to the performance, scalability, and compliance trade-offs of PQ/T solutions.

I am excited that we are developing a flexible Root of Trust to address this challenge, enabling diverse platforms—embedded systems, edge devices, and Critical National Infrastructure—to transition to quantum-resistant architectures seamlessly.

About PQShield

PQShield comprises a world-class collaboration of post-quantum cryptographers, engineers, and operators. We’ve helped shape all of the first international PQC NIST standards, and we were the first cybersecurity company to develop quantum-safe cryptography on chips, in applications, and in the cloud.

Also Read:

PQShield Demystifies Post-Quantum Cryptography with Leadership Lounge

PQShield Builds the First-Ever Post-Quantum Cryptography Chip

One Step Ahead of the Quantum Threat


2025 Outlook with Larry Zu of Sarcina Technology

2025 Outlook with Larry Zu of Sarcina Technology
by Daniel Nenni on 01-21-2025 at 10:00 am

Larry Zu

Tell us a little bit about yourself and your company. 

Larry Zu

I’m Larry Zu, Founder and CEO of Sarcina Technology. I’ve grown Sarcina from just designing packages for a few small companies to handling the entire post-silicon ecosystem, including package design, assembly, testing, qualification and production services for the top semiconductor companies in the world. I began my career at Bell Labs, before moving to DEC, Intel, and TSMC.  Along the way, I acquired deep skills on how to develop successful products including the Alpha, Itanium 2, Pentium 4, and XBOX 360 microprocessors.

Over my career, I have taped out nearly 1,000 packages with a greater than 99% first tape-out success rate. I’ve applied those skills to build Sarcina, a company that works with the world’s top foundries to ensure high quality products. We manage from the simplest to the most complex of packages. Companies forward their wafers from their foundries and Sarcina does the rest.  Wafers in, packaged chips out.

What was the most exciting high point of 2024 for your company? 

There were many great successes in 2024, so this is a difficult question. If I had to pick one, perhaps I would cite our work on Bump Pitch Transformers (BPT). I know it’s an odd name, but what this work does is reduce the cost and complexity of 2.5D package designs.

Current advanced 2.5D packaging uses a substrate to transpose a chip’s microbump pitch from 40-50 micrometers to the package’s 130 micrometer bump pitch. This is typically done with a silicon TSV (through-silicon via) interposer. These substrates are very expensive, in short supply, and complex to design, resulting in lead-time and cost challenges for many advanced designs.

Our BPT approach uses RDL interconnect or silicon bridge technologies, replacing silicon TSV interposers with more cost-effective re-distribution layers (RDL). This architecture is ideal for homogeneous and heterogeneous chiplet integration, targeting high-performance computing (HPC) devices for AI, data center, microprocessor, and networking applications.

What was the biggest challenge your company faced in 2024? 

Our biggest challenge is actually not a technical one. Sarcina’s strength and fundamental differentiation is our ability to complete high-performance engineering projects. Over the past 12 years, Sarcina has taped out more than 100 packages, all first-time successes. We’ve never re-taped out a single package.

The challenge is to get the word out to more companies who can benefit from our capabilities. We can help small to mid-sized ASIC companies and large system houses be more successful.

How is your company’s work addressing this biggest challenge?  

I personally do a lot of presentations at many trade shows and industry events to help spread the word about Sarcina’s Application Specific Advanced Package (ASAP) Service. Our work here on SemiWiki is also a key part of that strategy.

What do you think the biggest growth area for 2025 will be, and why?

Advanced packaging is now setting the trend for the next level of innovation. The know-how to integrate multiple devices in an advanced package provides the margin of victory. Sarcina is at the forefront, enabling these trends.

There will be growth in many areas as a result. Some markets we are currently enabling include AI, networking, data center, high-speed comms, and medical.

How is your company’s work addressing this growth? 

We continue to build more advanced flows that embody our substantial experience. Our partnerships also help to expand our reach and impact. The work we are doing with Keysight is an example of this. So is the work we are doing with Intel Foundry Services (IFS) Accelerator Design Services Alliance.

What conferences did you attend in 2024 and how was the traffic?

We attended quite a few events in 2024:

  • Chiplet Summit
  • OFC (Optical Fiber Communications)
  • IEEE MTT-S International Microwave Symposium
  • Silicon Catalyst Spring Portfolio Conference
  • Design Automation Conference (DAC) (I was a speaker at the Keysight Theater)
  • IEEE Electronics System-Integration Technology Conference (ESTC)
  • Silicon Catalyst Semiconductor Industry Forum

All these conferences are packed with people because they address hot topics in high performance computing and communication for AI applications inside a semiconductor ASIC chip. As semiconductor packaging becomes more and more important to build advanced ASIC chips, we observe more traffic to our booth during these conferences.

Will you attend conferences in 2025? Same or more?

We plan to attend similar shows in 2025, with some possible additions.  You can visit https://sarcinatech.com/upcoming-events/ to see the latest plans we have for show attendance.

How do customers engage with your company?

You can certainly stop by and visit us at the shows we will attend. You can also reach out to us on our website here: https://sarcinatech.com/contact/. We’ll respond quickly and work with you to define how we can make you more successful.

Additional questions or final comments? 

Semiconductor technology is evolving rapidly. Monolithic integration is being replaced by complex multi-chip system in package design.  These designs represent substantial challenges with many new effects to be modeled and tamed. Sarcina has the experience, skills and track record to help you overcome these challenges. Give us a call and find your margin of victory.

Also Read:

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

How Sarcina Revolutionizes Advanced Packaging #61DAC

Sarcina Teams with Keysight to Deliver Advanced Packages


2025 Outlook with Dr. Chouki Aktouf of Defacto

2025 Outlook with Dr. Chouki Aktouf of Defacto
by Daniel Nenni on 01-21-2025 at 6:00 am

Picture Chouki

Chouki Aktouf is Founder & CEO of Defacto Technologies and Co-Founder of Innova Advanced Technologies.  Prior to founding Defacto in 2003, Dr. Aktouf was an associate professor of Computer Science at the University of Grenoble – France and leader of a dependability research group. He holds a PhD in Electric Engineering from Grenoble University.

Tell us a little bit about your company. 

We provide since more than two decades innovative SoC design solutions for RTL designers and SoC architects. Defacto’s SoC Compiler tool is becoming the “De Facto” software to build large SoCs pre-synthesis by including not only RTL but also IP-XACT and design collaterals such as UPF and SDC. The Physically awareness of the Defacto tool strengthens its market positioning to meet aggressive PPA goals. The company is also known by its high-quality support which is provided to the end-users and also the innovation Defacto brings every year to the market to help building SoCs faster and cheaper.

What was the most exciting high point of 2024 for your company? 

The main accomplishment of Defacto was to position as a real leader in the front-end SoC integration, when having RTL but not only. IP-XACT, UPF, and SDC also need to be considered towards better efficiency, and cost.

What was the biggest challenge your company faced in 2024? 

In 2024, one of the biggest challenge was to succeed in R&D projects considering AI technologies. In the new Defacto products, we will be announcing AI-based automation to confirm our tool as the De Facto solution for SoC creation pre synthesis and help designers even with less expertise to benefit from the tool.

How is your company’s work addressing this biggest challenge? 

We work closely with leading R&D teams in France and in Europe to help solving technical challenges.

What do you think the biggest growth area for 2025 will be?

We believe AI-based EDA will be the main topic for the coming year.

How is your company’s work addressing this growth? 

 The company has engaged since several years with best Research labs in Europe to work closely on advanced AI-based technologies for EDA.

What conferences did you attend in 2024 and how was the traffic?

The main conference we attended this year was DAC. We feel that DAC is coming back from COVID since the past year and we were pleased to see a good affluence, in particular during the first day. We eager to see 2025!

Will you attend conferences in 2025? Same or more?

In 2025 we plan to attend DATE which will be close to our Headquarters in Grenoble, France. Of course DAC will be the main event and we will be announcing big new capabilities. We also plan to attend ITC since we have a regrowth activity around DFT with many news to highlight.

How do customers engage with your company?

The best is either to drop us an email (info_req@defactotech.com) or contact us on  website (https://defactotech.com/contact). We are known in the market as highly reactive, in both technical and business sides. So we encourage to contact us to set up presentations, demos and evaluations.

We also have an upcoming Innova Webinar that you can also attend:

How to track and predict design resources for complex chip design projects by including jointly cost and sustainability

We hope to meet you there.

Also Read:

Build a 100% Python-based Design environment for Large SoC Designs

Defacto Technologies and ARM, Joint SoC Flow at #61DAC

A Joint Solution Toward SoC Design “Exploration and Integration” released by Defacto #61DAC


Synopsys Brings Embedded Memory to the Future with its Flexible, IP-Based Compilers

Synopsys Brings Embedded Memory to the Future with its Flexible, IP-Based Compilers
by Mike Gianfagna on 01-20-2025 at 6:00 am

Synopsys Brings Embedded Memory to the Future with its Flexible, IP Based Compilers

There is a revolution happening that is fueled by innovation in areas such as AI, IoT and autonomous driving. These new systems put incredible stress on next-generation semiconductor technology. Faster processing, higher density and lower latency must all be delivered with reduced power and thermal profiles. One technology has become the centerpiece for much of these advances – memory. And within that discipline the need for dramatically improved embedded non-volatile memory. Synopsys is at the forefront of innovation here. Let’s find out how Synopsys brings embedded memory to the future with its flexible, IP-based compilers.

Embedded NVRAM – The Options

Flash has been the go-to option for embedded non-volatile memory for a long time. But as applications demand much more non-volatile storage and processes shrink below 28nm, flash memory is running out of steam. A new approach is needed to deliver high-speed data collection, transmission, storage, and analysis at scale. 

Two emerging technologies are gaining traction – Magneto-Resistive Random Access Memory (MRAM) and Resistive Random Access Memory (RRAM). These embedded memory options deliver the density, capacity, and scalability for next-generation systems. It turns out each is optimized for different applications and use cases. Let’s examine some of the differences.

MRAM: delivers higher reliability and superior power, performance, and area (PPA), even in extreme environments. Initially developed for aerospace applications, it uses an adjustable magnetic layer to maximize storage density. And its exceptional power and performance characteristics are ideal for applications requiring the highest levels of reliability and data integrity.

The technology is useful for vehicles that need over-the-air software updates for example.  A consideration for this technology is its sensitivity to strong magnetic fields. This may be mitigated with physical placement constraints or shielding in certain environments, adding complexity for some applications.

RRAM: is still in the early stages of market awareness and adoption. This technology uses a dielectric layer to store data. It isn’t sensitive to magnetic fields like MRAM, but it is less reliable in extreme environments.

Low cost and energy consumption combined with high density and scalability make RRAM a good choice for IoT devices, wearables, in-room sensors, and other applications requiring cost, power, and space efficiency. RRAM is also being used in automotive applications where environmental conditions can be managed.

Each of these technologies has a place, and design teams need comprehensive access to each to find the best answer. This is where Synopsys brings embedded memory to the future with its flexible, IP-based compilers.

The Synopsys Approach

Thanks to its IP-based compiler solutions, Synopsys can streamline MRAM and RRAM integration. Most suppliers offer a limited set of fixed macro options for embedded memory. With its IP-based compiler solutions, Synopsys provides comprehensive and configurable choices, allowing design teams to instantly build a wide range of macros and precisely match memory sizes and aspect ratios with MCU requirements.

For example, the MRAM Compiler is well-suited for newer applications with simplified power supply requirements, built-in self-test (BIST) and repair, and error correction code (ECC). In addition to accelerating system-on-chip (SoC) integration and time-to-market, it addresses the growing demand for reliable, cost-effective, efficient memory in AI-enabled applications.

The figure below illustrates how configurable MRAM IP provides flexibility for multiple word widths, aspect ratios, and floorplan optimizations.

Configurable MRAM IP

Synopsys is actively developing MRAM in the TSMC 22ULL and TSMC 16FFC processes. The company is also developing automotive MRAM and RRAM compilers in the GlobalFoundries 22FDX process, and they have demonstrated successful MRAM silicon on the 22ULL process, enabling SoC designers with low-risk solutions. Data retention, write endurance, and magnetic immunity testing results have met or exceeded design targets.

Leading foundries have announced roadmaps for additional MRAM and RRAM enablement, including FinFET solutions at 6nm and beyond. Synopsys has stated it will continue advancing next-gen memory technologies and help redefine the future of embedded systems.

To Learn More

You can read an informative blog from Synopsys entitled, Flash Forward: MRAM and RRAM Bring Embedded Memory and Applications into the Future here. You can also access the web page for Synopsys MRAM and RRAM IP here. That page also has very useful links to access a foundation IP selector and a non-volatile memory IP selector. And that’s how Synopsys brings embedded memory to the future with its flexible, IP-based compilers.

Also Read:

Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools

Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)

A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design


Podcast EP270: A tour of the Q3 2024 Semi Electronic Design Market Data Report with Wally Rhines

Podcast EP270: A tour of the Q3 2024 Semi Electronic Design Market Data Report with Wally Rhines
by Daniel Nenni on 01-17-2025 at 10:00 am

Dan is joined by Dr. Walden Rhines. Wally is a lot of things, CEO of Cornami, board member, advisor to many and friend to all. Today he is the Executive Sponsor of the SEMI Electronic Design Market Data report.

Dan explores the recently published report with Wally. Overall growth was 8.8%, a strong number but not as large as prior quarters. However, Wally does report that overall EDA revenue has reached a $20B run rate for the first time, a substantial achievement. Wally and Dan explore the details of the report, including the areas of strong growth and the reasons why. There were two regions that exhibited weaker growth as well. Dan explores the reasons for this with Wally. Some interesting insights about overall market dynamics come out of that discussion.

There are many other insightful discussions, including the strong growth in services and what that can mean for the future of the industry. The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual


CEO Interview: John Chang of Jmem Technology Co., Ltd.

CEO Interview: John Chang of Jmem Technology Co., Ltd.
by Daniel Nenni on 01-17-2025 at 6:00 am

Jmem Tek CEO John

John Chang, founder and CEO of JMEMTEK, combines technical expertise and business acumen to lead the company in addressing critical hardware security challenges. With a PhD candidate in Electro Physics at National Yang Ming Chiao Tung University and dual bachelor’s degrees in Electrical Engineering and Banking and Finance from the Queensland University of Technology, John bridges innovation and strategy seamlessly.

Since founding JMEMTEK in 2022, John has secured over $6 million in funding. His decade-long experience in semiconductor innovation and failure analysis, reinforces JMEMTEK’s position as a leader in hardware security and post-quantum cryptography.

With John’s vision, JMEMTEK continues to drive advancements for industries like FinTech, Defense Tech, and AIoT, shaping the future of secure and scalable technologies in the new quantum era.

Can you tell us about Jmem Technology and its core mission?

Jmem Technology Co., Ltd. is a pioneering company specializing in hardware security IP and IC design services. Our primary mission is to address the growing cybersecurity challenges posed by the advent of quantum computing and emerging threats in the digital age. We focus on developing cutting-edge Post-Quantum Cryptography (PQC) solutions and our foremost technologies on Roof of Trust like J-Physical Unclonable Function (JPUF) technology to deliver robust and scalable security for industries such as FinTech, Defense, and AIoT.

Our vision is simple yet bold: to build a secure digital future by safeguarding critical infrastructures with advanced hardware solutions. This vision drives everything we do, from R&D to partnerships with academia and industry leaders.

What sets Jmem Technology apart in the market?

Jmem Tek stands out because of our dual focus on innovation and practicality. For instance, our proprietary PQC security chip, powered by JPUF technology, not only generates and stores cryptographic keys securely but also enables tamper-proof authentication and secure OTA firmware updates.

Our technology is also designed to be highly scalable, making it adaptable to a wide range of applications—from protecting sensitive data in autonomous vehicles to securing critical systems in defense. Unlike software-based security measures, our hardware-based solutions offer unparalleled protection against cloning, reverse engineering, and other sophisticated attacks. With our chip our solutions can outperformed PQC on software up to few-hundreds times.

Additionally, we have cultivated strong collaborations with globally respected research institutions and corporate partners, including Andes Technology, UMC and co-author with HSSC on Side Channel attack topic. These partnerships validate our technological approach and open doors to new markets and opportunities.

How has Silicon Catalyst supported Jmem Technology’s journey?

Becoming a portfolio company of Silicon Catalyst has been transformative for Jmem Tek. The program offers unparalleled access to mentorship, industry connections, and technical resources. This support has accelerated our product development and market expansion, particularly in the U.S. and Europe.

One of the key benefits is the opportunity to engage with Silicon Catalyst’s extensive network of industry veterans, who provide invaluable insights and guidance as we scale. Additionally, being associated with Silicon Catalyst enhances our credibility as an innovative leader in hardware security, helping us forge stronger relationships with investors and partners.

What industries and applications do you see benefiting most from Jmem Technology’s solutions?

The versatility of our solutions allows us to cater to a diverse range of industries. Our PQC and PUF technologies are particularly valuable for:

  • FinTech: Ensuring secure transactions and safeguarding sensitive financial data.
  • Defense: Protecting mission-critical systems and communications against cyber threats.
  • AIoT: Enabling secure device connectivity and data exchange in smart environments.

As quantum computing continues to evolve, the demand for hardware-based security solutions will only grow, especially in sectors where data confidentiality and system integrity are paramount.

What are Jmem Technology’s plans for the future?

Our immediate goal is to expand our reach into new markets, particularly in Europe and North America, while strengthening our foothold in Taiwan’s semiconductor ecosystem. We’re also focused on advancing our research and development to further enhance the performance and versatility of our PQC and JPUF solutions.

Looking ahead, we aim to deepen our collaborations with strategic partners and academic institutions, leveraging their expertise to refine our technology and explore new applications. Ultimately, our mission is to create a world where every digital interaction is secure, no matter how advanced the threats become.

What excites you most about the future of hardware security?

The rapid advancement of quantum computing poses both challenges and opportunities. While it introduces new vulnerabilities, it also pushes us to innovate faster and smarter. We are excited about the role Jmem Tek can play in this transformative period, helping industries adapt and thrive in the face of unprecedented change, not just secure, but also enhancing the efficiency.

By staying ahead of the curve, we’re not just solving today’s problems—we’re building the foundation for a secure and resilient digital future.

For more information about Jmem Technology, visit https://jmemtek.com.

Also Read:

CEO Interview: Dr. Zeynep Bayram of 35ELEMENTS

CEO Interview: Subi Krishnamurthy of PIMIC

CEO Interview: Dr Josep Montanyà of Nanusens