Wiki Tag: Chiplets
Semiconductor Hardware Security Assurance
Semiconductor Hardware Security Assurance is the discipline and set of practices used to build justified confidence that an integrated circuit and its supporting hardware behave only as intended, resist realistic attacks, and can be trusted over their life cycle. It combines threat modeling, secure architecture, secure … Read More
CoPos (Chip-on-Panel-on-Substrate) Wiki
Chip-on-Panel-on-Substrate (CoPoS) is an advanced packaging architecture that “panelizes” the classic chip-on-carrier flow. Instead of building redistribution and interposer structures on round wafers, CoPoS forms them on large rectangular panels, then mounts the finished module onto an organic or glass package substrate.… Read More
Intel EMIB (Embedded Multi-die Interconnect Bridge)
EMIB (Embedded Multi-die Interconnect Bridge) is an advanced 2.5D packaging technology developed by Intel that enables high-density, high-bandwidth, low-latency interconnects between chiplets (dies) within a single package—without requiring a full silicon interposer. EMIB offers a modular and scalable approach to … Read More
CoWoS® (Chip-on-Wafer-on-Substrate) Wiki
CoWoS® (Chip-on-Wafer-on-Substrate) is a 2.5D advanced packaging technology developed by TSMC that allows multiple dies—including logic, memory, and analog ICs—to be integrated side-by-side on a high-density silicon interposer. CoWoS is a cornerstone of TSMC’s 3D Fabric™ platform and plays a critical role in enabling … Read More
UCIe (Universal Chiplet Interconnect Express) Wiki
UCIe (Universal Chiplet Interconnect Express) is an open industry standard for die-to-die interconnects that enables high-bandwidth, low-latency, power-efficient communication between chiplets in advanced package architectures. The UCIe specification was launched in March 2022 by the UCIe Consortium, with founding… Read More
TSMC 3D Fabric™ Wiki
TSMC 3D Fabric™ is a comprehensive suite of 3D silicon stacking and advanced packaging technologies developed by Taiwan Semiconductor Manufacturing Company (TSMC) to enable high-performance, power-efficient, and space-optimized system integration. It represents TSMC’s response to growing industry demand for heterogeneous… Read More
Semiconductor Verification IP (VIP) Wiki
Semiconductor Verification IP (VIP) is a pre-verified, reusable block of code or models used in simulation and verification environments to validate the correctness and interoperability of semiconductor designs. VIPs emulate the behavior of industry-standard protocols, interfaces, or system components, allowing verification… Read More
SerDes (Serializer/Deserializer) Wiki
Overview
SerDes (short for Serializer/Deserializer) is a high-speed circuit block used to convert parallel data to serial form and back again. It is widely used in integrated circuits, networking equipment, SoCs, and interconnect protocols to enable high-bandwidth data transmission over limited pin or channel resources.… Read More
TSMC N5 Process Technology Wiki
Overview
TSMC N5 (5-nanometer process node) is a high-volume FinFET-based semiconductor manufacturing technology developed by Taiwan Semiconductor Manufacturing Company (TSMC). It succeeded the N7 (7nm) family and introduced substantial improvements in performance, power, and transistor density.
N5 is widely regarded… Read More
Chiplets Wiki
Chiplets are small, functional integrated circuit (IC) blocks that are designed to work together in a modular fashion to form a complete system-on-chip (SoC) or system-in-package (SiP). Instead of building a large, monolithic chip on a single die, chiplet-based design breaks the system into multiple smaller dies that are connected… Read More
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