I made it through the Virtual Intel Architecture Day last week and much to my surprise it was very well done. Virtual events have been hit and miss but this one was definitely a hit. Great content, approachable experts, a glitch-free experience. The mainstream media has been redundantly covering it so let me add my many years of experience,… Read More
Higher Foundry/logic exposure helps-
Little or no Covid or China trade impact-
Nice quarter but even better guide-
Applied reported revenues of $4.4B and NonGAAP EPS of $1.06, nicely above street estimates of $4.2B and $0.95 in EPS. Guidance is for revenues $4.6B +-$200M and EPS of $1.17+- $0.06, versus current expectations of… Read More
Two bits of recent news has excited people in the semiconductor manufacturing space. First TSMC (bit.ly/384joVr) announced their intention to invest $12 B dollars in a Fab in Arizona. Then came the Corona-driven bipartisan proposed $23B federal government investment in semiconductor manufacturing (nyti.ms/2YZzFqnl). … Read More
Cyber security, economic growth, government leadership and industry support must be weighed
The debate
A healthy public debate is underway as to whether India should invest in semiconductor manufacturing. PVG Menon, former chair of the India Electronics and Semiconductor Association, supports the objective as part of a full… Read More
Last week, Intel announced its second-quarter financial results which easily beat the analysts’ consensus expectations by a handsome margin. Yet the stock price plummeted by over 16% right after the earnings call with management. Seven analysts downgraded the stock to a sell and the common theme on all the downgrades was that… Read More
On Thursday July 9 Imec held a virtual technology forum. Imec is one of the premier research organizations working on semiconductor technology and their forums are always interesting. My area of interest is process technology and the following are my observation in that area from the forum.
Luc Van Den Hove
Luc Van Den Hove is the… Read More
Thermo-compression bonding is used in heterogeneous 3D packaging technology – this attach method was applied to the assembly of large (12-stack and 16-stack) high bandwidth memory (HBM) die, with significant bandwidth and power improvements over traditional microbump attach.
The rapid growth of heterogeneous… Read More
Results were in line after correcting Covid Caused Revenue Rec issue-
ASML reported revenues of Euro3.3B and EPS of Euro1.79 as revenues from two EUV systems was not recognized, due to … Read More
“AI is the new electricity.”, according to Andrew Ng, Professor at Stanford University. The potential applications for machine learning classification are vast. Yet, current ML inference techniques are limited by the high power dissipation associated with traditional architectures. The figure below highlights the … Read More
There have been a multitude of announcements recently relative to the incorporation of machine learning (ML) methods into EDA tool algorithms, mostly in the physical implementation flows. For example, deterministic ML-based decision algorithms applied to cell placement and signal interconnect routing promise to expedite… Read More
