The First Must-Have in 5G

The First Must-Have in 5G
by Bernard Murphy on 12-11-2019 at 6:00 am

Bulk acoustic wave filter

If I was asked about must-have needs for 5G, I’d probably talk about massive MIMO and a lot of exotic parallel DSP processing, also perhaps need for new intelligent approaches to link adaptation and intelligent network slicing in the infrastructure. But there’s something that comes before that all that digital cleverness, in … Read More


Webinar: Tanner and ClioSoft Integration

Webinar: Tanner and ClioSoft Integration
by Alex Tan on 11-20-2018 at 7:00 am

A fusion of digital and analog IC circuits, mixed signal ICs are key components to many applications including IoTs, automotive, communications and consumer electronics –acting as enabler to bidirectional conversion of signals between analog domain derived from various audio, temperature and visual sensors to digital… Read More


Edge Devices Rely on Intelligent MEMS Based Sensors

Edge Devices Rely on Intelligent MEMS Based Sensors
by Tom Simon on 03-29-2018 at 12:00 pm

MEMS sensors play a huge role in intelligent systems these days. Mobile and IoT devices would essentially be blind if not for the rich variety of MEMS sensors integrated into them. The MEMS sensor market is growing rapidly, topping $10B in 2016 and slated to exceed $20B by 2020. MEMS is also growing in the RF market, where they are providing… Read More


IoT Project Planning – Profiting from the Folly of Others

IoT Project Planning – Profiting from the Folly of Others
by Mitch Heins on 12-18-2017 at 12:00 pm

I recently was introduced to a white paper written by John Stabenow, Director at Mentor, a Siemens Business, that gave an excellent overview of things to consider before launching into the design of an IoT edge project. John starts the paper with a quote from Pliny the Elder (A.D.23-A.D.79) who said, “The best plan is, as the common… Read More


Fusing CMOS IC and MEMS Design for IoT Edge Devices

Fusing CMOS IC and MEMS Design for IoT Edge Devices
by Mitch Heins on 09-11-2017 at 12:00 pm


In my 34 years in IC and EDA, it never ceases to amaze me as to how ingenious designers can be with what is given them. Mentor, a Siemens business, has released a wonderful white paper that is proof of this yet again. The white paper steps through how one of their customers, MEMSIC, used the Tanner tool suite to develop a combination CMOS… Read More


Overcoming the Challenges of Creating Custom SoCs for IoT

Overcoming the Challenges of Creating Custom SoCs for IoT
by Mitch Heins on 06-30-2017 at 7:00 am

As the Internet of Things (IoT) opportunities continues to expand, companies are working hard to bring System-on-Chip (SoC) solutions to market in the hopes of garnering market share and revenue. However, it’s not as easy as it may first seem. Companies are running into a series of issues that stand between them and capturing the… Read More


Unlocking Access to SOC’s for IoT Edge Product Developers

Unlocking Access to SOC’s for IoT Edge Product Developers
by Tom Simon on 03-13-2017 at 4:00 pm

In the wake of the many mega mergers and consolidation in the semiconductor and electronics space, it is easy to say that opportunities for smaller companies are shrinking. Indeed, quite the opposite might be true. The larger companies, like Broadcom, ARM, Qualcomm, Analog Devices, Microchip, Maxim and Infineon (to name a few)… Read More


Semiconductors Future Hinges on a Single Pillar

Semiconductors Future Hinges on a Single Pillar
by Pawan Fangaria on 01-03-2016 at 7:00 am

A unique phenomenon has started manifesting itself under the slew of mergers and acquisitions this year in the semiconductor landscape. This phenomenon is bound to intensify in the near future and would positions itself as a key factor for the future of the semiconductor industry. The winners and losers in the game would be determined… Read More