Navigating the System-in-a-Package Manufacturing Ecosystem

Navigating the System-in-a-Package Manufacturing Ecosystem
by Mitch Heins on 10-26-2017 at 12:00 pm

Being an old ASIC physical design guy, I tend to think of ASICs from a “bond-pads-in” perspective. This week however, I had a very eye-opening discussion with Dan Leung, Director of Packaging and Assembly for Open-Silicon, that totally changed my perspective. While I had been exposed many times to the concept of systems-in-a-package… Read More


Webinar Alert: High Bandwidth Memory ASIC SiPs for HPC and Networking Applications

Webinar Alert: High Bandwidth Memory ASIC SiPs for HPC and Networking Applications
by Mitch Heins on 08-22-2017 at 12:00 pm

Calling all ASIC designers working on High-Bandwidth Memory (HBM) access architectures in high-performance computing (HPC), networking, deep learning, virtual reality, gaming, cloud computing and data center applications. You won’t want to miss this upcoming webinar focused on system integration aspects of a HBM2 ASIC… Read More


Cadence Expands Integrated Photonics Beachhead

Cadence Expands Integrated Photonics Beachhead
by Mitch Heins on 03-30-2017 at 4:00 pm

In November of 2016, I made a bold statement that October 20, 2016 would stand as a watershed day in integrated photonics. The reason for this claim was that GLOBALFOUNDRIES proclaimed that integrated photonics was real and here to stay. The same week I wrote an article about Cadence Design Systems securing a photonic beachhead … Read More