Webinar: Intel: Pushing EMIB Forward Design Methodology Insights with Synopsys Tools – SemiWiki

Webinar: Intel: Pushing EMIB Forward Design Methodology Insights with Synopsys Tools – SemiWiki
by Admin on 06-02-2026 at 1:10 pm

Date: Jun 25, 2026 9:00 AM PST

In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys

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The Great Divide: A Tale of Three Hardware Emulation Architectures

The Great Divide: A Tale of Three Hardware Emulation Architectures
by Lauro Rizzatti on 05-06-2026 at 10:00 am

A Tale of Three Hardware Emulation Architectures

Hardware emulation arose as a necessity out of the needs of the eighties. By the mid-1980s, semiconductor designs had outgrown the practical limits of gate-level simulation. Gate-level simulation delivered accuracy, but at glacial pace; silicon prototypes performed at real-speed but arrived far too late. The industry needed… Read More


Synopsys and TSMC Deepen AI Design Alliance: What It Means

Synopsys and TSMC Deepen AI Design Alliance: What It Means
by Kalar Rajendiran on 05-05-2026 at 10:00 am

Synopsys Powering the next generation of AI

A recent announcement from Synopsys signals a meaningful escalation in the race to build next-generation AI hardware. The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance… Read More


WEBINAR: Beyond Moore’s Law and The Future of Semiconductor Manufacturing Intelligence

WEBINAR: Beyond Moore’s Law and The Future of Semiconductor Manufacturing Intelligence
by Daniel Nenni on 04-16-2026 at 6:00 am

The Future of Semiconductor Manufacturing Intelligence

This is a live panel with industry experts who are on the leading edge of AI in semiconductor manufacturing. This is a must attend event for all levels of semiconductor professionals. I hope to see you there. 

The semiconductor industry faces unprecedented challenges as it pushes toward advanced nodes below 3nm, managing exponential… Read More


From Wooden Boards to White Gloves: How FPGA Prototyping and Emulation Became Two Worlds of Verification… and How the Convergence Is Unfolding

From Wooden Boards to White Gloves: How FPGA Prototyping and Emulation Became Two Worlds of Verification… and How the Convergence Is Unfolding
by Lauro Rizzatti on 04-13-2026 at 6:00 am

From Wooden Boards to White Gloves Table 1 (1)

FPGA prototyping and hardware emulation originated from two independent demands that emerged at roughly the same time, namely, the necessity to implement digital designs in reconfigurable hardware. This was conceivable given the newly introduced field programmable gate array (FPGA) device.

Yet from the very beginning they… Read More


From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration

From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration
by Daniel Nenni on 04-08-2026 at 10:00 am

Types of Mutli Deisgn Packaging Synsopsys

Modern automotive electronics are undergoing a rapid transformation driven by increasing compute demands, functional safety requirements, and the shift toward scalable semiconductor architectures. One of the most significant technological developments enabling this transformation is the adoption of multi-die system… Read More


RISC-V Now! — Where Specification Meets Scale!

RISC-V Now! — Where Specification Meets Scale!
by Daniel Nenni on 03-31-2026 at 8:00 am

RVN! 26 SemiWiki (400 x 400 px) (1)

In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible RISC-V ISA from an exciting specificationRead More


Post-Silicon Validating an MMU. Innovation in Verification

Post-Silicon Validating an MMU. Innovation in Verification
by Bernard Murphy on 03-25-2026 at 6:00 am

Innovation New

Some post-silicon bugs are unavoidable, but we’re getting better at catching them before we ship. Here we look at a method based on a bare-metal exerciser to stress-test the MMU. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More


Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces

Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces
by Kalar Rajendiran on 03-23-2026 at 10:00 am

Bump maps for HBM PHY and HBM memory

This article concludes the three-part series examining key methodologies required for successful multi-die design. The first article Reducing Risk Early: Multi-Die Design Feasibility Exploration focused on feasibility exploration and early architectural validation, while the second article Building the InterconnectRead More