Dan is joined by podcast producer and collaborator Mike Gianfagna for Semiconductor Insiders episode 200. Dan and Mike look over the past two years (and 200 podcasts) to develop a top ten list of changes and innovation in the semiconductor industry. There is a lot of back-story detail on each topic in this far-reaching discussion.… Read More
In my previous article, we touched on ways to pull in the schedule. This time I’d like to analyze how peak usage affects project timeline and cost. The above graph is based on real pattern taken from one development week in Annapurna Labs 5nm Graviton.
The Graph shows the number of variable servers per hour per day. There’s a baseline… Read More
Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Software. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America,
Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Software. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America,
What is SIPI SIG?
The Synopsys SIPI SIG Event is for Synopsys customers to hear the latest advances and solutions in signal and power integrity from customers and partners. This event provides the opportunity for networking and discussion with fellow SIPI engineers to increase awareness of signal and power integrity issues
At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:
In the world of semiconductor design, constraints are essentially specifications and requirements that guide the implementation of a specific hardware or software component within a larger system. They dictate timing, area, power, performance, and of course functionality of a design, playing a crucial role in ensuring that… Read More
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
Hyperscale data centers are evolving rapidly to meet the demands of high-bandwidth, low-latency applications, ranging from AI and high-performance computing (HPC) to telecommunications and 4K video streaming. The increasing need for faster data transfer rates has prompted a scaling of Ethernet from 51Tb/s to 100Tb/s. Numerous… Read More
Synopsys Webinar: Tuesday, November 28, 2023 | 10-11 am. PT
System-on-Chip (SoC) designs continue to grow in both size and complexity in order to meet the ever-growing performance and power demands associated with modern technology. To keep up with this fast-paced evolution, the corresponding design-for-test (DFT) logic
