The move to true 3D IC, monolithic 3D SOC and 3D heterogeneous integration may require one of the most major design tool architecture overhauls since IC design tools were first developed. While we have been taking steps toward 3DIC with 2.5D designs with interposers, HBM, etc., the fundamental tools and flows remain intact in many… Read More
Automotive segment is a market that has historically been supported by a few select suppliers within the semiconductor ecosystem. Over the last decade, this market has transitioned from just being about reliability, performance, fuel efficiency, etc., to placing equal importance to user experience. This user experience … Read More
If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More
Thanks to advanced hardware and software, smart vehicles are improving with every generation. Capabilities that once seemed far-off and futuristic—from automatic braking to self-driving at the very pinnacle—are now either standard or within reach. However, considering how vehicle architectures have continued to evolve,… Read More
On July 30, 2020, NASA launched the Mars 2020 Perseverance rover, which is scheduled to land today. Perseverance has been deployed to Mars with a new mission: to search for evidence of past life and collect samples that will eventually be brought back to Earth by future missions.
Just prior to this year’s Synopsys User Group (SNUG) meeting, I had a call with Hany Elhak, Group Director of Product Management and Marketing at Synopsys, to talk about their latest announcements for analog simulation. Synopsys usually has big things to talk about each year around this time – this year is no exception. Hany… Read More
PCI-SIG has held to doubling PCIe’s data rate with each revision of the specification. The consortium of 800 companies, with its board consisting of Agilent, AMD, Dell, HP, Intel, Synopsys, NVIDIA, and Qualcomm, is continuing this trend with the PCIe 6.0 specification which calls for a transfer rate of 64 GT/s. PCI-SIG released… Read More
We have come a long way from the days of limited and manageable characterization databases with fewer views and smaller library sizes. The technologies we are headed towards pushing characterization to its limits with special modeling for variation, aging and reliability all on a single process, voltage and temperature (PVT).… Read More
Design verification (DV) is still one of the biggest challenges in the ASIC based product world. In last two decades, we have seen many changes in terms of HVLs and methodologies used for design verification. System Verilog is the most popular HVL these days and UVM is the most popular verification methodology.
Even after such an… Read More
What do genome sequencing, engineering modeling and simulation, and big data analytics have in common? They’re all bandwidth-hungry applications with complex data workloads. High-performance computing (HPC) systems deliver the parallel processing capabilities to generate detailed and valuable insights from these applications.
