The Intel Foundry Ecosystem Explained

The Intel Foundry Ecosystem Explained
by Daniel Nenni on 02-15-2022 at 5:00 am

Intel Tower Semiconductor Acquisition

Exciting times for the semiconductor industry! Last week Intel announced a billion dollar fund to build a foundry ecosystem and today Intel announced they are acquiring foundry Tower Semiconductor for $5.6 billion dollars, WOW! Some people doubted Intel’s commitment to the foundry market this time. I think we can now put that… Read More


The Semiconductor Ecosystem Explained

The Semiconductor Ecosystem Explained
by Steve Blank on 02-06-2022 at 6:00 am

TSMC Ecosystem Explained

The last year has seen a ton written about the semiconductor industry: chip shortages, the CHIPS Act, our dependence on Taiwan and TSMC, China, etc.

But despite all this talk about chips and semiconductors, few understand how the industry is structured. I’ve found the best way to understand something complicated is to diagram… Read More


Why It’s Critical to Design in Security Early to Protect Automotive Systems from Hackers

Why It’s Critical to Design in Security Early to Protect Automotive Systems from Hackers
by Mike Borza on 02-03-2022 at 6:00 am

Figure 2 Automotive Security Diagram

Remember when a pair of ethical hackers remotely took over a Jeep Cherokee as it was being driven on a highway near downtown St. Louis back in 2015? The back story is, those “hackers,” security researchers Charlie Miller and Chris Valasek, approached vehicle manufacturers several years before their high-profile feat, warning… Read More


Upcoming Webinar: 3DIC Design from Concept to Silicon

Upcoming Webinar: 3DIC Design from Concept to Silicon
by Kalar Rajendiran on 01-26-2022 at 10:00 am

Lessons from Existing Multi Die Solutions

Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression.  Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More


Identity and Data Encryption for PCIe and CXL Security

Identity and Data Encryption for PCIe and CXL Security
by Tom Simon on 01-07-2022 at 6:00 am

Security for Cloud Applications

Privacy and security have always been a concern when it comes to computing. In prior decades for most people this meant protecting passwords and locking your computer. However, today more and more users are storing sensitive data in the cloud, where it needs to be protected at rest and while in motion. In a Synopsys webinar Dana Neustadter,… Read More


Heterogeneous Integration – A Cost Analysis

Heterogeneous Integration – A Cost Analysis
by Tom Dillinger on 12-29-2021 at 10:00 am

cost comparison

Heterogeneous integration (HI) is a general term used to represent the diverse possibilities for die technology incorporated into advanced 2.5D/3D packaging.  At the recent International Electron Devices Meeting (IEDM) in San Francisco, a team from Synopsys and IC Knowledge presented data from analyses of future potential… Read More


Delivering Systemic Innovation to Power the Era of SysMoore

Delivering Systemic Innovation to Power the Era of SysMoore
by Kalar Rajendiran on 12-28-2021 at 6:00 am

Evolving Landscape

With the slowing down of Moore’s law , the industry as a whole has been working on various ways to maintain the rate of growth and advancements. A lot has been written up about various solutions being pursued to address specific aspects. The current era is being referred to by different names, SysMoore being one that Synopsys uses.… Read More


Is Ansys Reviving the Collaborative Business Model in EDA?

Is Ansys Reviving the Collaborative Business Model in EDA?
by Daniel Nenni on 12-16-2021 at 10:00 am

Evolution of Multiphysics Complexity

The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More


Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum

Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum
by Tom Simon on 12-09-2021 at 10:00 am

Ajei Gopal talks about 3D IC

System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development.  Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More


Webinar: The Backstory of PCIe 6.0 for HPC, From IP to Interconnect

Webinar: The Backstory of PCIe 6.0 for HPC, From IP to Interconnect
by Mike Gianfagna on 12-01-2021 at 8:00 am

The Backstory of PCIe 6.0 for HPC From IP to Interconnect

PCIe, or peripheral component interconnect express, is a very popular high-speed serial computer expansion bus standard. The width and speed the standard supports essentially defines the throughput for high-performance computing (HPC) applications.  The newest version, PCIe 6.0 promises to double the bandwidth that the… Read More