Building a better mousetrap plays a key role in achieving market success in any industry. Of course, building one requires differentiating the product from the others already in the market. A differentiated product can even lead to creating demand for new products in adjacent markets. All of this is great but how do you implement… Read More
Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so they behave as a single device. The new Tessent Multi-die software delivers comprehensive automation for the highly complex DFT tasks associated with these 2.5D and 3D IC designs.