Multi-chip modules are now more important than ever, even though the basic concept has been around for decades. With The effects of Moore’s Law and other factors such as yield, power, and process choices, reasons for dividing what once would have been a single SOC into multiple die and integrating them in a single module have become… Read More
When you think of the Defense Advanced Research Projects Agency (DARPA), this first thing that comes to mind is the development of the internet. And indeed, if you look at their website’s historic timeline, the development of ARPANET, as it was known at the time, is shown prominently in 1969. Incidentally, I actually used one of … Read More
Increasingly complex heterogeneous packaging solutions have proved essential to meeting the rapidly scaling requirements for automotive electronics. Perhaps there is no better example of this than advanced driver-assistance systems (ADAS) that are found in most new cars. In a recent paper published by Siemens EDA, they … Read More
Humans certainly have always had an aesthetic preference for symmetry. We also see symmetry showing up frequently in nature. The importance of symmetry in electronic designs has been apparent for decades. There are a host of analog structures that require balanced layout. For instance, these include differential pairs and … Read More
Glitches on clock domain crossing signals have always been a concern for chip designers. Now with increased requirements for reliability, renewed scrutiny is being given to find ways to identify these problems and fix them. In particular applications such as automotive electronics have given this added effort an impetus. Siemens… Read More
Silicon photonics is getting a lot of interest because it can be used in many applications to improve bandwidth, reduce power and provide novel new functionality. It is especially interesting because it offers an ability to combine electronics and optical elements into the same die. Though it is fabricated with familiar silicon… Read More
SoC integration offers huge benefits through reduced chip count in finished systems, higher performance, improved reliability, etc. A single die can contain billions of transistors, with multiple processors and countless subsystems all working together. The result of this has been rapid growth of semiconductor content … Read More
Pressing demands on compute speeds, storage capacity and rapid access to data are not new to the semiconductor industry. A desire for access to on-demand computing resources have always been there. During pre-cloud-computing era, companies provisioned on-demand compute capacity by procuring high performance computing … Read More
Although electronic systems design as a discipline has been around ever since electronics systems came into existence (and that was many decades ago), the design complexities involved and the demands and constraints placed on the systems have multiplied significantly since then. Recent research by LifeCycle Insights shows… Read More
UPF was created to go beyond what HDL can do for managing on-chip power. HDLs are agnostic when it comes to dealing with supply & ground connections, power domains, level shifters, retention and other power management related elements of SoCs. UPF fills the breach allowing designers to specify in detail what parts of the design… Read More
