While the leap from traditional SoC/IC designs to Three-Dimensional Integrated Circuits (3DICs) designs brings new benefits and opportunities, it also introduces new challenges. The benefits include performance, power efficiency, footprint reduction and cost savings. The challenges span design, verification, thermal… Read More
One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to partition semiconductor designs and seamlessly integrate silicon Intellectual Property (IP) at the most suitable process nodes and processes. This strategic partitioning yields… Read More
If you have anything to do with the semiconductor industry, you already know that one of the hottest areas for both manufacturing and EDA are systems designed with advanced packaging, basically putting more than one die (aka chiplets) in the same package.
When 3D packaging was first introduced, there were not really any effective… Read More
You are probably familiar with the acronym PPA, which stands for Power/Performance/Area. Sometimes it is PPAC, where C is for cost, since there is more to cost than just area. For example, did you know that adding an additional metal layer to a chip dramatically increases the cost, sometimes by millions of dollars? It requires a … Read More
Advanced process nodes create challenges for EDA both in handling ever larger designs and increasing design process complexity.
Shift-left design methodologies for design cycle time compression are one response to this. And this has also forced some rethinking about how to build and optimize design tools and flows.
SemiWiki… Read More
Dan is joined by a panel of experts to discuss chiplets and 2.5/3D design. The panelists are: Saif Alam – Vice President of Engineering at Movellus Inc., Tony Mastroianni Siemens EDA- Advanced Packaging Solutions Director and Craig Bishop – CTO Deca Technologies.
In this spirited and informative discussion the … Read More
My recent article, ‘Chip War without Soldiers’ explained the importance of upskilling and preparing the chip design workforce in this current scenario, and it also explained how it will lead to ‘Fabs without Chips’ if we don’t prioritize it. VLSI Engineers are the pillars of the semiconductor industry, and they can only transform… Read More
In the world of electronic systems design, complexity has always been a major challenge. As technology advances and demands for more efficient and powerful electronic devices grow, engineers face increasingly intricate design requirements. These complexities often lead to longer design cycles, increased costs, … Read More
Siemens EDA’s next move in its Calibre shift left strategy is the addition of correct-by-construction IC layout optimization for the most critical emerging physical design challenges. Calibre’s new DesignEnhancer product supports both custom and digital ICs and is already in use by several leading IC design companies. It … Read More
Next generation electronic systems require an engineering approach incorporating a digital twin methodology for early verification with digital prototypes. Over the course of a design project, the digital twin model evolves to allow more complex interactions including analysis, simulations and validations earlier… Read More
