Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!

Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!
by Daniel Nenni on 01-29-2012 at 4:00 pm

The ASIC business is getting more and more complicated. The ability to produce innovative die at a competitive price to solve increasingly complex problems just isn’t enough. The technology required to package that die is now front and center.

Here, at the junction of advanced design, process technology and state-of-the art … Read More


The Semiconductor Landscape In A Few Years?

The Semiconductor Landscape In A Few Years?
by Daniel Nenni on 01-25-2012 at 9:48 am

Looking at the huge gap between the revenue of semiconductor design and manufacturing (~$300B) and that of EDA tools, services and silicon IP combined (~6B) inspired me to look more deeply into the overall arena of semiconductors in today’s context and possibly decipher some trends which should emerge in near future. Although… Read More


Advanced Memory Cell Characterization with Calibre xACT 3D

Advanced Memory Cell Characterization with Calibre xACT 3D
by SStalnaker on 01-12-2012 at 7:18 pm

Advanced process technologies for manufacturing computer chips enable more functionality, higher performance, and low power through smaller sizes. Memory bits on a chip are predicted to double every two years to keep up with the demand for increased performance.

To meet these new requirements for performance and power, memory… Read More


HiFi audio…in all the devices

HiFi audio…in all the devices
by Paul McLellan on 01-09-2012 at 6:00 am

The big challenge with audio is that there are so many standards. Some of this is for historical reasons since audio for mobile (such as mp3), for the home (Dolby 5.1) and for cell-phone voice encoding/decoding have all had very different requirements, different standard setters and so on. But gradually everything is coming together.… Read More


Semiconductor IP Dilemma?

Semiconductor IP Dilemma?
by Daniel Nenni on 01-01-2012 at 3:00 pm

Just how many hands have touched your SoC design by the time it goes to manufacturing? Clearly the more hands that touch it, the more complex the design is, making it more difficult to meet your product requirements. The commercial semiconductor IP dilemma is that not only are you using the same IP as your competitors, you are exponentially… Read More


T’is the season for…semiconductor forecasts

T’is the season for…semiconductor forecasts
by Paul McLellan on 12-20-2011 at 3:10 pm

T’is the season to be jolly…and to predict the next year’s semiconductor market.

KPMG does a regular survey of senior executives in semiconductor companies to get their outlook on the year ahead. The message this year is mixed. 41% of executives expected their business to grow by more than 5% next year, which sounds not too bad until… Read More


Why AMD is Up Q4, While Intel is Down

Why AMD is Up Q4, While Intel is Down
by Ed McKernan on 12-19-2011 at 5:45 pm

Immediately following Intel’s announcement that they expected Q4 revenue to come up short by $1B, Rory Read the new CEO of AMD, countered that they were on track to meet their original guidance (see article). Furthermore, “In 1Q and 2Q, maybe you see some manifestations, but I wouldn’t bet against the supply chain,”… Read More


IC capacity utilization declined in 3Q 2011

IC capacity utilization declined in 3Q 2011
by Bill Jewell on 12-14-2011 at 11:54 pm

SICAS (Semiconductor Industry Capacity Statistics) has released its 3Q 2011 data, available through the SIA at: SICAS data . Beginning with 2Q 2011 the SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United Microelectronics Corporation… Read More


iLVS: Improving LVS Usability at Advanced Nodes

iLVS: Improving LVS Usability at Advanced Nodes
by glforte on 12-13-2011 at 4:54 pm

LVS Challenges at Advanced Nodes

Accurate, comprehensive device recognition, connectivity extraction, netlist generation and, ultimately, circuit comparison becomes more complex with each new process generation. As the number of layers and layer derivations increases the complexity of devices, especially Layout Dependent… Read More