This is the first in a series of CEO interviews and I thought semiconductor IP would be a great place to start. Xerxes Wania is the President and CEO of Sidense, a leading developer of Non-Volatile Memory (NVM) One-Time Programmable (OTP) IP cores. Sidense has been a part of SemiWiki since 2013 so we know them quite well. I hope the rest… Read More
Tag: semiconductor
KLAM Kommentary – Assessing the political landscape of approval
LRCX & KLAC’s merger continues to be closely watched given the recent turns and reversals we have seen which call into question the ability to get the deal done. The deal was announced in October of 2015 and we are on our second request from the DOJ and the deal will almost certainly go beyond the Oct 20th, one year deadline… Read More
Market Trends Motivate a Shift-Left in Functional Verification
Today, in the context of functional verification, industry trends are based on the needs of prominent vertical markets. There is some overlap in what these markets need, but there are some use models that are very specific to each market.
We assert this because we have a lot of customers asking about emulation solutions not from … Read More
GlobalFoundries Roadmap Update 2016!
I attended a lunch yesterday with GlobalFoundries CEO Sanjay Jha (formerly of Qualcomm), SVP Gregg Barltlett (Motorola/GF), and CTO Gary Patton (IBM). Having followed GF from the very beginning I can tell you without a shadow of a doubt that GF has transformed from a collection of companies (AMD, Chartered, IBM) to a fully integrated… Read More
A new world of 10nm design constraints
Every time the industry transitions to a smaller process node IC design software undergoes extensive updates.
I talked to a couple of experts in physical design at Mentor Graphics about what is involved in making place-and-route software ready for a new node. This is what I learned from Sudhakar Jilla, the IC design marketing director… Read More
Further delays in KLAM deal not a good omen
Deal likely getting worse as time & remedies go by…
Just a couple of short weeks ago on the earnings conference call, Lam management was adamant about the KLAM deal getting done and done by the Oct 20th deadline. Martin Anstice, the CEO , went to great lengths to tell us that the deal was under control, was going to happen, … Read More
STT-MRAM – Coming soon to an SoC near you
An increasing percentage of SoC die area is being allocated to memory arrays, as applications require more data/instruction storage and boot firmware. Indeed, foundries invest considerable R&D resources into optimizing their array technology IP offerings, often with more aggressive device features than used for other… Read More
CEO Insight: Transformation of Vayavya Labs into System Design Automation
With the advent of SoCs, design abstractions and verification has moved up at the system level. It’s imperative that EDA moves up the value chain to start design automation at system level. The System Design Automation will be the new face of EDA in coming years.… Read More
Analysis of Cypress Semiconductor acquisition of Broadcom wireless IoT assets
Cypress Semiconductor announced that it will acquire Broadcom’s wireless Internet of Things (IoT) business in a $550 million deal. The deal was announced on Thursday, April 28, at the same time it announced that T.J. Rodgers will step down as CEO. The deal transfers Broadcom’s Bluetooth, Wi-Fi and Zigbee product… Read More
Why is NXP Moving to FD-SOI?
The latest generations of power efficient and full-featured applications processors in NXP’s very successful and broadly deployed i.MX platform are being manufactured on 28nm FD-SOI. The new i.MX 7 series leverages the 32-bit ARM v7-A core, targeting the general embedded, e-reader, medical, wearable and IoT markets, where… Read More