The odds of deal completion has fallen to low levels. Whats the fallout on the companies and stocks? Is there life after a failed merger?
“A quagmire wrapped up inside an enigma” – LRCX & KLAC’s merger is the talk of the town, both in the semiconductor equipment industry as well as DOJ watchers in Washington… Read More
On September 8, 2016 GLOBALFOUNDRIES (GF) announced their 12nm FDSOI technology node. On September 12th I had a chance to interview Greg Bartlett, GF Senior Vice President for the CMOS Business Unit (as a side note, GF has: RF SOI, ASIC and CMOS business units).… Read More
This is the first in a series of CEO interviews and I thought semiconductor IP would be a great place to start. Xerxes Wania is the President and CEO of Sidense, a leading developer of Non-Volatile Memory (NVM) One-Time Programmable (OTP) IP cores. Sidense has been a part of SemiWiki since 2013 so we know them quite well. I hope the rest… Read More
LRCX & KLAC’s merger continues to be closely watched given the recent turns and reversals we have seen which call into question the ability to get the deal done. The deal was announced in October of 2015 and we are on our second request from the DOJ and the deal will almost certainly go beyond the Oct 20th, one year deadline… Read More
Today, in the context of functional verification, industry trends are based on the needs of prominent vertical markets. There is some overlap in what these markets need, but there are some use models that are very specific to each market.
We assert this because we have a lot of customers asking about emulation solutions not from … Read More
I attended a lunch yesterday with GlobalFoundries CEO Sanjay Jha (formerly of Qualcomm), SVP Gregg Barltlett (Motorola/GF), and CTO Gary Patton (IBM). Having followed GF from the very beginning I can tell you without a shadow of a doubt that GF has transformed from a collection of companies (AMD, Chartered, IBM) to a fully integrated… Read More
Every time the industry transitions to a smaller process node IC design software undergoes extensive updates.
I talked to a couple of experts in physical design at Mentor Graphics about what is involved in making place-and-route software ready for a new node. This is what I learned from Sudhakar Jilla, the IC design marketing director… Read More
Deal likely getting worse as time & remedies go by…
Just a couple of short weeks ago on the earnings conference call, Lam management was adamant about the KLAM deal getting done and done by the Oct 20th deadline. Martin Anstice, the CEO , went to great lengths to tell us that the deal was under control, was going to happen, … Read More
An increasing percentage of SoC die area is being allocated to memory arrays, as applications require more data/instruction storage and boot firmware. Indeed, foundries invest considerable R&D resources into optimizing their array technology IP offerings, often with more aggressive device features than used for other… Read More
With the advent of SoCs, design abstractions and verification has moved up at the system level. It’s imperative that EDA moves up the value chain to start design automation at system level. The System Design Automation will be the new face of EDA in coming years.… Read More
