Semiconductor manufacturers are under constantly increasing and intense pressure to accelerate innovative new chip designs to market faster than ever in smaller package sizes while assuring signal integrity and reducing power consumption. Three-dimensional integrated circuits (3D-ICs) promise to answer all these demands… Read More
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC… Read More
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC… Read More
Designers require comprehensive logical, physical, and electrical models to interpret the results of full-chip power noise and electromigration analysis flows, and subsequently deduce the appropriate design updates to address any analysis issues. These models include: LEF, DEF, Liberty library models (including detailed… Read More
While it’s interesting to hear a tool-vendor’s point of view on the capabilities of their product, it’s always more compelling to hear a customer/user point of view, especially when that customer is NVIDIA, a company known for making monster chips.
A quick recap on the concept. At 7nm, operating voltages are getting much closer… Read More
I’ve written before about how Ansys applies big data analytics and elastic compute in support of power integrity and other types of analysis. A good example of the need follows this reasoning: Advanced designs today require advanced semiconductor processes – 16nm and below. Designs at these processes run at low voltages, much… Read More
A year ago, I wrote about Ansys’ intro of Big Data methods into the world of power integrity analysis. The motivation behind this advance was introduced in another blog, questioning how far margin-based approaches to complex multi-dimensional analyses could go. An accurate analysis of power integrity in a complex chip should… Read More
