2.5D and 3D designs

2.5D and 3D designs
by Paul McLellan on 09-07-2011 at 1:54 pm

Going up! Power and performance issues, along with manufacturing yield issues, limit how much bigger chips can get in two dimensions. That, and the fact that you can’t manufacture two different processes on the same wafer, mean that we are going up into the third dimension.

The simplest way is what is called package-in-package… Read More


20nm SoC Design

20nm SoC Design
by Paul McLellan on 08-25-2011 at 12:48 am

There are a large number of challenges at 20nm that didn’t exist at 45nm or even 32nm.

The biggest issues are in the lithography area. Until now it has been possible to make a reticle using advanced reticle enhacement technology (RET) decoration and have it print. Amazing when you think that at 45nm we are making 45nm features… Read More


Top 5 Reasons for Wasting Power

Top 5 Reasons for Wasting Power
by Paul McLellan on 08-19-2011 at 2:27 pm

Traditionally, David Letterman style, we should really have the top 10 reasons for wasting power in semiconductor design, but here are the five big ones.

Starting with reason #5: Lack of a power gating strategy
Leakage power is a huge proportion of total power and the only way to save leakage power (apart from low leakage cells when… Read More


ANSYS/Apache

ANSYS/Apache
by Paul McLellan on 08-13-2011 at 2:43 pm

Last week I met with Andrew Yang, erstwhile CEO of Apache Design Systems and now formally President of Apache Design Inc, a wholly owned subsidiary of ANSYS. The merger formally closed at the start of the month. Within ANSYS Apache is positioned as Chip-aware System-level Engineering Simulation. ANSYS is pretty much completely… Read More


Totem webinar: Analog/Mixed-Signal Power Noise and Reliability

Totem webinar: Analog/Mixed-Signal Power Noise and Reliability
by Paul McLellan on 07-30-2011 at 5:26 pm

The Totem webinar will be at 11am on Tuesday 2nd August. This session will be conducted by Karan Sahni, Senior Applications Engineer at Apache Design Solutions. Karan has been with Apache since 2008, supporting the Redhawk, Totem, Sentinel product lines. He received his MS in Electrical Engineering from the Syracuse University… Read More


Low Power Webinar Series

Low Power Webinar Series
by Paul McLellan on 07-08-2011 at 4:57 pm

At DAC 2011 in San Diego, Apache gave many product presentations. Of course not everyone could make DAC or could make all the presentations in which they were interested. So from mid-July until mid-August these presentations will be given as webinars. Details, and links for registration, are here on the Apache website.

The seminars… Read More


ARM vs Intel…Performance? Power? OS support? Or ubiquity?

ARM vs Intel…Performance? Power? OS support? Or ubiquity?
by Eric Esteve on 03-22-2011 at 2:18 pm

This blog was posted 10 months ago, and the comments have made it much more interesting! Don’t miss the various comments at the back. Also feel free to let us know if you think the status, in this ARM vs Intel “war” has changed a lot since March 2011. Do you really think Intel has catch up with ARM in the mobile industry?Read More