In the fast-evolving world of semiconductor design, creating a complex System-on-Chip (SoC) requires meticulous planning to ensure performance, power efficiency, and cost-effectiveness. Aion Silicon’s white paper, authored by Piyush Singh, outlines a streamlined methodology that leverages advanced modeling… Read More
By Andy Nightingale, VP of Product Management and Marketing
As AI adoption accelerates across markets, including automotive ADAS, large-scale compute, multimedia, and edge intelligence, the foundations of system-on-chip (SoC) designs are being pushed harder than ever. Modern AI engines generate tightly coordinated, … Read More
The explosive growth of AI and accelerated computing is placing unprecedented demands on system-on-chip (SoC) design. Modern AI workloads require extremely high bandwidth, ultra-low latency, and energy-efficient data movement across increasingly heterogeneous architectures. As SoCs scale to incorporate clusters of… Read More
IP-XACT, defined by IEEE 1685, is a standard that pulls together IP packaging, integration, and reuse. For anyone building modern SoCs (Systems on Chip), IP-XACT isn’t just another XML schema: it is a productivity multiplier and a risk-reduction tool that brings order to your electronic system design.
What is IP-XACT?
IP-XACT… Read More
In chiplet-based design we continue the march of Moore’s Law by scaling what we can put in a semiconductor package beyond the boundaries of what we can build on a single die. This style is already gaining traction in AI applications, high performance computing, and automotive, each of which aims to scale out to highly integrated … Read More
I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More
Modern semiconductor devices, a far cry from the chips we once knew, are now highly complex intelligent systems used in datacenters, communications infrastructure, in consumer electronics, automotive, home and office automation, almost everywhere. All such applications build around large subsystems, invariably compute,… Read More
A Network-on-Chip (NoC) IP addresses the challenges of interconnect complexity in SoCs by significantly reducing wiring congestion and providing a scalable architecture. It allows for efficient communication among numerous initiators and targets with minimal latency and high speed. A NoC facilitates design changes, enabling… Read More
Automotive designs demand a high level of fault tolerance, and one of the methods to achieve this is to use error correcting codes (ECC). This Wikipedia page ECC Memory gives a flavor, though that article concentrates on memory and we are interested in wider applications using a form of forward error correction. This technique … Read More
The difficulty of SoC integration is clearly getting more demanding. Driven by process node density, multi-chip integration and seemingly never-ending demands for more performance at lower power, the hurdles continue to increase. When you consider these challenges in the context of Arteris, it’s natural to think about hardware… Read More
