3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More
Webinar: Multiphysics Simulation in Semiconductor Packaging
Semiconductor packaging is a critical step in the development of modern electronic devices, influencing their performance, reliability, and thermal management. The complexity of packaging technologies has grown significantly with the demand for miniaturization, higher power densities, and improved mechanical and thermal… Read More