At NVIDIA’s recent GTC conference, a Cadence-NVIDIA joint session provided insights into how AI-powered innovation is reshaping the future of data center infrastructure. Led by Kourosh Nemati, Senior Data Center Cooling and Infrastructure Engineer from NVIDIA and Sherman Ikemoto, Sales Development Group Director from … Read More
Tag: multiphysics
Webinar: Multiphysics Simulation in Semiconductor Packaging
Semiconductor packaging is a critical step in the development of modern electronic devices, influencing their performance, reliability, and thermal management. The complexity of packaging technologies has grown significantly with the demand for miniaturization, higher power densities, and improved mechanical and thermal… Read More
Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration
Memory access speeds are a performance bottleneck in today’s high- speed AI and HPC semiconductor designs. High Bandwidth Memory (HBM) in a 3D heterogeneous integrated (3DHI) system is the optimal solution to break through this “memory wall.” It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications.
ML and Multiphysics Corral 3D and HBM
3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More
Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals
The great things about CEO keynotes, at least from larger companies, is that you not only learn about recent advances but you also get a sense of the underlying algorithm for growth. Particularly reinforced when followed by discussions with high profile partner CEOs on their directions and areas of common interest. I saw this recently… Read More
Unleash the Power: NVIDIA GPUs, Ansys Simulation
In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.
Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More
Cadence Debuts Celsius Studio for In-Design Thermal Optimization
Continuing the multiphysics theme, I talked recently with Melika Roshandell (Product Management Director at Cadence) on the continuing convergence between MCAD and ECAD. You should know first that Melika has a PhD in mechanical engineering and an extensive background in thermal engineering at Broadcom and Qualcomm, all very… Read More
Cadence Claims the CFD High Ground with a New GPU-Based Accelerator
For observers of EDA markets there is an easily overlooked opportunity for new growth. Today around 50% of EDA revenues come from systems rather than semiconductor companies, from datacenters to automotive, aerospace, energy, and others. In most of these industries total system design depends as much on mechanical and other… Read More
Keynote Speakers Announced for IDEAS 2023 Digital Forum
As we all know, hearing directly from the people who actually use EDA tools, people who are solving real world problems with the latest technologies are the best source of information. Thus EDA User group meetings are always first on my event list every year which brings us to Ansys Ideas.
Ansys User Group Meeting Features Technical
… Read MoreChiplet Q&A with John Lee of Ansys
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More