Tag: multiphysics

Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration

Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration
by Admin on 01-14-2025 at 3:31 am

Memory access speeds are a performance bottleneck in today’s high- speed AI and HPC semiconductor designs. High Bandwidth Memory (HBM) in a 3D heterogeneous integrated (3DHI) system is the optimal solution to break through this “memory wall.” It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications.

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ML and Multiphysics Corral 3D and HBM

ML and Multiphysics Corral 3D and HBM
by Bernard Murphy on 01-07-2025 at 6:00 am
Categories: 3D IC, AI, Ansys, Inc., Chiplet, EDA

multidie and HBM stacks min

3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More

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Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals

Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals
by Bernard Murphy on 05-01-2024 at 6:00 am
Categories: AI, Automotive, Cadence, Chiplet, EDA

Anirudh keynote at CadenceLive 2024

The great things about CEO keynotes, at least from larger companies, is that you not only learn about recent advances but you also get a sense of the underlying algorithm for growth. Particularly reinforced when followed by discussions with high profile partner CEOs on their directions and areas of common interest. I saw this recently… Read More

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Unleash the Power: NVIDIA GPUs, Ansys Simulation

Unleash the Power: NVIDIA GPUs, Ansys Simulation
by Daniel Nenni on 03-19-2024 at 10:00 am
Categories: Ansys, Inc., Chiplet, EDA, Events

Electromagnatic PerceiveEM

In the realm of engineering simulations, the demand for faster, more accurate solutions to complex multiphysics challenges is ever-growing.

Simulation is a vital tool for engineers to design, test, and optimize complex systems and products. It helps engineers reduce costs, improve quality, and accelerate innovation. However,… Read More

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Cadence Debuts Celsius Studio for In-Design Thermal Optimization

Cadence Debuts Celsius Studio for In-Design Thermal Optimization
by Bernard Murphy on 02-21-2024 at 6:00 am
Categories: AI, Cadence, Chiplet, EDA

Celsius Studio min

Continuing the multiphysics theme, I talked recently with Melika Roshandell (Product Management Director at Cadence) on the continuing convergence between MCAD and ECAD. You should know first that Melika has a PhD in mechanical engineering and an extensive background in thermal engineering at Broadcom and Qualcomm, all very… Read More

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Cadence Claims the CFD High Ground with a New GPU-Based Accelerator

Cadence Claims the CFD High Ground with a New GPU-Based Accelerator
by Bernard Murphy on 02-01-2024 at 6:00 am
Categories: AI, Automotive, Cadence, EDA

J24135 Millennium Press Image 400x400 min

For observers of EDA markets there is an easily overlooked opportunity for new growth. Today around 50% of EDA revenues come from systems rather than semiconductor companies, from datacenters to automotive, aerospace, energy, and others. In most of these industries total system design depends as much on mechanical and other… Read More

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Keynote Speakers Announced for IDEAS 2023 Digital Forum

Keynote Speakers Announced for IDEAS 2023 Digital Forum
by Daniel Nenni on 10-26-2023 at 10:00 am
Categories: Ansys, Inc., EDA, Events

ideas 400X400

As we all know, hearing directly from the people who actually use EDA tools, people who are solving real world problems with the latest technologies are the best source of information. Thus EDA User group meetings are always first on my event list every year which brings us to Ansys Ideas.

Ansys User Group Meeting Features Technical

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Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am
Categories: Ansys, Inc., Chiplet, EDA, Events, Synopsys

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More

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A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am
Categories: Ansys, Inc., Chiplet, EDA

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More

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Optical I/O Solutions for Next-Generation Computing Systems

Optical I/O Solutions for Next-Generation Computing Systems
by Tom Simon on 10-28-2021 at 10:00 am
Categories: Ansys, Inc., Chiplet, EDA

Multiphysics design

According to DARPA the fraction of total power consumed in semiconductors for I/O purposes as been growing rapidly and is creating an I/O power bottleneck. It has reached the point where it needs to be addressed with new technologies and approaches. Interestingly, while the energy density, as measured by pJ/bit for short reach… Read More