Join us in this webinar to discover all the new features in Ansys Rocky in the 2023 R2 release, which includes new SPH, improved GPU algorithms, and multiphysics coupling with other Ansys products.
TIME:
SEPTEMBER 21, 2023
11 AM EDT
Venue:
Virtual
Join us in this webinar to discover all the new features in Ansys
The new optiSLang 2023 R2 release adds new user Interface capabilities making it easier to integrate multiphysics workflows for the typical use cases and provide more flexibility and openness for advanced scripting and customization purposes.
TIME:
SEPTEMBER 19, 2023
11 AM EDT / 4 PM GMT / 8:30 PM IST
Venue:
Virtual
See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations to other Ansys simulators to enhance designer modeling and simulation of electronics products from a multiphysics standpoint.
The new optiSLang 2023 R2 release adds new user Interface capabilities making it easier to integrate multiphysics workflows for the typical use cases and provide more flexibility and openness for advanced scripting and customization purposes.
TIME:
SEPTEMBER 5, 2023
11 AM EDT / 4 PM GMT / 8:30 PM IST
Venue:
Virtual
Join us for an in-depth exploration of the Ansys Lumerical Suite of tools for optoelectronic and photonic simulations of MicroLED devices during this upcoming webinar.
Time:
June 20, 2023
Venue:
Virtual
MicroLED technology is revolutionizing how we think about displays and lighting, offering promising
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
With… Read More
Whether the application is Automotive, 5G, Industrial, Energy, IoT, Medical, FA&D, or Consumer Goods, the chances are high that a printed circuit board will be involved. Increases in the electrification of modern systems will include electronic sensors, wireless connectivity, power conversion, or data handling system… Read More
The food and packaging industry faces numerous challenges. Companies need to maintain a competitive edge, continuously innovate to meet consumer demands, and ensure high product quality, while maintaining cost efficiency.… Read More
Electrification brings new challenges for Motor designers. More efficient, compact, high torques density, low noise designs are required to work with complex powertrain and control systems.
In this webinar, you learn how to set up an end-to-end Multiphysics motor design process in Siemens Simcenter and efficiently optimise… Read More
