If an Intel 10nm transistor fell in the ARM forest

If an Intel 10nm transistor fell in the ARM forest
by Don Dingee on 08-18-2016 at 4:00 pm

Intel’s news at IDF this week about partnering with ARM for foundry services on 10nm set off some wild speculation. It’s not a surprise that ARM would enable Intel – they’ve worked together before, ARM is an equal opportunity ecosystem partner, and ARM has publicly announced 10nm cores taped out at TSMC.… Read More


Linley Mobile and Wearable Conference Drills into Rapidly Evolving Markets

Linley Mobile and Wearable Conference Drills into Rapidly Evolving Markets
by Tom Simon on 08-04-2016 at 7:00 am

Last week the Linley conference on mobile and wearables started with an overview and keynote address by the event’s namesake Linley Gwennap. His talk offered a few surprises and was informative all around. As you have seen recently reported here on SemiWiki, he sees smartphone shipments continuing to rise, but with a declining… Read More


Filling out the rest of the mobile device

Filling out the rest of the mobile device
by Don Dingee on 08-01-2016 at 4:00 pm

We spend an inordinate amount of energy tracking the big chip – the application processor – in a mobile device. As we’ve seen this space is coming down to a handful of players. A more interesting competition is heating up around the APU for the rest of chips needed to make a phone.… Read More


Brexit and Semiconductors

Brexit and Semiconductors
by Daniel Nenni on 07-01-2016 at 7:00 am

Interesting news last week with 51.9% of British voters saying yes to Brexit (exiting the European Union). What does it have to do with semiconductors? Plenty! After reading the media’s take on the subject and talking to friends (experts) in China, Taiwan, and Hong Kong, I must say that there is not a consensus to be found and there… Read More


How Microsoft Could Become A Mobile Player

How Microsoft Could Become A Mobile Player
by Patrick Moorhead on 05-26-2016 at 4:00 pm

Microsoft BUILD is the company’s annual developer conference where they communicate their latest strategies and deliverables to developers and launch many new innovations. BUILD is extremely developer- focused and is intended to inform current Microsoft developers as well as recruit more developers to develop for Microsoft… Read More


ARM tests out TSMC 10FinFET – with two cores

ARM tests out TSMC 10FinFET – with two cores
by Don Dingee on 05-25-2016 at 4:00 pm

About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More


The Xiaomi Redmi Note 3 Significantly Improves Performance

The Xiaomi Redmi Note 3 Significantly Improves Performance
by Patrick Moorhead on 05-18-2016 at 12:00 pm

The smartphone market has been experiencing many changes, some of those changes have included the slowing of the overall pace of growth. One of the remaining growth segments of the smartphone market right now remains the mid-range which is priced around $200. These phones have traditionally been ignored by the big players in the… Read More


Analysis of Cypress Semiconductor acquisition of Broadcom wireless IoT assets

Analysis of Cypress Semiconductor acquisition of Broadcom wireless IoT assets
by Dale Ford on 05-10-2016 at 4:00 pm

Cypress Semiconductor announced that it will acquire Broadcom’s wireless Internet of Things (IoT) business in a $550 million deal. The deal was announced on Thursday, April 28, at the same time it announced that T.J. Rodgers will step down as CEO. The deal transfers Broadcom’s Bluetooth, Wi-Fi and Zigbee product… Read More


The Future of Wearable Tech

The Future of Wearable Tech
by Raj Kosaraju on 05-09-2016 at 7:00 am

Today, the wearable device market is a nascent, but growing one. There are about 160 unique wearable devices on the market, and IDTechEx predicts wearables will grow to a $70 billion market in the next ten years. The future of wearables, which includes activity trackers, smartwatches, smartglasses and embedded sensors in clothing,… Read More


2.5D supply chain takes HBM over the wall

2.5D supply chain takes HBM over the wall
by Don Dingee on 04-11-2016 at 4:00 pm

SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More