Mastering the Magic of Multi-Patterning

Mastering the Magic of Multi-Patterning
by Daniel Payne on 01-03-2014 at 7:03 pm

I’ve been quite impressed that modern ICs use a lithography process with 193nm light sources to resolve final feature sizes at 20nm and smaller dimensions. We’ve been blogging about Double Patterning Technology (DPT) some 45 times in the past few years that enable 20nm fabrication, so one big question for me is, “How… Read More


Capturing Analog Design Intent with Verification

Capturing Analog Design Intent with Verification
by Daniel Payne on 12-08-2013 at 10:05 am

Analog IC designers are gradually adopting what digital IC designers have been doing for years, metric driven verification. When you talk with analog designers about their methodology and approach, you hear terms like artisan being used which implies mostly a manually-oriented methodology. Thanks to automation from EDA companies,… Read More


Bringing EDA to India

Bringing EDA to India
by Daniel Payne on 11-13-2013 at 1:00 pm

Why do all three big EDA companies have user group meetings in India? The answer is to grow the EDA market in India because so many multi-national companies have engineers in India doing SoC, and IP design work. In my 35 years of IC design and EDA experience I’ve had the pleasure of working with and knowing many engineers and managers… Read More


Social Media at Mentor Graphics

Social Media at Mentor Graphics
by Daniel Payne on 10-29-2013 at 5:52 pm

You can often tell how important blogging and social media is to an EDA company by how much effort it takes to find their blog from the Home page. For the folks at Mentor Graphics I’d say that blogging is quite important, because it shows up as a top-level menu item. Notice also how important Twitter is, their latest tweets show… Read More


Assertions verifying blocks to systems at Broadcom

Assertions verifying blocks to systems at Broadcom
by Don Dingee on 10-15-2013 at 6:00 pm

Speaking from experience, it is very difficult to get an OEM customer to talk about how they actually use standards and vendor products. A new white paper co-authored by Broadcom lends insight into how a variety of technologies combine in a flow from IP block simulation verification with assertions to complete SoC emulation with… Read More


A Hybrid Test Approach – Combining ATPG and BIST

A Hybrid Test Approach – Combining ATPG and BIST
by Daniel Payne on 09-09-2013 at 5:18 pm

In the world of IC testability we tend to look at various approaches as independent means to an end, namely high test coverage with the minimum amount of test time, minimum area impact, minimum timing impact, and acceptable power use. Automatic Test Pattern Generation (ATPG) is a software-based approach that can be applied to any… Read More


Scan the horizon, P1687 takes us higher

Scan the horizon, P1687 takes us higher
by Don Dingee on 07-31-2013 at 6:00 pm

The tech standards cycle almost always goes like this: Problems or limits develop with the existing way of doing things. Innovators attempt to engineer solutions, usually many of them. Chaos ensues when customers figure out nothing new works with anything else. Competitors sit down and agree on a specification where things work… Read More


A Goldmine of Tester Data

A Goldmine of Tester Data
by Beth Martin on 07-10-2013 at 2:06 pm

Yesterday at SEMICON West I attended an interesting talk about how to use the masses of die test data to improve silicon yield. The speaker was Dr. Martin Keim, from Mentor Graphics.


First of all, he pointed out that with advanced process nodes (45nm, 32nm, and 28nm), and new technologies like FinFETs, we get design-sensitive defects.… Read More