TechInsights has been in the semiconductor analysis business for more than 35 years and is THE most trusted source of semiconductor information. TechInsights started as a reverse engineering and IP analysis company but has grown into much more. I remember waiting for the teardown reports before buying electronics to make sure… Read More
When I do a root cause analysis of Intel’s problem it is very simple. If Intel wants to continue to be a leading-edge semiconductor manufacturer, they need to fill their fabs, all of their fabs. Clearly several things need to happen in order to do that but the one that most interests me is on the foundry side.
I think we can all agree that… Read More
One of the most enduring threads in the SemiWiki forum is What would you do if you are the Intel CEO? There are currently 128 responses and more than 45,000 views. It was originally posted March 13th, 2015, after Brain Krzanich was given the CEO position. A different time for sure but an interesting read and the responses keep on coming.… Read More
A response to Daniel Nenni’s “What’s Wrong with Intel?” article, which invited alternative views.
At the risk of calling down the forecast universal opprobrium, I’m going to disagree with Dan’s take on the centrality of Intel.
I don’t agree that Intel is too big/important to fail or that the US can’t succeed in semiconductors without… Read More
One of the most popular topics on the SemiWiki forum is Intel, which I understand. Many of us grew up with Intel, some of us have worked there, and I can say that the vast majority of us want Intel to succeed. The latest Intel PR debacle is the abrupt departure of CEO Pat Gelsinger. To me this confirms the answer to the question, “What is … Read More
Dan is joined by Dr. Tahir Ghani, Intel senior fellow and director of process pathfinding in Intel’s Technology Research Group. Tahir has a 30-year career at Intel working on many innovations, including strained silicon, high-K metal gate devices, FinFETs, RibbonFETs, and backside power delivery (BSPD), among others. He has… Read More
My first job out of college was migrating a DRAM chip from one process node to a newer node, and it was a 100% manual process that required many months of effort. That need to migrate semiconductor IP to newer nodes is still with us today, and much automation has been applied to digital circuits, however migrating analog IP has proven… Read More
Anyone who has read my articles about IEDM in the past know I consider it a premiere conference covering developments of leading-edge semiconductor process technology. The 2024 conference will take place in San Francisco from December 7th through 11th.
AI – Lots of artificial… Read More
The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More
Entering the exhibit area of DAC on the first floor I was immediately faced with the Keysight EDA booth, and it was even larger than either the Synopsys or Cadence booths. They had a complete schedule of partners presenting in their theatre that included: Microsoft Azure, Riscure, Fermi Labs, BAE Systems, Alphawave, Intel Foundry,… Read More
