Podcast EP169: How Are the Standards for the Terabit Era Defined?

Podcast EP169: How Are the Standards for the Terabit Era Defined?
by Daniel Nenni on 06-30-2023 at 10:00 am

Dan is joined by Priyank Shukla of Synopsys and Kent Lusted of Intel.

Priyank Shukla is a Sr. Staff Product Manager for the Synopsys High-Speed SerDes IP portfolio. He has broad experience in analog, mixed-signal design with strong focus on high performance compute, mobile and automotive SoCs.

Kent Lusted is a Principal Engineer… Read More


Intel Internal Foundry Model Webinar

Intel Internal Foundry Model Webinar
by Scotten Jones on 06-21-2023 at 12:00 pm

IAO Investor Webinar Slides to post on our INTC website PDF Page 07

Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.

On a humorous note, the person moderating the attendee questions sounded … Read More


The Updated Legacy of Intel CEOs

The Updated Legacy of Intel CEOs
by Daniel Nenni on 06-21-2023 at 10:00 am

Intel HQ 2023

(First published December 24, 2014)

A list of the best and worst CEOs in 2014 was recently published. The good news is that none of our semiconductor CEOs were on the worst list. The bad news is that none of our semiconductor CEOs were on the best list either. I will be writing about the CEOs that made our industry what it is today starting… Read More


VLSI Symposium – Intel PowerVia Technology

VLSI Symposium – Intel PowerVia Technology
by Scotten Jones on 06-12-2023 at 6:00 am

Slide4

At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.

Traditionally all interconnects have taken place on the front side of devices with signal and … Read More


ASML Wavering- Supports our Concern of Second Leg Down for Semis- False Bottom

ASML Wavering- Supports our Concern of Second Leg Down for Semis- False Bottom
by Robert Maire on 04-21-2023 at 8:00 am

Semiconductor False Bottom

-ASML weakness is evidence of deeper chip down cycle
-When ASML sneezes other chip equip makers catch a cold
-Will backlog last long enough? Will EUV demand hold up?
-“Unthinkable” event, litho cancelations, could shock industry

ASML has in line quarter but alarm bells ring on wavering outlook

ASML reported Euro6.7B… Read More


Chiplets, is now their time?

Chiplets, is now their time?
by Daniel Nenni on 03-31-2023 at 6:00 am

P3221015 cropped

Chiplets appeared on SemiWiki in 2020 and have been a top trending keyword ever since. The question is not IF chiplets will disrupt the semiconductor industry, the question is WHEN? I certainly have voiced my opinion on this (pro chiplet) but let’s hear it from the experts. There was a live panel recently sponsored by Silicon CatalystRead More


Gordon Moore’s legacy will live on through new paths & incarnations

Gordon Moore’s legacy will live on through new paths & incarnations
by Robert Maire on 03-25-2023 at 6:00 pm

Gordon Moore RIP

-Gordon Moore’s passing reminds us of how far we have come
-One of many pioneers of chip industry-but most remembered
-The most exponential & ubiquitous industry of all times
-“No exponential is forever”- Gordon Moore was an exponential

Remembering Gordon Moore

He will be remembered most for his observation… Read More


DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!

DesignCon 2023 Panel Photonics future: the vision, the challenge, and the path to infinity & beyond!
by Raha Vafaei on 02-28-2023 at 6:00 am

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The explosion in volume and consumption of data, fueled by industry trends in virtualization, networking, and computing among others, continues to push photonic solutions forward into leading positions. On Feb 2nd, I attended a panel by Ansys at DesignCon that brought together industry experts from Intel, GlobalFoundries,… Read More


IEDM 2023 – 2D Materials – Intel and TSMC

IEDM 2023 – 2D Materials – Intel and TSMC
by Scotten Jones on 02-20-2023 at 6:00 am

Slide1

Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More


PCIe 6.0: Challenges of Achieving 64GT/s with PAM4 in Lossy, HVM Channels

PCIe 6.0: Challenges of Achieving 64GT/s with PAM4 in Lossy, HVM Channels
by Kalar Rajendiran on 02-14-2023 at 6:00 am

Multi Level Challenges

As the premier high-speed communications and system design conference, DesignCon 2023 offered deep insights from various experts on a number of technical topics. In the area of high-speed communications, PCIe has a played a crucial role over the years in supporting increasingly higher communications speed with every new revision.… Read More