(Work email required for verified registration)
During a project, subsystem and full-chip integration plays a crucial role. Integration can be particularly challenging on large SoCs with distributed teams due to complexity of the integration process, multi-site infrastructure issues, as well as the need to collaborate … Read More
IEEE vTools Events is more than just a place to report past meeting activity. It is an event management tool that enables IEEE Sections, Subsections, Chapters, Affinity Groups and Student Branches to schedule, promote and report (L31) IEEE meetings and events.
vTools Events also offers event registration which, if setup, will… Read More
In today’s fast-paced manufacturing world, keeping up with changing customer demands is crucial.
Imagine a situation where your customer orders eco-friendly packaging and expects fast changes and top-notch quality. Can your processes handle this smoothly, or do they lead to manual work, higher costs, and slower operations?… Read More
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges… Read More
CEA-List and Menta SAS will present together the MOSAICS-LP project,
a scalable chiplet platform
REGISTER HERE… Read More
Over the last couple of decades, the electronics communications industry has been a significant driver behind the growth of the FPGA market and continues on. A major reason behind this is the many different high-speed interfaces built into FPGAs to support a variety of communications standards/protocols. The underlying input-output… Read More
November 16, 2022 | 9:00 AM PT | 12:00 PM ET | 6:00 PM CET
(A recording will be sent after the live event to all registrants)
The era of chiplets and heterogeneous integration is here. High-end performance packaging will be a $7.87 billion market by 2027, with a 19% CAGR.1
As the semiconductor industry adopts chiplets and heterogeneous… Read More
