All Things Semiconductor!
Small EDA companies often focus on a single point tool and then gradually over time they add new, complementary tools to start creating more of a sub-flow to help you get that next SoC project out on time. The most astute EDA companies often choose to partner with other like-minded companies to create tools that work together well,… Read More
Virtual prototyping has, inexplicably, been largely a DIY thing so far. Tools and models have come from different sources with different approaches, and it has been up to the software development team to do the integration step and cobble together a toolchain and methodology that fits with their development effort.
That integration… Read More
In the history of semiconductor design and manufacturing, the age-old concept of DRC rule-deck qualification for handshake between design and manufacturing still applies strongly to produce working silicon. In fact, DRC clean GDSII works as the de facto golden gate between a design and a foundry for manufacturing the chip for… Read More
Our previous Blue Pearl post looked at the breadth of contextual visualization capability in the GUI to speed up debug. Two other important aspects of the ASIC & FPGA pre-synthesis workflow are automating analysis with scripts and managing the stream of messages produced. Let’s look at these aspects… Read More
We’ve been saying for a while that it looks like there is a resurgence in design starts for ASICs targeting the IoT. A recent webinar featuring speakers from ARM and Open Silicon (and moderated by Daniel Nenni) affirms this trend, and provides some insight on how these designs may differ from typical microcontrollers.
One of my first… Read More
Since creating the landmark “all-you-can-eat” license with Samsung in 2002, ARM has inked several subscription deals with chipmakers and EDA firms. The latest ARM subscriber license deal just announced is for Mentor Graphics. What makes their strategy unique?… Read More
How can large SOC projects effectively integrate sub blocks and IP into a stable version for release or internal development? The person responsible for integrating SOC sub blocks into a validated configuration for release has a difficult task. Usually there are many sub-blocks, each undergoing their own development. There… Read More
About 11 months ago, I wrote a piece titled “Money for data and your MEMS for free.” In that, I took on the thinking that TSMC is just going to ride into town, fab trillions of IoT sensors, and they all will be 2.6 cents ten years from now. Good headline, but the technology and economics are not that simple. This may be the semiconductor … Read More
Today, an SoC is seen in the context of an optimized assembly of IPs; it’s no more a single monolithic chip design. It’s very common to see an ARM processor IP along with an interconnect IP, a memory IP, and couple of buses and interfaces IP in an SoC. Although the SoC seems to be an integrated collection of IPs, it can be very complex and… Read More
If you hang around engineers for any time at all, the word optimization is bound to come up. The very definition of engineer is to contrive or devise a solution. With that anointing, most engineers are beholden to the idea that their job is creating, synthesizing, and perfecting a solution specifically for the needs of a unique situation.… Read More
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Concerned about IP security threats for your SoCs?
Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
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REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
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Concerned about IP security threats for your SoCs?
Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip
PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior
Thermal-induced Reliability Challenges and Solutions for Advanced IC Design
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
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REPLAY: The Brave New World of Customized Memory
REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning
REPLAY: VLSI Design Methodology Development
REPLAY: Lightspeed Data Sync – Design Workspace Problems Solved!
REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats?
REPLAY: How ASIC/SoC Prototyping Solutions Can Help You!
REPLAY: Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®
REPLAY: Taiwan ESD Workshop Recording
REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction
REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version)
REPLAY: Finding Your Way Through Verification
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[_errors:protected] => Array
(
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[_cascadeSave:protected] => Array
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[_behaviors:protected] =>
)
[Forum] => vw\vw\XF\Entity\Forum Object
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[_useReplaceInto:protected] =>
[_newValues:protected] => Array
(
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[_values:protected] => Array
(
[node_id] => 2
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[last_post_date] => 1571339503
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[last_post_username] => mfrankel
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[last_thread_title] => Wafer Capacity by Feature Size Shows Rapid Growth at <10nm
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[_relations:protected] => Array
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[Node] => XF\Entity\Node Object
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[title] => SemiWiki Main Forum ( Ask the Experts! )
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[_cascadeSave:protected] => Array
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[_behaviors:protected] =>
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[_previousValues:protected] => Array
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[populated:protected] => 1
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better_recent_comments-2
Widget_Better_Recent_Comments Instance: 2Array
(
[title] => Recent Article Comments
[number] => 10
[avatar] =>
[date] => 1
[comment] => 1
[link] => 1
[display_widget_mobile] => 1
[rw_opt] => Array
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[others_front_page] => 1
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[rw_opt_exclude] => Array
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Widget_Better_Recent_Comments
Response to IP’s Growing Impact On Yield And Reliability