When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More
Tag: ieee
Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA
The IEEE has an Orange Country Chapter of the Components, Packaging and Manufacturing Technology Society who are organizing an all-day workshop, 3D Integrated Circuits: Technologies Enabling the Revolution. This looks to be an informative day with real-world examples in both design and test being presented by over a dozen … Read More