ISSCC 2012: Silicon Systems for Sustainability!

ISSCC 2012: Silicon Systems for Sustainability!
by Daniel Nenni on 02-26-2012 at 4:00 pm


What can we do for Earth’s sustainability? Besides sorting our garbage and recycling our lawn clippings? Sustainability must be the paramount theme for the future of human society! Semiconductors for a better life! Well, according to my kids, if you take away their smart phones there is no life!… Read More


3D-IC Physical Design

3D-IC Physical Design
by Pawan Fangaria on 02-22-2012 at 10:00 am

When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More


Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA

Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA
by Daniel Payne on 11-19-2011 at 4:42 pm

The IEEE has an Orange Country Chapter of the Components, Packaging and Manufacturing Technology Society who are organizing an all-day workshop, 3D Integrated Circuits: Technologies Enabling the Revolution. This looks to be an informative day with real-world examples in both design and test being presented by over a dozen … Read More