Grid Vision 2050 – Unified & Open Across The Globe

Grid Vision 2050 – Unified & Open Across The Globe
by Pawan Fangaria on 02-02-2014 at 10:30 am

Whenever there is good momentum in a particular technology, IEEEtakes major initiative to standardize the procedures, formats, methods, measurements etc. involved in the technology to proliferate it for the advantage of wider community. And that becomes successful by active participation and collaboration of both producers… Read More


TSMC ♥ Synopsys (HSPICE)

TSMC ♥ Synopsys (HSPICE)
by Daniel Nenni on 10-24-2013 at 5:05 am

In case you haven’t noticed, Synopsys has been in the press lately talking about their relationship with TSMC. Since I’m an internationally recognized industry expert they gave me a call for a briefing and I was happy to do it. Staying connected with the #1 EDA company is important and fun since I get to ask questions that most people… Read More


ICCAD at 30: Alberto Looks Back and Forward

ICCAD at 30: Alberto Looks Back and Forward
by Paul McLellan on 11-08-2012 at 8:10 pm

At ICCAD earlier this week, CEDA sponsored a talk by Alberto Sangiovanni-Vincentelli looking back over the last 30 years (it is the 30th anniversary of ICCAD) and looking to the future. As is always the case in these sorts of presentations, the retrospective contained a lot more detail than the going forward part. Clayton Christensen… Read More


ISSCC 2012: Silicon Systems for Sustainability!

ISSCC 2012: Silicon Systems for Sustainability!
by Daniel Nenni on 02-26-2012 at 4:00 pm


What can we do for Earth’s sustainability? Besides sorting our garbage and recycling our lawn clippings? Sustainability must be the paramount theme for the future of human society! Semiconductors for a better life! Well, according to my kids, if you take away their smart phones there is no life!… Read More


3D-IC Physical Design

3D-IC Physical Design
by Pawan Fangaria on 02-22-2012 at 10:00 am

When process nodes reached 28 nm and below, it appeared that design density is reaching a saturation point, hitting the limits of Moore’s law. I was of the opinion that the future of microelectronic physical design was limited to 20 and 14 nm being addressed by technological advances such as FinFETs, double patterning, HKMG (High-k… Read More


Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA

Learning about 3D IC Design and Test, IEEE Workshop on Friday, December 9th in Newport Beach, CA
by Daniel Payne on 11-19-2011 at 4:42 pm

The IEEE has an Orange Country Chapter of the Components, Packaging and Manufacturing Technology Society who are organizing an all-day workshop, 3D Integrated Circuits: Technologies Enabling the Revolution. This looks to be an informative day with real-world examples in both design and test being presented by over a dozen … Read More