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The challenges of 7nm are well documented. Lithography artifacts create exploding design rule complexity, mask costs and cycle time. Noise and crosstalk get harder to deal with, as does timing closure. The types of applications that demand 7nm performance will often introduce HBM memory stacks and 2.5D packaging, and that creates… Read More
Scott Jones and I had the opportunity to talk again with Gary Patton, GlobalFoundries CTO and SVP of R&D for a quick update on 7nm and EUV. Gary has been at GF for two years now with more than 500 other technologists from the IBM semiconductor acquisition. 7nm is the first IBM based process from GF (14nm was licensed from Samsung),… Read More
