All Things Semiconductor!
Dr. Cheng Wang, Co-Founder and SVP Engineering at Flex Logix, presented the second talk in the ‘AI at the Edge’ session, at the just concluded Linley Spring Processor Conference, highlighting the InferX X1 Inference Co-Processor’s high throughout, low cost, and low power. He opened by pointing out that existing inference solutions… Read More
Machine learning applications in data centers (or “the cloud”) have pervasively changed our environment. Advances in speech recognition and natural language understanding have enabled personal assistants to augment our daily lifestyle. Image classification and object recognition techniques enrich our social media experience,… Read More
The design of electronic systems for aerospace applications shares many of the same constraints as apply to consumer products – e.g., cost (including NRE), power dissipation, size, time-to-market. Both market segments are driven to leverage the integration benefits of process scaling. … Read More
Machine learning-based applications have become prevalent across consumer, medical, and automotive markets. Still, the underlying architecture(s) and implementations are evolving rapidly, to best fit the throughput, latency, and power efficiency requirements of an ever increasing application space. Although ML is … Read More
The upcoming Design Automation Conference in San Francisco includes a very interesting session –“Has the Time for Embedded FPGA Come at Last?” Periodically, I’ve been having coffee with the team at Flex Logix, to get their perspective on this very question – specifically, to learn about the key features that customers are seeking… Read More
As Moore’s Law enables increased integration, the diversity of functionality in SoC designs has grown. Design teams are seeking to utilize outside technical expertise in key functional areas, and to accelerate their productivity by re-using existing designs that others have developed. The Intellectual Property (IP) industry… Read More
IP providers need to evaluate several complex engineering problems when addressing customer requirements – perhaps the most intricate challenge is the degree of IP configurabilityavailable to satisfy unique customer applications. … Read More
The IC industry is commonly divided into different market segments – consumer, mobile, industrial, commercial, medical, automotive, and aerospace. A key differentiation among these segments is the characterization and reliability qualification strategy for the fabrication process and design circuitry. For each segment,… Read More
One of the barriers to silicon success has always been design costs, especially if you are an emerging company or targeting an emerging market such as IoT. Today design start costs are dominated by IP which is paid at the start of the project and that is after costly IP evaluations and other IP verification and integration challenges.… Read More
The initial project planning for an SoC design project faces a difficult engineering decision with regards to the “margin” that should be included as part of timing closure. For cell-based blocks, the delay calculation algorithms within the static timing analysis (STA) flow utilize various assumptions to replace… Read More
REPLAY: Fabless: The Transformation of the Semiconductor Industry
The Brave New World of Customized Memory
Embedded FPGA: The Fabric for Optimized Machine Learning
VLSI Design Methodology Development
Desinging Complex SoCs and Dealing with Multiple File Formats?
How ASIC/SoC Prototyping Solutions Can Help You!
Flexible, Multiprotocol IO’s in 7nm FinFets
REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation
REPLAY: Avoiding CDM (Charged Device Model) ESD Failures
REPLAY: eFPGA – “What a great idea! But I have no idea how I’d use it!”
REPLAY: Ensuring System-level Security Through Hardware/Software Security Verification
