An Invited Talk at IEDM: Intel’s Mr. Transistor Presents The Incredible Shrinking Transistor – Shattering Perceived Barriers and Forging Ahead

An Invited Talk at IEDM: Intel’s Mr. Transistor Presents The Incredible Shrinking Transistor – Shattering Perceived Barriers and Forging Ahead
by Mike Gianfagna on 12-16-2024 at 10:00 am

An Invited Talk at IDEM Intel’s Mr. Transistor Presents The Incredible Shrinking Transistor – Shattering Perceived Barriers and Forging Ahead

IEDM turned 70 last week. This was cause for much celebration in the form of special events. One such event was a special invited paper on Tuesday afternoon from Intel’s Tahir Ghani, or Mr. Transistor as he is known. Tahir has been driving innovation at Intel for a very long time. He is an eyewitness to the incredible impact of the Moore’s… Read More


Analog Bits Enables the Migration to 3nm and Beyond

Analog Bits Enables the Migration to 3nm and Beyond
by Mike Gianfagna on 01-10-2024 at 6:00 am

Analog Bits Enables the Migration to 3nm and Beyond

The world is abuzz with 3nm and 2nm technology availability. These processes offer the opportunity to pack far more on a single die than ever before. The complex digital systems contemplated will bring new AI algorithms to life and much more. But there is another side of the technology migration story.  With all that digital processing… Read More


3D Device Technology Development

3D Device Technology Development
by Tom Dillinger on 07-13-2022 at 6:00 am

CFET cross section v2

The VLSI Symposium on Technology and Circuits provides a deep dive on recent technical advances, as well as a view into the research efforts that will be transitioning to production in the near future.  In a short course presentation at the Symposium, Marko Radosavljevic, from the Components Research group at Intel, provided … Read More


Highlights of the “Intel Accelerated” Roadmap Presentation

Highlights of the “Intel Accelerated” Roadmap Presentation
by Tom Dillinger on 07-30-2021 at 6:00 am

ribbon FETs

Introduction

Intel recently provided a detailed silicon process and advanced packaging technology roadmap presentation, entitled “Intel Accelerated”.  The roadmap timeline extended out to 2024, with discussions of Intel client, data center, and GPU product releases, and especially, the underlying technologies to be … Read More


TSMC Design Considerations for Gate-All-Around (GAA) Technology

TSMC Design Considerations for Gate-All-Around (GAA) Technology
by Tom Dillinger on 07-12-2021 at 6:00 am

mobility differences 3

The annual VLSI Symposium provides unique insights into R&D innovations in both circuits and technology.  Indeed, the papers presented are divided into two main tracks – Circuits and Technology.  In addition, the symposium offers workshops, forums, and short courses, providing a breadth of additional information.

At… Read More


Optimization for pFET Nanosheet Devices

Optimization for pFET Nanosheet Devices
by Tom Dillinger on 01-04-2021 at 6:00 am

Intel flow TEM

The next transition from current FinFET devices at advanced process nodes is the “nanosheet” device, as depicted in the figure below. [1]

The FinFET provides improved gate-to-channel electrostatic control compared to a planar device, where the gate traverses three sides of the fin.  The “gate-all-around” characteristics… Read More


MOSFET Gate Length Scaling Limit at Reduced Threshold Voltages

MOSFET Gate Length Scaling Limit at Reduced Threshold Voltages
by Fred Chen on 05-10-2020 at 6:00 am

MOSFET Gate Length Scaling Limit at Reduced Threshold Voltages

As transistor dimensions shrink to follow Moore’s Law, the functionality of the gate used to switch on or off the current is actually being degraded by the short channel effect (SCE) [1-5]. Moreover, the simultaneous reduction of voltage aggravates the degradation, as will be discussed below.

A Practical Lower Limit ofRead More