If you look real close at the #49 DAC floor plan you will see the tiny Intel booth dwarfed by those of TSMC, GlobalFoundries, Samsung, and ARM. The number one semiconductor company in the world does not have the budget for the cornerstone conference of the semiconductor ecosystem? Oh my…… Intel has a big foundry hat and no cattle… Read More
Tag: eda
Hardware Configuration Management at DAC 2012
Next month at DAC I plan to visit the ClioSoft booth to get an update on what’s new with hardware configuration management (HCM). Last year I met with Srinath Anantharaman to get an introduction to their company and how their tools are used by both front-end engineers and back-end IC layout designers.
Srinath Anantharaman,… Read More
RTDA at DAC: Scale to Millions of Jobs
RTDA is all about enterprise level scalability. Their three main products all scale to be able to handle the most demanding needs of large companies with large farms of servers. Of course there are some new refinements too.
LicenseMonitor can scale to 70,000 simultaneous checkouts with 1 billion checkout records in the database.… Read More
Atrenta at DAC: Fast Lint, IP Kit and More
Atrenta will have a new look this year at DAC. I’m not quite sure what that means but we’ll all just have to go along and find out.
They have three users talking about their use of Atrenta’s tools. All 3 of these presentations are in the user-track poster session on Tuesday June 5th 12.30-1.30pm in room 105 (which … Read More
Customers Talk About Reliability, Low-Power and 3D
At DAC in San Francisco this year, Apache once again have a mixture of presentations by customers on their use of Apache tools and presentations by Apache themselves on their products. Most of the customer presentations are given just once, but the product presentations are given multiple times over the three days.
I think one of… Read More
Sagantec Update: More EDA Consolidation!
Adding sophisticated 2D dynamic compaction technology to address 20nm and 14nm challenges. Santa Clara, California – May 3 ,2012 – Sagantec today announced that it has acquired Dutch startup NP-Komplete Technologies BV (Eindhoven, The Netherlands) for its physical design compaction and migration solutions based on a sophisticated… Read More
TSMC 20nm Challenges!
Now that the 28nm challenges are dead
It is time to look ahead
The tabloid pundits may not agree
But Moore’s law again you will see
The semiconductor ecosystem is humming
(2X gate density -20%+ performance-20%+ power savings)
The 20nm design starts are coming!
Okay, I’m really bad at poetry. Gambling however, I do pretty well. Las… Read More
Formal Verification, there’s an App for that
The success of Apple’s AppStore has made people aware that software doesn’t have to be delivered in a big monolithic lump. Indeed, going back a bit earlier, Apple’s iTunes store made people aware that you didn’t have to buy a whole album if you only wanted a track or two.
EDA applications in today’s… Read More
It is free after you pay for it and there is a one-time annual fee: The Case for FD-SOI
In one of Portlandia’s TV program sketches, there is a funny interchange between a carrier salesperson and Fred Armisen (of SNL fame) who was trying to buy a phone. One chuckle line was a statement by the seller that the phone was free after paying for it and that there was a one-time annual fee. With this anecdote as a mental backdrop,… Read More
28nm Layout Needs Signoff Quality at Design Time
We are all aware that at 28nm and below several types of complex layout effects manifest themselves into the design and pose a herculean task, with several re-spins to correct them at pre-tapeout. It’s apparent that the layout needs to be correct by construction at the very beginning during the design stage.
