SoC designers have always wanted to simulate hardware and software together during new product development, so one practical question has been how to trade off performance versus accuracy when creating an early model of the hardware. The creative minds at Carbon Design Systems and ARM have combined to offer us some hope and relief… Read More
Tag: eda
Power, Signal and Thermal Updates from ANSYS at DesignCon
DesignConis next week in Santa Clara, so today I spoke with Mark Ravenstahlfrom ANSYS to get an idea of what to expect at the conference and trade show.
Using IC Data Management Tools and Migrating Vendors
Non-volatile memory is used in a wide variety of consumer and industrial applications and comes in an array of architectures like Serial Flash and CBRAM (Conductive Bridging RAM). I caught up with Shane Hollmer by phone this week to gain some insight into a recent acquisition of Atmel’s serial flash components, and how that… Read More
Verdi: No Requiem for Openness
I sat down last week for lunch with Michael Sanie. Mike and I go back a long way, working together at VLSI Technology (where his first job out of school was to take over the circuit extractor that I’d originally written) and then in strategic marketing at Cadence. Now Mike has marketing for (almost?) all of Synopsys’s … Read More
How We Got Here…
Over at the GSA Forum website I have an article on the history of the semiconductor industry. It is actually based on a couple of brief history of semiconductor blogs (here and here) I published here on SemiWiki last year but edited down a lot and tightened up.
Since the start of the year seems to be the time for predictions, here are the… Read More
Double Patterning for IC Design, Extraction and Signoff
TSMC and Synopsys hosted a webinar in December on this topic of double patterning and how it impacts the IC extraction flow. The 20nm process node has IC layout geometries so closely spaced that the traditional optical-based lithography cannot be used, instead lower layers like Poly and Metal 1 require a new approach of using two… Read More
FD-SOI is Worth More Than Two Cores
This is the second blog entry about an ST Ericsson white-paper on multiprocessors in mobile. The first part was here.
The first part of the white-paper basically shows that for mobile the optimal number of cores is two. It is much better to use process technology (and good EDA) to run the processor at higher frequency rather than add… Read More
Yawn… New EDA Leader Results Are Coming
We will soon start to see the quarterly financial reporting installments of the “Big 3” public EDA companies. I predict they will be as boring as usual. I am not sure if I would want it any differently though.
Back in the 90s there were times when it was truly interesting to wait to see what Cadence, Mentor, or later Synopsys, might announce.… Read More
Oasys Has a New CEO
Scott Seaton is the new CEO of Oasys Design Systems. Paul van Besouw, the CEO since the company’s founding, becomes the CTO. I met Scott last year when I was doing some consulting work for Carbon Design where he was VP of sales (the new VP sales at Carbon is Hal Conklin, by the way).
I talked to Scott about why he had joined Oasys. … Read More
Fixing Double-patterning Errors at 20nm
David Avercrombie of Mentor won the award for the best tutorial at the 2012 TSMC OIP for his presentation, along with Peter Hsu of TSMC, on Finding and Fixing Double Patterning Errors in 20nm. The whole presentation along with the slides is now available online here. The first part of the presentation is an introduction to double … Read More
