Chips Are Going 3D, DRC Needs to Go 3D Too

Chips Are Going 3D, DRC Needs to Go 3D Too
by Paul McLellan on 02-10-2015 at 7:00 am

The last paradigm shift in DRC was around 0.35um when designs got too large to handle as flat data, and hierarchical approaches were required. Back then the design rules themselves were not that complex, the explosion of data volume came from the complexity of the design itself. But each process node added more design rules intricacies… Read More


Design Rule Checking (DRC) Meets New Challenges

Design Rule Checking (DRC) Meets New Challenges
by Daniel Payne on 12-02-2014 at 7:00 am

The traditional batch-oriented DRC process run as a final check to ensure compliance with foundry yield goals is quickly moving toward a concurrent DRC process performed early and often throughout design, especially at the 28 nm and smaller process nodes. What are the technology factors causing this change?

  • Increasing number
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Using Cadence PVS for Signoff at TowerJazz

Using Cadence PVS for Signoff at TowerJazz
by Daniel Payne on 11-11-2014 at 7:00 pm

TowerJazzis a specialty foundry that provides IC manufacturing into several markets, like: RF, high-performance analog, power, imaging, consumer, automotive, medical, industrial and aerospace/defense. In June there was a presentation from Ofer Tamir of TowerJazz at DACin the Cadence theatre, so I had a chance this week … Read More


Aldec Can Ensure Smooth System Integration

Aldec Can Ensure Smooth System Integration
by Luke Miller on 06-17-2014 at 9:00 pm

Tools, tools, tools. Designs are rapidly changing, JESD204b, Hybrid Memory cube and all other Gigabit serialization schemes are here to stay. RIP DDR. This means board level simulations with respect to firmware (FPGA) are going to be more challenging than ever. Why? you ask, especially if the board layout is simpler? True, but… Read More


FinFET & Multi-patterning Need Special P&R Handling

FinFET & Multi-patterning Need Special P&R Handling
by Pawan Fangaria on 04-28-2014 at 1:00 pm

I think by now a lot has been said about the necessity of multi-patterning at advanced technology nodes with extremely low feature size such as 20nm, because lithography using 193nm wavelength of light makes printing and manufacturing of semiconductor design very difficult. The multi-patterning is a novel semiconductor manufacturing… Read More


Show Me How To Get Better DRC and LVS Results For My SoC Design

Show Me How To Get Better DRC and LVS Results For My SoC Design
by Daniel Payne on 04-14-2014 at 3:30 pm

Most IC engineers learn best by hands-on experience when another more experienced person can show us what to do. If you cannot find that experienced person, then the next best thing is a video from an expert. I was surprised to find out that video was so important today that the #2 most viewed web site on the Internet was www.youtube.comRead More


Verifying DRC Decks and Design Rule Specifications

Verifying DRC Decks and Design Rule Specifications
by Daniel Nenni on 02-19-2014 at 8:00 am

DRVerify is part of the iDRM design rule compiler platform from Sage DA, something that I have been personally involved with for the past three years. DRVerify is mainly used to verify third party design rule check (DRC) decks and ensure that they correctly, completely and accurately represent the design rule specification. In… Read More


An easier way to deal with design rule waivers (video)

An easier way to deal with design rule waivers (video)
by Beth Martin on 10-26-2013 at 11:00 am

At advanced nodes, design rules are necessarily more complex and restrictive. Although most of the time you can find a way to live with them, sometimes it’s necessary to seek a waiver from the foundry for a particular design feature. This involves documenting the feature, the design rules in question and the conditions under which… Read More


Best Practices for Using DRC, LVS and Parasitic Extraction – on YouTube

Best Practices for Using DRC, LVS and Parasitic Extraction – on YouTube
by Daniel Payne on 07-10-2013 at 1:21 pm

EDA companies produce a wealth of content to help IC engineers get the best out of their tools through several means:

  • Reference Manuals
  • User Guides
  • Tutorials
  • Workshops
  • Seminars
  • Training Classes
  • Phone Support
  • AE visits
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