The deadline is coming up at the end of next week (technically on Monday October 29th for those of you who like real brinkmanship) for several aspects of DAC (not submission of papers for the conference itself) but most of the less academic-oriented things.
Proposals for:
In past years the Kaufman award, the most prestigious in EDA, has been announced around September and presented during a dinner in October or November in Silicon Valley. EDAC and CEDA, the sponsors of the award, have just announced that this time the award dinner will take place in Austin at the 50th DAC following the early Sunday … Read More
I visited Oasys Design Systems and talked to Craig Robbins, their VP sales. For the first time this year, Oasys has a theater presentations and demos of RealTime Designer which are open to anyone attending the show. In previous years, they have had suite demos for appropriately qualified potential customers but outside they have… Read More
Sunday Night – you have to network at the EDAC kick-off party.… Read More
Mike Muller’s keynote focused on a lot of changes since the ARM1 was designed in 1983 when ARM the company did not exist and ARM was the next generation processor for Acorn Computer, which was really in the hobby market and had its first boost when they had a contract to design the BBC Microcomputer to go along with a computer literacy… Read More
David Abercrombie from Mentor Graphics met with me on Tuesday at DAC to provide an update on DPT – Double Patterning Technology, something new required for several layers starting at the 20nm node in order to get any IC yield. DPT is also part of Multiple-Patterning.… Read More
IC place and route is a big challenge so we see many EDA companies creating tools. On Tuesday at DAC I met with Dave Noble of Pulsic to get an update.
Notes
Dave Noble, VP Operations (EDA since 2003), Sperry Univac since 1974
– had been an EDA distributor for Pulsic as well
More leads qualified on Monday than all days of last year … Read More
3D has been a growing buzz word in IC design and packaging for several years now, so it’s refreshing to actually find an EDA vendor that has developed tools to help analyze something like 3D thermal and mechanical stress at DAC. … Read More
I use social media 7 days a week and while at DAC I received a message from Herve Guegan on my LinkedIn account where he basically said, “Hey, go check out Asygn at DAC, they do analog macro models.”… Read More
One year ago I met with Hany Elhak of Synopsys to get an update on what was new with HSPICE in 2011, so this year at DAC Hany met me at the Synopsys booth for a quick update.
HSPICE has something called Precision Parallel so with 16 cores your IC circuit simulations will have about 10 x speed up compared to a single core.… Read More
