In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More
2025 Keynote Addresses from Industry Leaders:
Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne
2025’s Main Topics Included:
AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working … Read More
Many products are assembled from components manufactured and distributed separately, and it is important to consider how such products are manufactured when seeking to provide commercially valuable patent protection. This article provides an example in the field of computer chip manufacture.
A system-on-a-chip
Using chiplets is an emerging trend well-covered at #62DAC and they even had a dedicated Chiplet Pavilion, so I checked out the presentation from Dan Slocombe, Design Engineering Architect in the Compute Solutions Group at Cadence. In a short 20 minutes Dan managed to cover a lot of ground, so this blog will summarize the key points.… Read More
Chip on Panel on Substrate, often shortened to CoPoS, extends the familiar idea of chip on carrier packaging by moving the redistribution and interposer style structures from circular wafers to large rectangular panels. The finished panel assembly is then mounted on an organic or glass package substrate. This shift from round
On July 9, 2025, a DACtv session by Dr. Peter Levin explored the transformative impact of artificial intelligence (AI) on chip design, as presented in the YouTube video. The speaker, an industry expert, delved into how AI is reshaping electronic design automation (EDA), addressing the escalating complexity of modern chips and… Read More
Bob Fung is the CEO of Owens Design, a Silicon Valley company specializing in the design and build of complex equipment that powers high-tech manufacturing. Over his 22-year tenure, Bob has led the development of more than 200 custom systems for world-class companies across the semiconductor, biomedical, energy, and emerging… Read More
Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging,
AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More
