Dr. Sunghyun Park earned his B.S. from KAIST and his Ph.D. from MIT’s CSAIL (Computer Science and Artificial Intelligence Laboratory). He built his career across Intel, Samsung Research, and SpaceX as a semiconductor design engineer, before serving as Vice President at Morgan Stanley in New York — a rare combination of… Read More
Analog Bits is expanding its role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: delivering, monitoring, and managing power inside increasingly complex chips.
The company announced that its IP will be included in an upcoming customer test-chip tapeout… Read More
Source: Jonathon Evans and Polychronis Xekalakis, “NVIDIA Vera CPU,” Hot Chips 2026. Performance figures are NVIDIA claims, and several results were based on preproduction or unofficial testing.
NVIDIA’s Vera CPU is a server processor designed specifically for agentic AI, where language models repeatedly observe, reason,… Read More
Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More
Chiplet-based architectures, 2.5D integration, and system-in-package (SiP) designs are unlocking new levels of performance, scalability, and design flexibility. But moving beyond the monolithic SoC also introduces complex interactions among… Read More
The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.
Intel Foundry also made its presence felt, reminding everyone… Read More
As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More
I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
Keysight Technologies returns to 2026 DAC, The Chips to Systems Conference this year as a Silver Sponsor and an “I LOVE DAC” sponsor, bringing its Design Engineering Software portfolio to Booth #927 at DAC 2026, which runs July 26-29 in Long Beach, Calif. The Keysight team will be on-site Monday through Wednesday … Read More
Mohit Gupta founded TYLsemi to build chiplet-based intelligent power and connectivity solutions for AI infrastructure—an area where custom silicon has long been underserved. TYLsemi exists to provide the foundational chiplet platform that enables tailored custom silicon solutions for the evolving needs of AI infrastructure.… Read More
