As semiconductor design pushes into increasingly complex territory, driven by Ai, ML, HPC, and heterogeneous system architectures, designers are challenged to balance performance, power, and time-to-market pressures. In this landscape, network-on-chip (NoC) architectures have emerged as a foundational building block… Read More
Join us to hear firsthand from the innovators at Siemens and Alphawave Semi and learn proven practices to enhance your UCIe-enabled AI system performance!
The semiconductor industry is shifting rapidly from monolithic SoC design to chiplet-based systems. At the same time, AI compute workloads have pushed into petaflop-class
Dr. Zou is one of the industry’s leading experts in power delivery for high performance processors. Before founding PowerLattice, he held technical leadership roles at Qualcomm/NUVIA, Huawei and Intel, where he led the multidisciplinary teams advancing integrated voltage regulator technologies across magnetic materials,… Read More
Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More
Daniel is joined by Dave Eggleston is senior business development manager at Microchip with a focus on licensing SST SuperFlash technology. Dave’s extensive background in Flash, MRAM, RRAM, and storage is built on 30+ years of industry experience. This includes serving as VP of Embedded Memory at GLOBALFOUNDRIES, CEO… Read More
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
In the relentless race to power next-generation artificial intelligence (AI) systems, data connectivity has emerged as the critical bottleneck. As AI models balloon in size—from billions to trillions of parameters—compute resources alone are insufficient. According to Ayar Labs, approximately 70% of AI compute time is … Read More
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More
2025 Keynote Addresses from Industry Leaders:
Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne
2025’s Main Topics Included:
AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working … Read More
