Alchip Technologies Ltd., a global leader in high-performance computing (HPC) and artificial intelligence (AI) ASIC design and production services, continues its trajectory of rapid growth and technical leadership by pushing the boundaries of advanced-node silicon, expanding its global design capabilities, and building… Read More
Tag: chiplet
Webinar: Simplifying Interface Protocol Verification with Veloce Transactor Library
As hyperscaler chiplet and SoCs grow in complexity, integrating and validating multiple high-speed and low-speed interface protocols—such as PCIe, CXL, UCIe, AMBA, AXI, AHB, CHI, CSI2, and DSI2, can be a significant challenge. Design Verification Engineers and Technical Managers must ensure seamless protocol compliance
Webinar: Synopsys Collaboration Framework to Boost SoC/Chiplet Architecture Performance Analysis and Optimization
Date: March, 13 – 9 a.m. PST
Using virtual prototypes alongside early accessible performance models of new SoC or Chiplet architectures has become the de facto standard for early architecture performance modeling, exploration, and analysis. However, as designs and tools become increasingly complex, these virtual
Outlook 2025 with David Hwang of Alchip
Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit. He also serves as Senior Vice President, Business Development. Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC. He holds… Read More
2025 Outlook Anna Fontanelli MZ Technologies
Anna Fontanelli, CEO of MZ Technologies, is a silicon executive with more than 35 years of expertise in managing complex R&D organizations/programs to give birth to innovative EDA technologies. Strong communication skills and proven ability to lead distributed, cross functional teams in international environments.… Read More
Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
Chiplets-Based Systems: Keysight’s Role in Design, Testing, and Data Management
Keysight, with deep roots tracing back to Hewlett-Packard, has long been at the forefront of innovation in electronic design and testing. It manufactures electronics test and measurement equipment and software. The company also owns its own foundry and makes custom chips and packages for its instrumentation business. Many… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More
Heterogeneous 2D/3D Packaging Challenges
A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More
Webinar: The Impact on the Automotive Market as Chips Transform Into 3D Systems
The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren’t just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components… Read More