The semiconductor manufacturing industry has hit a new era of data intensity. We know that we need to look at alternatives to silicon and that electrical interconnects are unable to keep pace. We know we need to design more chiplets and alter microchip architecture. But how much data are we talking specifically, and how much
In the rapidly evolving landscape of semiconductor technology, the Universal Chiplet Interconnect Express (UCIe) emerges as a groundbreaking open standard designed to revolutionize on-package chiplet integrations. Presented by Dr. Debendra Das Sharma, Chair of the UCIe Consortium and Intel Senior Fellow, at the Chiplet… Read More
At the 2025 RISC-V Summit, amid debates over cloud scaling and AI cost, DeepComputing CEO Yuning Liang offered a radical view: the future of intelligence isn’t in the cloud at all — it’s already in your pocket. His lunchtime conversation began with iPhones and ended with the death of the operating system. In between, he sketched … Read More
As semiconductor design pushes into increasingly complex territory, driven by Ai, ML, HPC, and heterogeneous system architectures, designers are challenged to balance performance, power, and time-to-market pressures. In this landscape, network-on-chip (NoC) architectures have emerged as a foundational building block… Read More
Dr. Zou is one of the industry’s leading experts in power delivery for high performance processors. Before founding PowerLattice, he held technical leadership roles at Qualcomm/NUVIA, Huawei and Intel, where he led the multidisciplinary teams advancing integrated voltage regulator technologies across magnetic materials,… Read More
Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More
Daniel is joined by Dave Eggleston is senior business development manager at Microchip with a focus on licensing SST SuperFlash technology. Dave’s extensive background in Flash, MRAM, RRAM, and storage is built on 30+ years of industry experience. This includes serving as VP of Embedded Memory at GLOBALFOUNDRIES, CEO… Read More
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
In the relentless race to power next-generation artificial intelligence (AI) systems, data connectivity has emerged as the critical bottleneck. As AI models balloon in size—from billions to trillions of parameters—compute resources alone are insufficient. According to Ayar Labs, approximately 70% of AI compute time is … Read More
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
