Chiplets: providing commercially valuable patent protection for modular products

Chiplets: providing commercially valuable patent protection for modular products
by Robbie Berryman on 08-24-2025 at 6:00 am

Screenshot 2025 07 27 at 08 32 09

Many products are assembled from components manufactured and distributed separately, and it is important to consider how such products are manufactured when seeking to provide commercially valuable patent protection. This article provides an example in the field of computer chip manufacture.

Chiplets

A system-on-a-chip

Read More

Chiplets and Cadence at #62DAC

Chiplets and Cadence at #62DAC
by Daniel Payne on 08-12-2025 at 10:00 am

SoC Cockpit Concept min

Using chiplets is an emerging trend well-covered at #62DAC and they even had a dedicated Chiplet Pavilion, so I checked out the presentation from Dan Slocombe, Design Engineering Architect in the Compute Solutions Group at Cadence. In a short 20 minutes Dan managed to cover a lot of ground, so this blog will summarize the key  points.… Read More


CoPoS is a Bigger Canvas for Chiplets and HBM

CoPoS is a Bigger Canvas for Chiplets and HBM
by Admin on 08-03-2025 at 10:00 am

Chip on Panel on Substrate, often shortened to CoPoS, extends the familiar idea of chip on carrier packaging by moving the redistribution and interposer style structures from circular wafers to large rectangular panels. The finished panel assembly is then mounted on an organic or glass package substrate. This shift from round

Read More

CEO Interview with Bob Fung of Owens Design

CEO Interview with Bob Fung of Owens Design
by Daniel Nenni on 08-01-2025 at 10:00 am

Bob Fung Photo

Bob Fung is the CEO of Owens Design, a Silicon Valley company specializing in the design and build of complex equipment that powers high-tech manufacturing. Over his 22-year tenure, Bob has led the development of more than 200 custom systems for world-class companies across the semiconductor, biomedical, energy, and emerging… Read More


Chiplet and Heterogeneous Integration for Microelectronics Packaging – Virtual Training

Chiplet and Heterogeneous Integration for Microelectronics Packaging – Virtual Training
by Admin on 07-18-2025 at 9:49 am

Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging,

Read More

AI Booming is Fueling Interface IP 23.5% YoY Growth

AI Booming is Fueling Interface IP 23.5% YoY Growth
by Eric Esteve on 07-10-2025 at 6:00 am

image001 (2)

AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More


Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis

Siemens EDA Unveils Groundbreaking Tools to Simplify 3D IC Design and Analysis
by Kalar Rajendiran on 07-01-2025 at 10:00 am

Innovator3D IC Solution Suite

In a major announcement at the 2025 Design Automation Conference (DAC), Siemens EDA introduced a significant expansion to its electronic design automation (EDA) portfolio, aimed at transforming how engineers design, validate, and manage the complexity of next-generation three-dimensional integrated circuits (3D ICs).… Read More


Agile Analog at the 2025 Design Automation Conference #26DAC

Agile Analog at the 2025 Design Automation Conference #26DAC
by Daniel Nenni on 06-17-2025 at 10:00 am

62nd DAC SemiWiki

See Agile Analog at DAC in the EE Times Chiplet Pavilion (Booth 2308, Level 2)

Learn how to enhance security and performance with our customizable analog IP

Agile Analog is delighted to announce that we will be back exhibiting at the Design Automation Conference (DAC). Come join us in the EE Times Chiplet Pavilion (booth 2308) to … Read More


Altair at the 2025 Design Automation Conference #62DAC

Altair at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-17-2025 at 8:00 am

62nd DAC SemiWiki

Design Perfection from Concept to Tape-out Booth #1617 at DAC25 – June 23-25, 2025

Join us to learn how Altair’s world-class solutions are powering perfect semiconductor design.

The semiconductor industry operates at an accelerated pace, in which every second saved is a competitive advantage. You must rely on solutions

Read More

Webinar: Verifying Chiplet-based Systems

Webinar: Verifying Chiplet-based Systems
by Admin on 05-27-2025 at 11:15 am

Verifying Chiplet-based Systems (online)

As the semiconductor industry increasingly embraces chiplet-based architectures, the complexity of system integration and verification has grown exponentially. Verifying these modular systems demands new approaches, tools, and collaboration across design and verification… Read More