Daniel is joined by Dave Eggleston is senior business development manager at Microchip with a focus on licensing SST SuperFlash technology. Dave’s extensive background in Flash, MRAM, RRAM, and storage is built on 30+ years of industry experience. This includes serving as VP of Embedded Memory at GLOBALFOUNDRIES, CEO… Read More
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
In the relentless race to power next-generation artificial intelligence (AI) systems, data connectivity has emerged as the critical bottleneck. As AI models balloon in size—from billions to trillions of parameters—compute resources alone are insufficient. According to Ayar Labs, approximately 70% of AI compute time is … Read More
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More
Chiplet Summit 2026by Admin on 08-27-2025 at 9:54 pm
All the Solutions for Developing Chiplets
2025 Keynote Addresses from Industry Leaders:
Alphawave Semi, Arm, Cadence Design Systems, Keysight, Open Compute Project, Synopsys, Teradyne
2025’s Main Topics Included:
AI/ML Acceleration, Open Chiplet Economy, Advanced Packaging Methods, Die-to-die Interfaces, Working … Read More
Many products are assembled from components manufactured and distributed separately, and it is important to consider how such products are manufactured when seeking to provide commercially valuable patent protection. This article provides an example in the field of computer chip manufacture.
Chiplets
A system-on-a-chip
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Using chiplets is an emerging trend well-covered at #62DAC and they even had a dedicated Chiplet Pavilion, so I checked out the presentation from Dan Slocombe, Design Engineering Architect in the Compute Solutions Group at Cadence. In a short 20 minutes Dan managed to cover a lot of ground, so this blog will summarize the key points.… Read More
On July 9, 2025, a DACtv session by Dr. Peter Levin explored the transformative impact of artificial intelligence (AI) on chip design, as presented in the YouTube video. The speaker, an industry expert, delved into how AI is reshaping electronic design automation (EDA), addressing the escalating complexity of modern chips and… Read More
