Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology

Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology
by Tom Dillinger on 12-18-2019 at 10:00 am

Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology.  A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer;  the interposer… Read More


IP Provider Vidatronic Embraces the ClioSoft Design Management Platform

IP Provider Vidatronic Embraces the ClioSoft Design Management Platform
by Randy Smith on 07-31-2019 at 6:00 am

Having worked at several semiconductor intellectual property (SIP) companies, I know how important it is to have a strong design data management platform for tracking the development and distribution of SIP products. Everyone doing semiconductor design should care about design data management. But for an IP company, it is … Read More


1-on-1 with Anirudh Devgan, President, Cadence

1-on-1 with Anirudh Devgan, President, Cadence
by Tom Dillinger on 07-27-2018 at 12:00 pm

At the Design Automation Conference, no one is busier than an EDA company executive — conference panels, product launch briefings, customer meetings, and corporate dinners all place considerable demands on their time. I was fortunate enough to be able to meet with Anirudh Devgan, President of Cadence, at the recent DAC55 in San… Read More


IoT Designs Beginning to Shift to 7nm: Promises Upside for Cadence Physically-Aware Design Flow

IoT Designs Beginning to Shift to 7nm: Promises Upside for Cadence Physically-Aware Design Flow
by Mitch Heins on 01-29-2018 at 12:00 pm

Until recently, ICs at bleeding edge nodes like 7nm technology from foundries like TSMC were mostly targeted for high-performance-computing (HPC) and mobile applications or possibly high radix switches that needed the increased performance of advanced nodes. The momentum of Moore’s law and Moore-than-Moore saw foundries… Read More


Photonics Summit Delivers High-Bandwidth Discussion on State of Silicon Photonics

Photonics Summit Delivers High-Bandwidth Discussion on State of Silicon Photonics
by Mitch Heins on 10-03-2017 at 12:00 pm

On September 6, 2017, Cadence Design Systems, Lumerical Solutions and PhoeniX Software hosted their second Photonics Summit. As with last year’s summit, this was a two-day event, with the first day including in a myriad of photonics presentations and the second day being a hands-on workshop. The hands-on workshop taught attendees… Read More


CDNLive Boston Keynote Address Highlights Emergence of Silicon Photonics

CDNLive Boston Keynote Address Highlights Emergence of Silicon Photonics
by Mitch Heins on 09-27-2017 at 7:00 am

I had the pleasure of being able to attend the CDNLive event held in the Boston, MA area last month and I was pleasantly surprised to see that Cadence highlighted Silicon Photonics as one of its Keynote topics. MIT Professor Duane Boning gave an excellent overview of the current state of silicon photonics and why he believes it is time… Read More


ARM and Cadence IP Simplify IoT System Design and Verification

ARM and Cadence IP Simplify IoT System Design and Verification
by Mitch Heins on 08-01-2017 at 7:00 am

As the Internet-of-Things (IoT) markets mature, we are seeing the complexity of IoT systems evolve from simple routing functions that connect IoT edge devices to the cloud into more complex system of systems that manage the interaction between multiple sensor-hubs. IoT sensor-hubs and gateways not only take care of basic care… Read More


Cadence’s Tempus – New Hierarchical Approach for Static Timing Analysis

Cadence’s Tempus – New Hierarchical Approach for Static Timing Analysis
by Mitch Heins on 07-13-2017 at 12:00 pm

While at the 54[SUP]th[/SUP] Design Automation Conference (DAC) I had the opportunity to talk with Ruben Molina, Product Management Director for Cadence’s Tempus static timing analysis (STA) tool. This was a good review of how the state-of-the-art for STA has evolved over the last couple decades. While the basic problem hasn… Read More


Capture the Light with Integrated Photonics

Capture the Light with Integrated Photonics
by Mitch Heins on 07-03-2017 at 7:00 am


I wrote up a quick article in the weeks before the Design Automation Conference (DAC) letting readers know that Integrated Photonics were indeed coming to DAC again this year. As a follow up, I attended the DAC presentation, ‘Capture the Light. An Integrated Photonics Design Solution from Cadence, Lumerical and PhoeniX Software… Read More


TSMC Unveils More Details of Automotive Design Enablement Platform

TSMC Unveils More Details of Automotive Design Enablement Platform
by Mitch Heins on 06-28-2017 at 7:00 am

At this year’s Design Automation Conference (DAC), TSMC unveiled more details about the design enablement platforms that were introduced at their 23[SUP]rd[/SUP] annual TSMC Technology Symposium earlier this year. I attended a presentation on TSMC’s Automotive Enablement Platform held at the Cadence Theater where TSMC… Read More