The tremendous increase in global data traffic over the past decade shows no sign of abating. Indeed, the applications for all facets of data communications are expanding, from 5G (and soon, 6G) wireless communications to metropolitan area networks serving autonomous vehicles to broader deployment of machine learning algorithms. … Read More
Tag: cadence design systems
EDA Flows for 3D Die Integration
Background
The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures. The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More
Podcast EP16: Hyperscale Computing & Changes in the Datacenter
Dan is joined by Frank Schirrmeister, senior group director of solutions marketing at Cadence Design Systems, Frank has extensive experience in complex system design from his work at companies such as Cadence, Synopsys, Imperas and ChipVision. He has also advised Vayavya Labs and CriticalBlue.
Dan and Frank discuss the many… Read More
WEBINAR LESSONS LEARNED FROM SOLARWINDS
Webinar: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs
I had the opportunity to preview the upcoming SemiWiki webinar titled: Design Methodologies for Next-Generation Heterogeneously Integrated 2.5/3D-IC Designs. John Park’s message, describing this powerful Cadence solution, really impressed me. That’s why I want to encourage you to register for it and join this SemiWiki … Read More
Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology
Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology. A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer; the interposer… Read More
IP Provider Vidatronic Embraces the ClioSoft Design Management Platform
Having worked at several semiconductor intellectual property (SIP) companies, I know how important it is to have a strong design data management platform for tracking the development and distribution of SIP products. Everyone doing semiconductor design should care about design data management. But for an IP company, it is … Read More
1-on-1 with Anirudh Devgan, President, Cadence
At the Design Automation Conference, no one is busier than an EDA company executive — conference panels, product launch briefings, customer meetings, and corporate dinners all place considerable demands on their time. I was fortunate enough to be able to meet with Anirudh Devgan, President of Cadence, at the recent DAC55 in San… Read More
IoT Designs Beginning to Shift to 7nm: Promises Upside for Cadence Physically-Aware Design Flow
Until recently, ICs at bleeding edge nodes like 7nm technology from foundries like TSMC were mostly targeted for high-performance-computing (HPC) and mobile applications or possibly high radix switches that needed the increased performance of advanced nodes. The momentum of Moore’s law and Moore-than-Moore saw foundries… Read More
Photonics Summit Delivers High-Bandwidth Discussion on State of Silicon Photonics
On September 6, 2017, Cadence Design Systems, Lumerical Solutions and PhoeniX Software hosted their second Photonics Summit. As with last year’s summit, this was a two-day event, with the first day including in a myriad of photonics presentations and the second day being a hands-on workshop. The hands-on workshop taught attendees… Read More