Podcast EP264: How Sigasi is Helping to Advance Semiconductor Design with Dieter Therssen

Podcast EP264: How Sigasi is Helping to Advance Semiconductor Design with Dieter Therssen
by Daniel Nenni on 12-06-2024 at 10:00 am

Dan is joined by Dieter Therssen, CEO of Sigasi. Deiter started his career as a hardware design engineer, using IMEC’s visionary tools and design methodologies in the early days of silicon integration. Today, being CEO of Sigasi, a fast-growing, creative technology company is a perfect fit for Dieter. Having worked in that space… Read More


2024 Outlook with Srinivasa Kakumanu of MosChip

2024 Outlook with Srinivasa Kakumanu of MosChip
by Daniel Nenni on 03-27-2024 at 10:00 am

KS MD&CEO MosChip 2024

MosChip is a publicly traded company founded in the year 1999, they offer semiconductor design services, turnkey ASIC, software services, and end-to-end product engineering solutions. The company headquartered in Hyderabad, India, with five design centers and over 1300 engineers located in Silicon Valley (USA), Hyderabad,… Read More


Podcast EP129: Sondrel’s Unique Position in the Custom Chip Market

Podcast EP129: Sondrel’s Unique Position in the Custom Chip Market
by Daniel Nenni on 12-07-2022 at 10:00 am

Dan is joined by Graham Curren, CEO of ASIC provider Sondrel. Graham founded Sondrel in 2002 after identifying a gap in the market for an international company specialising in complex digital IC design. Prior to establishing Sondrel, Graham worked in both ASIC design and manufacturing before joining EDA company, Avant! Corporation.… Read More


Podcast EP84: MegaChips and Their Launch in the US with Doug Fairbairn

Podcast EP84: MegaChips and Their Launch in the US with Doug Fairbairn
by Daniel Nenni on 06-08-2022 at 10:00 am

Dan is joined by semiconductor and EDA industry veteran Douglas Fairbairn. Doug provides details about MegaChips, where he currently heads business development. MegaChips is a large, successful 30-year old semiconductor company based in Japan.

Doug is helping MegaChips launch in the US with a focus on ASIC design and delivery.… Read More


Certitude: Tool that can help to catch DV Environment Gaps

Certitude: Tool that can help to catch DV Environment Gaps
by eInfochips on 04-13-2021 at 2:00 pm

Certitude 9

Design verification (DV) is still one of the biggest challenges in the ASIC based product world. In last two decades, we have seen many changes in terms of HVLs and methodologies used for design verification. System Verilog is the most popular HVL these days and UVM is the most popular verification methodology.

Even after such an… Read More


eSilicon ASICs all in the Google Cloud

eSilicon ASICs all in the Google Cloud
by Daniel Nenni on 05-08-2019 at 12:00 pm

Having just completed a cloud evaluation for SemiWiki I can tell you why eSilicon chose Google. Simply put, they are working harder to get cloud business. Google ($4B) is the number five cloud provider behind Microsoft ($21.2B), Amazon ($20.4B), IBM ($10.3B) and Oracle ($6.08B). There is a lot of money in the cloud and a lot more … Read More


Retro-uC: on a road to low-cost, (ridiculously) low-volume ASICs ?

Retro-uC: on a road to low-cost, (ridiculously) low-volume ASICs ?
by Staf_Verhaegen on 09-25-2018 at 7:00 am

I’m a long time reader of SemiWiki; almost from the start. I’ve sometimes been a passionate commenter but as some of you may have noticed my activity lately on the forum was lower. One of the reasons is a project I am working on and I feel honoured I was invited to present the background here on SemiWiki.

I am currently working… Read More


Semiconductor IP Reality Check

Semiconductor IP Reality Check
by Daniel Nenni on 09-19-2018 at 12:00 pm

A robust, proven library of IP is a critical enabler for the entire semiconductor ecosystem. Without it, ASIC design is pretty much impossible, given time-to-market pressures. Said another way, designing IP for your next chip simply doesn’t fit the schedule – most teams have barely enough time to integrate and validate pre-existing… Read More


Open-Silicon SerDes TCoE Enables Successful Delivery of ASICs for Next-generation, High-Speed Systems

Open-Silicon SerDes TCoE Enables Successful Delivery of ASICs for Next-generation, High-Speed Systems
by Mitch Heins on 06-26-2017 at 12:00 pm

With 5G cellular networks just around the corner, there is an ever-increasing number of companies working to bring faster communications chips to the market. Data centers are now deploying 100G to handle the increased bandwidth requirements, typically in the form of four 28Gbps channels and that means ASIC designers are looking… Read More


eSilicon Revolutionizes Semiconductor IP Selection and Purchasing!

eSilicon Revolutionizes Semiconductor IP Selection and Purchasing!
by Daniel Nenni on 09-21-2016 at 10:00 am

Design starts are the lifeblood of the semiconductor industry which is why we have been following the eSilicon STAR Platform since its introduction with great anticipation. The STAR platform was first launched about three years ago. Today, there are over 1,300 registered STAR users in 52 countries around the world.

The ASIC business… Read More