For 5G to really deliver on its promise of high bandwidth and good coverage, it needs to use an RF band known as C-Band (3.7 to 4.4 GHz). This band is ideal because its frequency is high enough to offer 100MHz wide channels and also low enough that signal attenuation, especially in urban areas, is minimal. In 2020 the FCC auctioned off… Read More
Exciting times for the semiconductor industry! Last week Intel announced a billion dollar fund to build a foundry ecosystem and today Intel announced they are acquiring foundry Tower Semiconductor for $5.6 billion dollars, WOW! Some people doubted Intel’s commitment to the foundry market this time. I think we can now put that… Read More
Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression. Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More
Automatic adaptive meshing in Ansys HFSS is a critical component of its finite element method (FEM) simulation process. Guided by Maxwell’s Equations, it efficiently refines a mesh to deliver a reliable solution, guaranteed. Engineers around the world count on this technology when designing cutting-edge electronic products.… Read More
Ansys and Keysight wanted to see if they could answer the question, If we put virtual cellphones in different locations in a city, can we predict what kind of 5G signal we’re going to get in those locations? To find out, they created and tested a detailed virtual model of a city, including a variety of 5G antennae, receivers, and transmitters… Read More
The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More
Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory Controller… Read More
System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development. Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More
The nearly unavoidable truth about dynamic voltage drop (DVD) signoff for power distribution networks (PDN) is that the quality of results depends on the quality and quantity of the vectors used to activate the circuit switching. As SOCs grow larger and are implemented on smaller nodes, the challenges of sufficient coverage … Read More
Automatic adaptive meshing in HFSS is a critical component of its advanced simulation process. Guided by Maxwell’s Equations, it efficiently refines the mesh to accurately capture both the geometric and electromagnetic detail of a design. The end result is a process that guarantees accurate and reliable simulation results… Read More
