Sondrel Explains One of the Secrets of Its Success – NoC Design

Sondrel Explains One of the Secrets of Its Success – NoC Design
by Mike Gianfagna on 03-15-2021 at 8:00 am

Seventeen horizontal layers of a complex digital chip design showing the interconnection layouts for each layer

Sondrel is an interesting and unique company. They are a supplier of turnkey services from system to silicon supply. So far, not that unique as there are a lot of companies with this mission. What is unique is their focus on complex designs. The company takes on the design of chips that would need teams of engineers working for a year… Read More


Webinar: Build Your Next HBM2/2E Chip with SiFive

Webinar: Build Your Next HBM2/2E Chip with SiFive
by Mike Gianfagna on 05-04-2020 at 10:00 am

Screen Shot 2020 05 03 at 12.09.58 PM

I have been watching the trend for quite some time now that many advanced FinFET designs today are actually 2.5D systems in package. All of these 2.5D silicon interposer-based designs have high-bandwidth memory (HBM) stacks on board.  Often there are multiple memory stacks in both 4-high and 8-high configurations. If you follow… Read More


Advanced ASICs – It Takes an Ecosystem

Advanced ASICs – It Takes an Ecosystem
by Mike Gianfagna on 11-26-2017 at 2:00 pm

I remember the days of the IDM (integrated device manufacturer). For me, it was RCA, where I worked for 15 years as the company changed from RCA to GE and then ultimately to Harris Semiconductor. It’s a bit of a cliché, but life was simpler then, from a customer point of view at least. RCA did it all. We designed all the IP, did the physical… Read More