At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) exposure systems. I recently got to interview Mike Lercel of ASML to discuss the presentations.
Despite all the attention EUV is getting, most layers are still… Read More
There is a lot of interest right now in how Intel compares to the leading foundries and what the future may hold.
Several years ago, I published several extremely popular articles converting processes from various companies to “Equivalent Nodes” (EN). Nodes were at one time based on actual physical features of processes but had… Read More
Seeking Alpha just published an article about Intel and Samsung passing TSMC for process leadership. The Intel part seems to be a theme with them, they have talked in the past about how Intel does bigger density improvements with each generation than the foundries but forget that the foundries are doing 5 nodes in the time it takes… Read More
Imec is one of the premier semiconductor research organizations and at IEDM they presented dozens of papers. I had the opportunity to see several of the papers presented and interview 3 of Imec’s researchers.
Jan Van Houdt, DMTS ferroelectric and exploratory memory
I have had very interesting discussions with Imec researchers… Read More