GTC 2026: Agentic AI for Semiconductor Design and Manufacturing Janhavi Giri, PhD Principal…Read More
Scaling Multi-Die Connectivity: Automated Routing for High-Speed InterfacesThis article concludes the three-part series examining key…Read More
Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet SummitAt the recent Chiplet Summit, presentations, discussions and…Read More
Captain America: Can Elon Musk Save America's Chip Manufacturing Industry?Intel has posted three consecutive years of falling…Read More
Cadence is a DAC anchor, everyone will visit their booth, so lets look at their technical sessions and put our agendas together. Lets start with the breakfast/lunch sessions because Cadence usually puts out quite a spread, we all gotta eat and free food tastes even better:
Has “Timing Signoff Innovation” Become an Oxymoron? What… Read More
We have seen last week in a first post how crucial was the IP qualification process (TSMC 9000) to increase the probability of successfully Tape Out a chip. Being able to discriminate between dangerous and safe IP is the first step of TSMC 9000 Quality process, IP tagging is the complementary step, almost as essential as the first … Read More
As we know mobile industry is one of the fastest growing in the electronics arena, and it has led to the emergence of several standards of interfaces between processors, devices, storage, camera, keyboard and so on. The interfaces can involve hardware as well as software and can be complex. The standards are still evolving, often… Read More
Carbon Design drives a lot of traffic to SemiWiki. Actually, it’s ARM driving traffic to the Carbon landing page since Carbon and ARM work closely together. When we blog about designing with ARM IP droves of people click over. Seriously, DROVES of people. Rick Lucier has deep EDA experience and has led Carbon as CEO for the … Read More
Methodics is new to SemiWiki and I have to tell you I’m really enjoying working with them. Their office is in a great location and the inovation spirit runs strong. Simon Butler is an interesting guy. He first started in EDA with HLD (acquired by Cadence) and was a founder at Sabio Labs (acquired by Magma). In between those startups… Read More
I love it when my Acura goes months and months without any major repair issue or computer-related glitches. Cars or networks only become reliable when they are designed and built for reliability. Freescale designs SoCs for advanced automotive and networking applications, and their engineers know much about the topics of power,… Read More
I went to some of the JEDEC mobile conference a couple of weeks ago. The opening keynote was by Richard Wietfeld of Qualcomm called The Need for Speed.
He emphasized that smartphones are really setting the pace these days in all things mobile and internet. Over 1/3 of access is on smartphones now. Over 4/5 of searches on smartphones… Read More
Cornelia Golovanovworks at LSI Corp in Pennsylvania and is an EMI expert that provides EDA tool and methodology advise to design groups. She earned a PhD in microelectronics and radioelectricity from the Institut national polytechnique de Grenoble, and joined Lucent out of school 12 years ago. We had a chance to talk by phone about… Read More
Today, Jasper announced their new Jasper-Gold Low Power Verification App. This is focused on verifying low power designs with multiple power domains, voltage islands, power shutoff, clock shutoff, and all the other techniques used for reducing power. Of course power is the main driver of SoC design these days, whether it is for… Read More
I blogged recently about reliability testing with high energy neutron beams. This is good for getting basic reliability data but it is not really a useful tool for worrying about reliability while the chip is still being designed and something can be done about it.
That is where IROC Technologies SOCFIT tool comes in. It takes all… Read More
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