I’ve been digging around the Interwebs a bit trying to find out what the received wisdom is about how big a cost reduction can be expected if and when we transition to 450mm (18″) wafers from today’s standard of 300mm (12″). And the answers are totally all over the place. They vary from about a 30% cost reduction… Read More



A Brief History of RTL Design
RTL is an acronym for Register Transfer Level and refers to a level of hardware design abstraction using Registers and logic gates. Here’s an example schematic showing one DFF as a register, and one inverter as a logic gate.
Figure 1: RTL diagram of a DFF (D Flip Flop) and Inverter… Read More
Variation at 28-nm with Solido and GLOBALFOUNDRIES
At DAC 2012 GLOBALFOUNDRIES and Solido presented a user track poster titled “Understanding and Designing for Variation in GLOBALFOUNDRIES 28-nm Technology” (as was previously announced here). This post describes the work that we presented.
We set out to better understand the effects of variation on design at 28-nm. In particular,… Read More
Will Paul Otellini Convince Tim Cook to Fill Intel’s Fabs?
An empty Fab is a terrible thing to waste, especially when it is leading edge. By the end of the year Intel will, by my back of the envelope calculation, be sitting with the equivalent of one idle 22nm Fab (cost $5B). What would you do if you were Paul Otellini?
Across the valley, in Cupertino, you have Tim Cook, whose modus operandi is … Read More
Hand-crafted for horsepower: Apple A6 SoC
For all the raving and ranting and hand-wringing about the iPhone 5, the centerpiece of the device – the new A6 SoC – is proving to be a marvelous piece of engineering.… Read More
Samsung going vertical Qualcomm cry CEVA laugh
These last days have been full of Apple related stories; maybe it’s time to discuss a new topic? Like for example Samsung, direct competitor for Apple in the smartphone market, and take a look at the company move toward more vertical integration. Everybody working in the SC industry knows that Samsung is ranked #2 behind Intel, even… Read More
A Brief History of Atrenta and RTL Design
We’re plagued by acronyms in this business. Wikipedia defines RTL as follows: “In digital circuit design, register-transfer level (RTL) is a design abstraction which models a synchronous digital circuit in terms of the flow of digital signals (data) between hardware registers, and the logical operations performed on those… Read More
Mentor Graphics Update at TSMC 2012 OIP
What
In just 20 days you can get an update on four Mentor Graphics tools as used in the TSMC Open Innovation Platform (OIP). Many EDA and IP companies will be presenting along with Mentor, so it should be informative for fabless design companies in Silicon Valley doing business with TSMC.
… Read More
iPhone 5: Boost to semiconductor market?
The release of Apple’s iPhone 5 has led to much speculation on its impact on the economy. An analyst at J.P. Morgan estimated the iPhone 5 could add $3.2 billion to U.S. GDP in the fourth quarter, adding ¼ to ½ point to the GDP growth rate.
Analysts’ estimates for total iPhone sales in 4Q 2012 are in the range of 46 million to 50 million units.… Read More
Aldec-Altera DO-254
As described in DO-254, any inability to verify specific requirements by test on the device itself must be justified, and alternative means must be provided. Certification authorities favor verification by test for formal verification credits because of the simple fact that hardware flies not simulation models. Requirements… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot