Whenever people hear that I travel internationally one week a month they cringe at the thought of crowded airports, 12 hour flights, jet lag, and days packed with meetings. I generally shrug, accept the label of travel warrior, and say it is all part of doing business in the semiconductor ecosystem. But in reality, it is not as bad … Read More





Cadence Mixed Signal Technology Summit
Yesterday I attended some of the Cadence mixed-signal technology summit. The day ended with a panel session on Are We Closing the Gap Yet in Mixed-signal Design? Richard Goering moderated. The panelists were all mixed signal experts:
- Nayaz Khan of Maxim
- Nishant Shah of Broadcom
- Shiv Sikand of IC Manage
- Bill Meier of Texas Instruments
Atrenta Wins Gold
What is the most read article on design on EE Times website? Brian Bailey has an article up running through the top 10. It turns out that the #1 article is Understanding Clock Domain Issues by Saurabh Verma and Ashima S. Dabare of Atrenta. It actually had more than double the views of the second place paper. Checking clock domain crossing… Read More
The End of an Era
I drove down from San Francisco, where I live, to Silicon Valley this morning. Something odd was going on. As I approached San Francisco Airport there were a couple of buildings with lots of people standing on the roof. As I got further south, the bridges over the freeway all had lots of people just milling around. It was when I got to … Read More
Displaced but Looking to Add EDA Tools Skills?
In this tough economy you may find yourself displaced and looking for the next opportunity. If you’d like to add some new EDA tool skills, then check out what EMA Design Automation is offering with free Cadence OrCAD training.… Read More
Virtual Prototype your SoC including Arteris FlexNoC and optimize architecture using CPAK from Carbon
I have talked about Virtual Prototyping a SoC including FlexNoC Network on Chip IP from Arteris by using Carbon Design Systems set of tools in a previous post. A blog, posted on Carbon’ web, is clearly explaining the process to follow to optimize a fabric (FlexNoC) successively using the different tools from Carbon. Bill Neifert,… Read More
Over-under: Apple, 52M iPhones in 4Q
I’m in a Twitter conversation with some friends, with the subject: how many phones can Apple ship in the 4th quarter?
A respected analyst said 52M is “an easy mark” for Apple; others are saying 58M is the target for just the iPhone 5 in 4Q. However, the start for the iPhone 5 has been anything but easy. Oh, the orders… Read More
Damn! Cramer Figured It Out
As an investor, one has to always be aware when Jim Cramer informs the world of the investment scenario you have been playing comes out of the shadows and sees the light of day. Soon the herd will follow which is positive, but now one has to figure how long to ride the roller coaster. In an article posted on thestreet.com entitled “Tech… Read More
2nd International Workshop on Resistive RAM at Stanford
A Veritable who’s who of ReRAM researchers will be present at the 2nd International Workshop on Resistive RAM at Stanford in the beginning of October. Sponsored by IMEC and Stanford’s NMRTI (Non-Volatile Technology Research Initiative), the program features two days of talks, panel sessions and no doubt lots of… Read More
Automating Complex Circuit Checking Tasks
By Hend Wagieh, Mentor Graphics
At advanced IC technology nodes, circuit designers are now encountering problems such as reduced voltage supply headroom, increased wiring parasitic resistance (Rp) and capacitance (Cp), more restrictive electromigration (EM) rules, latch-up, and electrostatic discharge (ESD) damage,… Read More
RISC-V Virtualization and the Complexity of MMUs