CEO Interview with Vamshi Kothur, of Tuple TechnologiesIt was my pleasure to meet with Vamshi…Read More
Webinar – Power is the New Performance: Scaling Power & Performance for Next Generation SoCsWhat if you could reduce power and extend…Read More
Reachability in Analog and AMS. Innovation in VerificationCan a combination of learning-based surrogate models plus…Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural PivotIn 2003, legendary computer architect Michael J. Flynn…Read More
My background is IC design engineering, so it’s always a delight to talk with another engineer on their chip challenges. Today I spoke by phone with Sucharita Biswas, a Senior Hardware Engineer at Altera involved in IC test debug for FPGA devices.
April 25, 2013, San Jose, CA
Click here to register.
Come hear Mentor Graphics CEO, Wally Rhines, 2013 Kaufman Award Winner,Chenming Hu, and Xilinx Senior VP,Victor Peng, at the User2User Conference in San Jose.
KEYNOTES
Organizing by Design
9:00am – 9:50am
Walden C. Rhines | CEO & Chairman | Mentor Graphics
Winning products… Read More
I recently spoke to Arvind Narayanan, Product Marketing Manager for Mentor’s place and route division about emerging technology. This of course led to FinFETS, FDSOI, performance, power, and cost-benefit. The battle between FDSOI and FinFETs, said Narayanan, is going to be something to watch.
Both FDSOI and FinFET technologies… Read More
Hierarchical IC design has been around since the dawn of electronics, and every SoC design today will use hierarchy for both the physical and logical descriptions. During the physical implementation of an SoC you will likely run into EDA tool limits that require a re-structure of the hierarchy. This re-partitioning will cause… Read More
UBM’s EETimes and EDN today announced Kathryn Kranen as the lifetime achievement award winner for this years ACE awards program. Kathryn, of course, is the CEO of Jasper (and is also currently the chairman of EDAC). Past winners exemplify the prestige and significance of the award. Since 2005 the award was given to Gordon… Read More
I blogged last month about single event effects (SEE) where a semiconductor chip behaves incorrectly due to being hit by an ion or a neutron. Since we live on a radioactive planet and are bombarded by cosmic rays from space, this is a real problem, and it is getting worse at each process node. But just how big of a problem is it?
TFIT is … Read More
If you ask to IP vendors selling functions, PHY or Controller, supporting Interface based protocols which part is the master piece, the controller IP only vendors will answer: certainly my digital block, look how complex it has to be to support the transport and logical part of the protocol! Just think about the PCI Express gen-3… Read More
This year’s recipient of the Kaufman Award is Dr Chenming Hu. I can’t think of a more deserving recipient. He is the father of the FinFET transistor which is clearly the most revolutionary thing to come along in semiconductor for a long time. Of course he wasn’t working alone but he was the leader of the team at UC… Read More
Given the compressed time between 20nm and 16nm, twelve months versus the industry average twenty four months, it is time to start talking about 10nm, absolutely. Next Tuesday is the 19th annual TSMC Technology Symposium keynoted of course by the Chairman, Dr. Morris Chang.
Join the 2013 TSMC Technology Symposium. Get the latest… Read More
The burgeoning need of high density of electronic content on a single chip, thereby necessitating critical PPA (Power, Performance, Area) optimization, has pushed the technology node below 0.1 micron where static power becomes equally relevant as dynamic power. Moreover, multiple power rails run through the circuit at different… Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot