In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More
LLM-assisted schematic test-report analysis and root-cause investigationBy Piyush Bag Intro: In this AI era,…Read More
From Frontend to the Frontiers of Silicon with Moores Lab AIAlex Navarro is a Principal Software Engineer at…Read More
Synopsys Announces AgentEngineer Solutions and Autopilot Platform for Autonomous EngineeringSynopsys today announced its AgentEngineerTM solutions portfolio and…Read More
PDF Solutions CONNECT, the Premier Event for Semiconductor Analytics and AI, October 15 and 16 in San FranciscoOn October 15 and 16, 2026, in San…Read MoreSofics’ ESD Innovations Power AI and Radiation-Hardened Breakthroughs on TSMC Platforms
In the fast-evolving semiconductor landscape, electrostatic discharge (ESD) protection is pivotal for ensuring chip reliability amid shrinking nodes and extreme applications. Sofics, a Belgian IP provider specializing in ESD solutions for ICs, has cemented its leadership through strategic collaborations showcased … Read More
MIN PULSE WIDTH (MPW) TIMING CHECK The Silent Timing Trap Lurking in Every Sub-5nm Design
By Zameer Mohammed
This article claims to provide clear key insights of Min Pulse Width (MPW) timing signoff check, proactive closure strategies for faster time-to-market, and effective methods to prevent silicon failures.
Min Pulse Width (MPW) check for timing signoff has become an important design constraint at the sub-5nm… Read More
CEO Interview with Gary Spittle of Sonical
British-born, California-based entrepreneur, Gary Spittle, is the founder of Sonical – a disruptive, forward-thinking audio brand that is currently on the cusp of delivering something quite remarkable: think immersive, wireless, and completely lossless.
Gary holds a PhD. He investigated the use of binaural audio for improving… Read More
Podcast EP309: The State of RISC-V and the Upcoming RISC-V Summit with Andrea Gallo
Daniel is joined by Andrea Gallo, CEO of RISC-V International. Before joining RISC-V he worked in leadership roles at Linaro for over a decade and before Linaro he was a fellow at STMicroelectronics.
Dan explores the current state of the RISC-V movement with Andrea, who describes the focus and history of this evolving standard.… Read More
Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration
In a move that underscores the semiconductor industry’s push toward resilient supply chains and agile innovation, Thalia Design Automation and X-FAB Silicon Foundries have announced a strategic partnership aimed at safeguarding supply continuity and accelerating intellectual property (IP) migration. This collaboration,… Read More
Scaling Debug Wisdom with Bronco AI
In the business press today I still find a preference for reporting proof-of-concept accomplishments for AI applications: passing a bar exam with a top grade, finding cancerous tissue in X-rays more accurately than junior radiologists, and so on. Back in the day we knew that a proof-of-concept, however appealing, had to be followed… Read More
CEO Interview with David Zhi LuoZhang of Bronco AI
David Zhi LuoZhang is Co-Founder and CEO of Bronco AI with extensive experience in building AI systems for mission-critical high-stakes applications. Previously while at Shield AI, he helped train AI pilots that could beat top human F-15 and F-16 fighter pilots in aerial combat. There, he created techniques to improve ML interpretability… Read More
Thermal Sensing Headache Finally Over for 2nm and Beyond
By Nir Sever, Senior Director Business Development, proteanTecs
Silicon-proven LVTS for 2nm: a new era of accuracy and integration in thermal monitoring
Effective thermal management is crucial to prevent overheating and optimize performance in modern SoCs. Inadequate temperature control due to inaccurate thermal sensing… Read More
Synopsys and TSMC Unite to Power the Future of AI and Multi-Die Innovation
In a rapidly evolving semiconductor landscape, where AI demands unprecedented computational power and efficiency, Synopsys has deepened its partnership with TSMC to pioneer advancements in AI-driven designs and multi-die systems. Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages … Read More



Why ASML Is Racing to Build 110 EUV Machines