Security Coverage: Assuring Comprehensive Security in Hardware DesignAs hardware systems become increasingly complex and security…Read More
Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC3D IC was a very popular topic at…Read More
Analysis and Exploration of Parasitic EffectsWith advanced semiconductor processes continuing to shrink, the…Read More
Siemens Proposes Unified Static and Formal Verification with AIGiven my SpyGlass background I always keep an…Read More
Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 RoadmapAlchip Technologies, a global leader in high-performance computing…Read More
The number one semiconductor IP company in the world is ARM, and they have really figured out how to use social media in a big way to communicate with and listen to their customers. When you first visit the Home page for ARM there are four social media icons displayed in monochrome underneath the menu bar. As you hover over the icons (Twitter,… Read More
The reader will find many updates in the “Interface IP Survey” from IPNEST, released in October 2013. Good question, as the IP market is a very fast moving one and the protocol based Interface IP, is moving even faster… exhibiting 20% growth rate in 2012, expected to grow with 10% CAGR between 2012 and 2017 to reach $700M. … Read More
There is always a lot of posturing and pontificating when semiconductor executives talk about the future of process development. They are fighting an air war of perception and investor expectations, so naturally want to make sure they have plenty to brag about. But, as we pointed out recently with Intel’s problems at 14nm, moving… Read More
Save closure time and boost performance by incorporating knowledge of physically aware design early into your front-end design implementation flow
With the adoption of advanced process nodes, design closure is becoming increasingly difficult due to the lack of convergence between the front end and the back end of the register-transfer… Read More
The Intel analyst meeting last week reads like an absolute train wreck with INTC stock dropping 5%+ the very next day. Since I work in the fabless semiconductor ecosystem during the day I was not able to listen to it live like the other pundits. Nor am I as easily fooled by Power Point slides. I did however review the materials and would… Read More
When you see a new product announcement from an EDA company, it is always put in terms that make it seem as if the engineer is sitting at his or her desktop with a big server and is running the new tool to wondrous effect. But the reality in the real world is that most companies have a computing infrastructure of server farms, often several… Read More
Yesterday Cadence had an all-day Signoff Summit where they talked about the tools that they have for signoff in advanced nodes. Well, of course, those tools work just fine in non-advanced nodes too, but at 20nm and 16nm there are FinFETs, double patterning, timing impacts from dummy metal fill, a gazillion corners to be analyzed… Read More
The first time that I saw a DRAM in a ceramic package running on a tester I made the mistake of touching my finger to the metal lid, scorching my finger and teaching me a lesson that ICs can run extremely hot. I’ve read a lot the past few years about 3D IC design, and immediately my mind becomes curious about how an engineer would go… Read More
There has been a lot of huffing and puffing lately about 64-bit cores making it into the Apple A7 and other mobile SoCs, and we could probably dedicate a post to that discussion. However, there are a couple other wrinkles to the Apple A7 that should be getting a lot more attention.
There are two primary causes of user frustration in multimedia… Read More
QCOM is now sampling the TSMC 20nm version of its market dominating Gobi LTE modem. The announcement also included a new turbo charged version of their 28nm Snapdragon 800 SoC with a Krait 450 quad core CPU and Adrino 420 GPU. Given the comparable benchmarks between the Intel 22nm SoC and the 28nm SoCs from Apple and QCOM, the new 20nm… Read More
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cHBM for AI: Capabilities, Challenges, and Opportunities