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Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC

Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC
by Mike Gianfagna on 07-24-2025 at 6:00 am

Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC

3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here.  There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More


Analysis and Exploration of Parasitic Effects

Analysis and Exploration of Parasitic Effects
by Daniel Payne on 07-23-2025 at 10:00 am

parasitc elements min

With advanced semiconductor processes continuing to shrink, the number and complexity of parasitic elements in designs grows exponentially contributing to one of the most significant bottlenecks in the design flow. Undetected parasitic-induced issues can be extremely costly, often resulting in tape-out delays.

Silvaco… Read More


Siemens Proposes Unified Static and Formal Verification with AI

Siemens Proposes Unified Static and Formal Verification with AI
by Bernard Murphy on 07-23-2025 at 6:00 am

Siemens Proposes Unified Static and Formal Verification with AI min

Given my SpyGlass background I always keep an eye out for new ideas that might be emerging in static and formal verification. Whatever can be covered through stimulus-free analysis reduces time that needn’t be wasted in dynamic analysis, also adding certainty to coverage across that range. Still, advances don’t come easily. … Read More


Edge Roughness Differences Among EUV Resists

Edge Roughness Differences Among EUV Resists
by Fred Chen on 07-23-2025 at 6:00 am

Edge Roughness Differences Among EUV Resists

EUV resists are a key component in the implementation and optimization of EUV lithography. By converting a limited number of absorbed EUV photons into a variable number of released migrating electrons, the resist becomes the final determinant of resolution. There are two kinds of resist which are seriously considered: chemically… Read More


Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
by Admin on 07-22-2025 at 10:00 am

Figure 1

By Tetsu Ho

With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More


Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 Roadmap

Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 Roadmap
by Daniel Nenni on 07-22-2025 at 6:10 am

Alchip TSMC N2 announcement SemiWiki

Alchip Technologies, a global leader in high-performance computing (HPC) and AI infrastructure ASICs, has officially launched its 2nm Design Platform, marking a major advancement in custom silicon design. The company has already received its first 2nm wafers and is collaborating with customers on the development of high-performance… Read More


Agile Analog Update at #62DAC

Agile Analog Update at #62DAC
by Daniel Payne on 07-21-2025 at 10:00 am

agile analog min

On the last day of DAC 2025 I met with Chris Morrison, VP of Product Marketing at Agile Analog, to get an update. Their company provides Analog IP, the way you want it, and I knew that they had internal tools and a novel methodology to speed up the development process. This year they have started talking more about their internal IP automation… Read More


Protecting Sensitive Analog and RF Signals with Net Shielding

Protecting Sensitive Analog and RF Signals with Net Shielding
by Admin on 07-21-2025 at 6:00 am

fig1 net shielding 72dpi

By Hossam Sarhan

Communication has become the backbone of our modern world, driving the rapid growth of the integrated circuit (IC) industry, particularly in communication and automotive applications. These applications have increased the demand for high-performance analog and radio frequency (RF) designs.

However, designing… Read More


Executive Interview with Matthew Addley

Executive Interview with Matthew Addley
by Daniel Nenni on 07-20-2025 at 10:00 am

Matthew Addley SemiWiki Interview

Matthew Addley is an Industry Strategist at Infor, specializing in the global manufacturing sector. With over 30 years of experience in driving business transformation through technology, he aligns industry needs with Infor’s product strategy through thought leadership, customer engagement, and market insight. Beginning… Read More


CEO Interview with Jonathan Reeves of CSignum

CEO Interview with Jonathan Reeves of CSignum
by Daniel Nenni on 07-20-2025 at 8:00 am

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For more than 30 years, Jonathan has successfully led many start-up ventures, including multiple acquisitions as well as senior operating roles in networking, cloud computing, cybersecurity, and AI businesses.

He co-founded Arvizio, a provider of enterprise AR solutions, was Chairman and co-founder of CloudLink Technologies,… Read More