I last wrote about Secure IC back in 2023, a provider of embedded security technologies and services. Cadence announced at the beginning of 2025 their intention to acquire this company, which warrants a check-in again on what they have to offer. Secure-IC addresses multiple markets, from automotive, through defense/space and… Read More
IPLM: Future Forward Webinar May 19thStep into the future of semiconductor design management…Read More
From Point Solutions to Agentic AI Ecosystems: Semiconductor Process Control Depends on Its PastAgentic AI is often presented as a revolutionary…Read More
Panel Discission: Beyond Moore's Law and the Future of Semiconductor ManufacturingThe semiconductor industry is entering a post-Moore’s Law…Read More
CEO Interview with Dave Kelf, CEO of Breker Verification SystemsIn the functional verification space, Breker Verification Systems stands…Read More
RISC-V: From Niche Architecture to Strategic FoundationAt the recent RISC-V Now by Andes conference,…Read MoreThe Journey of Interface Protocols: The Evolution of Interface Protocols – Part 1 of 2
Prolog – Interface Protocols: Achilles’ Heels in Today’s State-of-the-art SOCs
June 30 was only a week away when Varun had a sleepless night. The call from the datacenter manager the evening before alerted him on a potential problem with the training of a new Generative AI model. Six months earlier Varun’s employer installed… Read More
Leveraging Common Weakness Enumeration (CWEs) for Enhanced RISC-V CPU Security
As RISC-V adoption accelerates across the semiconductor industry, so do the concerns about hardware security vulnerabilities that arise from its open and highly customizable nature. From hardware to firmware and operating systems, every layer of a system-on-chip (SoC) design must be scrutinized for security risks. Unlike… Read More
Metal fill extraction: Breaking the speed-accuracy tradeoff
By Shehab Ashraf
As semiconductor technology scales and device complexity increases, accurately modeling the parasitic effects of metal fill has become critical for circuit performance, power integrity, and reliability. Metal fill is a crucial part of the manufacturing process, ensuring uniform layer density, improving… Read More
How Arteris is Revolutionizing SoC Design with Smart NoC IP
Recently, Design & Reuse held its IP-SoC Days event at the Hyatt Regency in Santa Clara. Advanced IP drives a lot of the innovation we are seeing in chip design. This event provides a venue for IP providers to highlight the latest products and services and share a vision of the future. IP consumers are anxious to hear about all the… Read More
CEO Interview with Ido Bukspan of Pliops
Prior to becoming CEO of Pliops in 2023, Ido Bukspan was the senior vice president of the Chip Design Group at NVIDIA and one of the leaders at Mellanox before it was acquired by NVIDIA for nearly $7 billion.
Tell us about your company.
Pliops accelerates and amplifies the performance and scalability of global GenAI infrastructure,… Read More
CEO Interview with Roger Cummings of PEAK:AIO
Roger Cummings is the CEO of PEAK:AIO, a company at the forefront of enabling enterprise organizations to scale, govern, and secure their AI and HPC applications. Under Roger’s leadership, PEAK:AIO has increased its traction and market presence in delivering cutting-edge software-defined data solutions that transform commodity… Read More
Video EP4: A Deeper Look at Advanced Packaging & Multi-Die Design Challenges with Anna Fontanelli
In this episode of the Semiconductor Insiders video series, Dan is once again joined by Anna Fontanelli, founder and CEO of MZ Technologies. In this discussion, more details of the challenges presented by advanced packaging and multi-die design are explored. Anna provides details of what’s involved in architectural … Read More
Analog Bits Steals the Show with Working IP on TSMC 3nm and 2nm and a New Design Strategy
The TSMC Technology Symposium recently kicked off in Santa Clara, with a series of events scheduled around the world. This event showcases the latest TSMC technology. It is also an opportunity for TSMC’s vast ecosystem to demonstrate commercial application on TSMC’s technology. There is a lot to unpack at an event like this. There… Read More
Podcast EP286: The Significant Impact of Ambient Scientific Technology on AI Deployment with GP Singh
Dan is joined by GP Singh, CEO of Ambient Scientific. With over 20 years of experience, GP has played a pivotal role in shaping the industry, driving 50+ chip tapeouts, including game-changing advancements at FinFET technology nodes. Now, as the CEO of Ambient Scientific, GP brings together hands-on engineering expertise and… Read More


The Semiconductor Growth Numbers are Insane but the Real World Doesn’t Tally!